Zhang Taizhi
Senior Engineer
No summit linked
2016–2020: Led power-hardware development for motor controllers, including power-module selection, chip junction-temperature estimation, discrete-pack development, and gate-driver and power-supply design; served as Senior Hardware Engineer in INOVANCE automotive.
2021–Present: Direct the development of automotive-grade power modules. Act as Technical Lead for Module Development in INOVANCE automotive.
Company Profile
Shenzhen Inovance Technology Co., Ltd. (stock code: SZ.300124) was founded in 2003 and has a market capitalization of about RMB 160Bn. Inovance is the key force in developing industrial automation and drive technologies in China, providing optical-mechatronics-hydraulic-pneumatic integrated solutions covering drive, control, motor, and precision machinery.
Headquartered in Shenzhen, Inovance has more than 20,000 employees and has established multiple production bases in Suzhou, Yueyang, Nanjing, Shanghai, Jinan, Jiaxing, Changchun, and Hungary, as well as having resident offices and service centers in over 30 countries and regions worldwide.
Carsten Mohr
General Manager
No summit linked
Carsten is Executive Vice President of the Metal Foils division at SCHLENK and supports CuNex in the same position. He is a mechanical engineer by training and has an extensive track record in the silver paste and copper fabricating industry.
Company Profile
CuNex offers copper sinter pastes and preforms for high-power electronics packaging (die attach, substrate attach, die topside attach). Our copper-based interconnect materials follow a low pressure and rapid sintering approach ensuring improved reliability and performance at a substantial cost advantage over silver sintering.
After 7 years of extensive research, CuNex launched the Cuprum series of sinter pastes and CuForm sinter preforms. The copper pastes and preforms are suitable for Si, SiC and GaN devices as well as high power LEDs.
Specialized engineering solutions also allow for sinter lamination of substrates and die attach supporting embedded chip technologies.
The product development and volume manufacturing are driven by SCHLENK with a history of 150 years in copper and copper alloys.
The Cuprum pastes and CuForm preforms have class leading features:
– Low cost
– Fast drying in air
– Low sintering temperature and pressure
– Rapid sintering process
– High thermal conductivity
– Flexibility on die size and standard metallizations
– No nanoparticles
– Storage at room temperature for up to 6 months
Leon(Yenan) Wu, Ph.D.
Founding Partner & CEO
No summit linked
- Master’s degree from Xi’an Jiaotong University
- PhD from the School of Integrated Circuits, Tsinghua University
- With a background in Electronic Engineering, he has served as a member of the investment committee for integrated circuit and related industry funds under well-known large central enterprises such as Yizhuang Holding Co., Ltd., achieving remarkable investment performance
Company Profile
Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.
西安龙鼎投资管理有限公司（简称“龙鼎投资”）成立于2014年，是一家以国家发展需求为核心导向，以“金融”+“产业”为核心引擎，专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。
Wei Wenyuan
C-ASAM Secretary General
No summit linked
Company Profile
Marcus Kneifel, Ph.D.
Sr. Vice President, Systems Engineering
No summit linked
Dr. Marcus Kneifel currently serves as senior vice president of systems engineering, responsible for delivering cutting-edge systems and executing best-in-class engineering practices to expand and support the automotive, industrial, AI and new emerging technologies in adjacent growth markets.Dr. Kneifel is a seasoned leader with deep industry knowledge and a proven track record, bringing valuable expertise into key target markets for the company.Before joining onsemi, Marcus was the Chief Technology Officer and Board Member at Preh Group, and the General Manager of Portfolio Management 800V BEV Power Electronics, Electrified Powertrain Technology at ZF Friedrichshafen. Prior to that, he spent more than 20 years at Robert Bosch, moving through the ranks to ultimately be the General Manager of Engineering Customer Projects, Driver Assistance Systems.He holds a master’s degree in electrical engineering from both the University of Applied Sciences Braunschweig and the University of Bremen, as well as a PhD. in Power Electronics from the University of Bremen.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Liu Yongshun
Senior Chief Engineer of Chips
No summit linked
Company Profile
Cynthia Zhang
Founder
No summit linked
Cynthia Zhang is the founder of FutureX Capital, a boutique all-stage fund focused on global high-tech and AI companies. Some of her notable portfolio includes Bytedance (TikTok), NIO (NYSE: NIO), Meituan (3690.HK), Xiaomi (1810.HK), and Kingsoft Cloud (NASDAQ: KC). She has been consistently recognized as one of the Top 50 Female Investors and Top Technology GP in China.
Prior to founding FutureX, Cynthia was the founder of the Private Equity Division at China Asset Management Company, one of the largest asset management firms in Asia.
Cynthia holds a bachelor’s degree in Computer Science from the National University of Singapore, an EMBA from Tsinghua University’s PBC School of Finance, and is an alumna of the Stanford Executive Program at Stanford Graduate School of Business.
Company Profile
FutureX Capital invests in visionary founders building transformative AI technologies across all stages. With $3B+ accumulated investment and deep roots in the US and China tech ecosystems, we’re positioned at the forefront of the next wave of innovation.
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
No summit linked
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
Jun Li
General Manager (FAE Head Quarter), Shanghai
No summit linked
JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.
Company Profile
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
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