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Haopeng Liu

Haopeng Liu has nearly 20 years of experience in IP product development and management, who has accumulated rich technical experience from IP products to systems. Besides, he has mastered the latest technology and application trends in the IP industry and ecosystem. Mr. Liu, served as IP Technical Support Manager and Senior Solutions Manager in Synopsys China, joined Synopsys China as the first IP engineer in 2007. He is always committed to developing and supporting many local design and manufacturing enterprises. He also won many honors such as Synopsys Global Outstanding Employees. He once served in Hisilicon, mainly responsible for IP design and implementation.

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AkroStar Technology Co., Ltd.

AkroStar was founded in June 2020 and is a leading Chinese enterprise specializing in advanced interface IP. We are committed to the research and development of domestically produced advanced interface IP and breaking through “bottleneck” technologies. AkroStar offers comprehensive high-speed interface IP solutions, including PCIe, Serdes, DDR, D2D, USB, MIPI, HDMI, SATA, SD/eMMC, etc., covering a full-stack complete IP solution compliant with the latest protocol standards.

Company website:https://www.akrostar-tech.com/

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Jianmin Li

Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Dr. Hongchao Liu

Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.

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Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.

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Dr. Stefan Pieper

Stefan Pieper has studied chemistry in Berlin, Germany where he also completed his PH.D. in analytical chemistry. In 2009 he joined Atotech as Application Scientist in the department of Semiconductor Advanced Packaging processes where he used the opportunity to gain deep insight in multiple electrochemical metallization processes and their characterization for semiconductor application. During his work as Application Scientist, he also spent over 3 years in the US where he optimized Cu dual damascene electrodeposition and Through Silicon Via plating. In 2020 he took over the position of Global Application Manager for Electroless deposition processes in semiconductor application at Atotech. In his current position he is leading a team that provides wet-chemical solutions for semiconductor metallization with the focus on power semiconductor.

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mks Atotech

Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com

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Dr. KK Kuo

Dr. KK Kuo is Vice President of ATX Group R&D Center, responsible for development of new technology, introduction of high technology. Dr. Kuo has over 22 years’ experience in semiconductor industry, good at new product development of RF modules, sensors, high reliability and intelligent automotive electronics, IoT IC and smart mobile communications. He holds more than 50 Chinese patents, dozens of U.S. and Taiwanese patents, and published many academic papers. Dr. Kuo is a member of IEEE Electronic Packaging Society, selected as “Science and Technology Entrepreneur of Jiangsu Province” in 2018. He graduated from Taiwan Sun Yat-Sen University with PhD in electrical engineering.

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ATX Semiconductor (Suzhou) Co., Ltd.

ATX Group, a worldwide well-known company to provide service of IC assembly and test, offering a full range of turnkey services that include package design, front-end engineering test, wafer test, package assembly and final test. Besides, ATX Group maintains a highly experienced and skilled engineering team dedicated to the research and development of the latest assembly technologies. ATX also invests the latest equipments and state-of-art facilities, making us a true extension of our customers’ manufacturing operations. Has a professional laboratory, with most advanced equipments and rich experience in semiconductor assembly and test, to provide customers with comprehensive solutions.

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Ralf Bornefeld

Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.

Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.

Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.

Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.

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Bosch Sensortec

Bosch Sensortec GmbH, a fully owned subsidiary of Robert Bosch GmbH, develops and markets a wide portfolio of microelectromechanical systems (MEMS) sensors and solutions tailored for smartphones, tablets, wearables and hearables, AR/VR devices, drones, robots, smart home and IoT (Internet of Things) applications. The product portfolio includes 3-axis accelerometers, gyroscopes and magnetometers, integrated 6- and 9-axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems, acoustic microsystems and comprehensive software. Since its foundation in 2005, Bosch Sensortec has emerged as the MEMS technology leader in the markets it addresses. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995 and has, to date, sold more than 15 billion MEMS sensors.

The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). According to preliminary figures, the company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.

As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. Bosch employs some 76,100 associates in research and development, as well as roughly 38,000 software engineers.

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Laurent Giai-Miniet

Laurent is the CEO of ERS electronic GmbH, and oversees the Sales, Marketing, Applications and Business Development team. He has more than 25 years of experience in the semiconductor industry and has held leadership positions in renowned companies such as Texas Instruments and Infineon, as well as in high-tech start-ups. Laurent has an MBA from the Institut d’Administration des Entreprises of Aix-en-Provence (France).

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ERS Electronic GmbH

ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales and support offices worldwide.

Phone: +49 898941320
Email: info@ers-gmbh.de
Website: www.ers-gmbh.com

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Cheng-Tyng Yen

Founder & CEO of Fast SiC Semiconductor. fastSiC is a fabless company dedicated on SiC power devices. Fast SiC Semiconductor has mass produced 650V~1700V SiC MOSFETs with its own proprietary designs, which have been adopted by leading customers in the field of server power supplies, charging piles and PV inverters. He has more than 10 years experiences on the design, process, qualification and application of SiC power devices. He currently serves as the TPC member of ISPSD and has published and filed more than 150 papers and patents.

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Fast SiC Semiconductor Inc.

Fast SiC Semiconductor is a SiC power devices supplier. We supply high performance 650V~1700V SiC MOSFETs and Schottky Barrier Diodes discrete devices and bare chips with our own proprietary designs, for leading customers in applications including PV inverters, EV charging piles, energy storage system, BMS, ATE, motor drive, SMPS for datacenter, OBC and DC/DC for EV, as well as manufacturers of industrial and EV power modules.

General Telephone: +886-3-6590579
General Email: info@fastsic.com
Website: https://fastsic.com

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Yupeng Xu

Xu YuPeng, CTO of FOREHOPE electronic(NINGBO) Co.LTD since June of 2018. 21 years experience in semiconductor assembly house. Before FHEC, Mr Xu has 7 years experience work as VP of ICBU in JCET (2011~2018). and 7 years RND engineer/Manager in Statschippac shanghai(2004~2011). 2 years process engineer in ASE shanghai(2002~2003). Mr Xu experienced with all kinds of IC package assembly process & technology ,especially in SiP integration, Automotive IC , wafer level package development etc.

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Forehope Electronic (Ningbo) Co., Ltd.

Forehope(FHEC) was founded in Nov 2017, devoted to a worldwide and industry-leading high-end IC ,package assembly and testing . The end customer application covered consumer electronics,AI, industry, Automotive, Network,Data center etc. We can deliver package type include WBQFN, WBLGA, WBBGA, FCCSP, Hybrid-BGA, SiP, MEMS.,QFP, FCBGA etc. And also we can provide wafer level package include Bumping, WLCSP. Forehope continue to research & develop advanced wafer level package like as Fan-out, 2.5D/3D , which for chiplet solutions.

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Jiemin Cao

Graduated from Shandong University in 2003

2003~2004 engaged in process development of Ningbo SMIC(Riying&IMP)

From 2004 to today , I worked in Silan Microelectronics, respectively engaged in chip testing, FA&RA ,quality director, Power module product &assembly development .

Now is VP of Silan, in charge of: power module product &package development, IGBT/SIC chip platform management, product quality engineering, RA&FA, etc.

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Hangzhou Silan Microelectronics Co., Ltd.
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Dr. Rainer Kaesmaier

Since 2018 Dr. Rainer Kaesmaier is Managing Director for the Global Product Group Semiconductors of Hitachi Energy, leading the semiconductor business with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes for market segments such as energy transmission & distribution, transportation & rail, renewable, industry and e-mobility. He is a semiconductor industry veteran having held various management and executive positions in the sector for more than 25 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he assumed the responsibility for the global semiconductor business of Hitachi Energy. In addition to that, Rainer is since 2019 also member of the management board for Hitachi Energy Switzerland Ltd.

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Hitachi Energy Ltd.

We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.

Hitachi Energy Switzerland Ltd.
Semiconductors
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland

Phone: +41 58 586 14 19
Fax: +41 58 586 13 06
Email: salesdesksem@hitachienergy.com
www.hitachienergy.com/semiconductors

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Dr. Hongliang Shi

Dr. Shi Hongliang, Director of SiC Application of Hunan SANAN, is responsible for customer requirement introduction, system level application solutions, technical support and new product definition. He has 10+ years of R&D experience in system application design of SiC power devices, optimized design of high frequency high power magnetic devices, etc. He holds a PhD degree in Electrical Engineering from Tsinghua University.

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Hunan Sanan Semiconductor Co., Ltd.
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Mark Nils Münzer

Mark Muenzer received the Dipl.-lng. degree in electrical engineering from the RWTH Aachen, Germany, in 1997. As a development engineer for industrial power modules at Eupec GmbH he established industry leading power modules. In 2005 Mark transferred to Infineon Headquarter in Munich where he build up Infineon’s ElectricDriveTrain business. He initiated new product families for automotive power modules and related driver ICs. As a senior director Mark Muenzer was from 2012 until 2018 responsible for the newly found business segment EDT-Electric Drive Train. 2018 Mark Muenzer took over a position as Vice President for Innovation & Emerging Technologies in the Automotive High Power business line of Infineon. In September 2022 Mark was promoted to Distinguished Engineer.

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Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Prof. Qinfen Hao

Dr. Qinfen Hao, graduated from the Institute of Computing Technology, Chinese Academy of Sciences (ICT) in 2001 with a Ph.D. in System Architecture. He is currently the director of the Interconnect Technology Laboratory of ICT, a professor at the University of Chinese Academy of Sciences, the secretary-general of the China Computer Interconnect Technology Alliance (CCITA) and the director of the Wuxi Institute of Integrated Circuit Interconnect Technology.

He has successively engaged in the design and research of high-performance computer, high-end SMP server, several important chips in computer such as cache coherence interconnect chip, CPU, etc. He has won the second prize of the Chinese National Science and Technology Progress Award twice, in charge of over three national scientific research projects, served as the chief scientist of the Ministry of Science and Technology’s key research and development program. He published more than 40 scientific papers and applied for more than 30 patents until now.

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Institute of Computing Technology, Chinese Academy of Science
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Dr. Fengze Hou

Fengze Hou is an IEEE senior member. He received his Ph.D. from the Delft University of Technology, Delft, The Netherlands, in 2020. In 2012, he joined the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), in Beijing, China. From 2013 to 2021, he was a senior engineer at the National Center for Advanced Packaging (NCAP), Wuxi, China. Dr Hou is an associate professor at the IMECAS. He has authored or coauthored over 60 articles in journals and international conferences and holds more than 20 patents. He first proposed the PCB-embedded SiC MOSFET packaging technology in the world. His interests cover chiplet and heterogeneous integration, advanced packaging, chip power delivery, thermal management, and thermo-mechanical reliability.

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Institute of Microelectronics of the Chinese Academy of Sciences

The Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS) was established in 1958 as the CAS No. 109 Semiconductor Factory under the former CAS Institute of Applied Physics. Its original goal was to meet the nation’s strategic need to develop a high-frequency transistor computer. After numerous changes and mergers, it assumed its current name in 2003.
The IME is the only comprehensive scientific research institution in China, capable of carrying out full-chain research and development from microelectronic principal devices, integration processes, high-end chips, advanced packaging, and manufacturing equipment to applications.
IME comprises a national key laboratory, two CAS key laboratories, 11 research departments, and three technology research centers, covering all the main research areas of microelectronics. IME has a Ph.D. program in electronics and information; two master’s degree programs in IC engineering, and electronic and communication engineering, respectively; and a postdoctoral program in microelectronics.
IME has established long-term cooperative relationships with many national research institutions, universities, and companies in such countries as the United States, the United Kingdom, Germany, Japan, and Singapore, etc. A large number of delegations visit the institute every year, giving lectures, conducting academic exchange, and undertaking cooperative research projects.

Company website: www.ime.ac.cn

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Dr. Yang Cheng

Dr. Yang has 20 years’ of experience in electronics system and IC packaging development. At present he is senior director of advanced packaging and SiP design at JCET. Before joining JCET, he was at Flex on SiP products and technology development in IoT, automotive, medical, and industrial applications, covering design, manufacturing, and testing areas. He has worked at Intel on memory packaging design and technology development for 13 years. Dr. Yang hold a Ph.D. degree from National University of Singapore, EMBA from Washington University in St. Louis, and Master and Bachelor from Shanghai Jiaotong University.

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JCET Group Co., Ltd.

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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Simon Zhang

VP of JSSI with 20+ years R&D and PM experience in advanced package area, full global OSAT operation experience. He holds more than 25+ patents in 2.5D PKG area and worked in global enterprise like SPIL, TI.

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Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.

JSSI, registered in Sep’2020 in Nanjing,Jiangsu Province, P.R.C, and factory located in the same industry park with TSMC-12inch Nanjing Plant. JSSI business focus on Semiconductor Assembly & Test service including Bumping/WLCSP/eWLB/WB-FCQFN/LGA/BGA/2.5D package solution. JSSI core management and R & D team worked in advanced package area more than 20 years, and company committed to provide first-class technology services for customers; JSSI factory has 1700+ employees and obtained ISO9001, QC080000, ISO14001, ISO27001,TS16949 and other system certifications. JSSI R&D team worked with several key GPU/CPU design house to focus on the 2.5D PKG design and test vehicle sample manufacturing now.

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MoChen Tian

In 2021, he founded Kiwimoore and assumed the role of CEO. Kiwimoore is among the world’s pioneering companies, focusing on universal interconnect chiplets and system-level solutions. These are built on next-gen computing architecture and offer leading high-performance general-purpose chiplets and solutions. Their aim to enable high-computing power chips to achieve a significant leap in performance.

Former Global Vice President of NXP Semiconductors, he was accountable for marketing and team management in Greater China, encompassing Smart ID, MCU, Mobile, IoT, and other product lines.

He successfully spearheaded the product line definition in China, overseeing the entire process from market demand assessment to specification definition and product realization. This effort resulted in cumulative product lifecycle sales of $5 billion.

Previously, he served as the Head of Marketing Asia Pacific in the Chipcard & Security Division at Infineon Technologies.

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Kiwimoore

Founded in early 2021, Kiwimmore is among the world’s pioneering companies, offering “universal interconnect chiplets and system-level solutions” based on the Chiplet architecture,our primary product lineup comprises two types of products: High-speed interconnect IO Die
and High-performance interconnect Base Die. Additionally, we provide a series of Die2Die IPs, Chiplet software design platforms, and other hardware and software products.

We target the AIGC-driven high-performance computing markets, such as data centers, autonomous driving, personal computing platforms, and more. Our company is dedicated to delivering chiplet system-level solutions with the interconnect chiplets. These solutions are designed to assist our customers in expediting the development of intricate, high-computing-power chips in a more efficient manner.

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