Allan Zhou, Ph.D.

Senior Advisor

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Allan Zhou holds a Ph.D. in Chemistry and Materials Science from the University of Connecticut, USA.
He has served as CEO of Shanghai GTA Semiconductor Co., Ltd., Professor at Fudan University, Distinguished Professor and Adjunct Dean of the School of Excellence in Engineering at Shanghai Dian Ji University, Senior R&D Scientist at Applied Materials Inc. (USA), as well as Senior R&D Manager, Fab Director of Large-Scale Manufacturing, and Senior Director of the Operations Center at Semiconductor Manufacturing International Corporation (SMIC).

With extensive expertise in the engineering principles and methodologies of large-scale production for semiconductor micro-nano devices, he has dedicated his career to the research, development, and industrialization of intelligent manufacturing equipment and materials for semiconductor micro-nano devices—particularly focusing on the large-scale industrialization of domestic semiconductor equipment and materials in China. He is recognized as one of the key pioneers in the large-scale industrialization of copper interconnect technology for semiconductor integrated circuits in China.

He has been awarded the 1st Level Prize of the Shanghai Science and Technology Progress Award, published over 20 academic papers, and holds 21 international patents.
He has been selected as a National and Shanghai Distinguished Expert (Innovation Category), honored as an Outstanding Entrepreneur of the Year by China Electronics Corporation (CEC), and received the inaugural Shanghai Outstanding Talent Award.

周华(Allan Zhou)拥有美国康涅狄格大学化学与材料科学博士学位。
他曾担任上海积塔半导体有限公司首席执行官、复旦大学教授、上海电机学院特聘教授兼卓越工程学院兼职副院长、应用材料公司(美国)高级研发科学家,以及中芯国际(SMIC)高级研发经理、大规模制造工厂厂长和运营中心资深处长。

他在半导体微纳器件大规模生产的工程原理与方法方面具有广泛专业知识,长期致力于半导体微纳器件智能制造装备与材料的研发及产业化,尤其专注于中国本土半导体设备与材料的大规模产业化。他被公认为中国半导体集成电路铜互连技术大规模产业化的主要开创者之一。

他曾荣获上海市科学技术进步一等奖,发表过20余篇学术论文,并持有21项国际专利。
他还入选国家级和上海市特聘专家(创新类),获评中国电子信息产业集团年度杰出企业家,以及首届“上海杰出人才”称号。



Wilson Hong

Chair of ISIG China

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Formerly Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.

Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.

At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.

Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.



Jun Wang

Chairman

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Jianhui Wang

Partner

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Jinwei Liu

Senior Reliability Expert

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Geely 汽车集团 资深可靠性专家,高级质量经理。北京泰山质量协会 理事工业设计协会 理事国家重大科技专项《车载移动监测实验室》项目质量总工程师。

Senior Reliability Expert and Senior Quality Manager at Geely Automobile Group.
Director of the Beijing Taishan Quality Association and the Industrial Design Association.
Chief Quality Engineer for the National Major Science and Technology Project “Vehicle-Mounted Mobile Monitoring Laboratory.”

Geely Auto Group is a leading automobile manufacturer based in Hangzhou, China and was founded in 1997 as a subsidiary unit of Zhejiang Geely Holding Group (ZGH). The Group manages several leading brands, including Geely Auto, Lynk & Co, and Zeekr. Geely Auto Group is also the global strategic partner of Malaysian national automaker PROTON.



Carsten Mohr

General Manager

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Carsten is Executive Vice President of the Metal Foils division at SCHLENK and supports CuNex in the same position. He is a mechanical engineer by training and has an extensive track record in the silver paste and copper fabricating industry.

CuNex offers copper sinter pastes and preforms for high-power electronics packaging (die attach, substrate attach, die topside attach). Our copper-based interconnect materials follow a low pressure and rapid sintering approach ensuring improved reliability and performance at a substantial cost advantage over silver sintering.

After 7 years of extensive research, CuNex launched the Cuprum series of sinter pastes and CuForm sinter preforms. The copper pastes and preforms are suitable for Si, SiC and GaN devices as well as high power LEDs.

Specialized engineering solutions also allow for sinter lamination of substrates and die attach supporting embedded chip technologies.

The product development and volume manufacturing are driven by SCHLENK with a history of 150 years in copper and copper alloys.

The Cuprum pastes and CuForm preforms have class leading features:

– Low cost
– Fast drying in air
– Low sintering temperature and pressure
– Rapid sintering process
– High thermal conductivity
– Flexibility on die size and standard metallizations
– No nanoparticles
– Storage at room temperature for up to 6 months



Leon(Yenan) Wu, Ph.D.

Founding Partner & CEO

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  • Master’s degree from Xi’an Jiaotong University
  •  PhD from the School of Integrated Circuits, Tsinghua University
  •  With a background in Electronic Engineering, he has served as a member of the investment committee for integrated circuit and related industry funds under well-known large central enterprises such as Yizhuang Holding Co., Ltd., achieving remarkable investment performance

Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.

西安龙鼎投资管理有限公司(简称“龙鼎投资”)成立于2014年,是一家以国家发展需求为核心导向,以“金融”+“产业”为核心引擎,专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。



Wei Wenyuan

C-ASAM Secretary General

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Marcus Kneifel, Ph.D.

Sr. Vice President, Systems Engineering

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Dr. Marcus Kneifel currently serves as senior vice president of systems engineering, responsible for delivering cutting-edge systems and executing best-in-class engineering practices to expand and support the automotive, industrial, AI and new emerging technologies in adjacent growth markets.Dr. Kneifel is a seasoned leader with deep industry knowledge and a proven track record, bringing valuable expertise into key target markets for the company.Before joining onsemi, Marcus was the Chief Technology Officer and Board Member at Preh Group, and the General Manager of Portfolio Management 800V BEV Power Electronics, Electrified Powertrain Technology at ZF Friedrichshafen. Prior to that, he spent more than 20 years at Robert Bosch, moving through the ranks to ultimately be the General Manager of Engineering Customer Projects, Driver Assistance Systems.He holds a master’s degree in electrical engineering from both the University of Applied Sciences Braunschweig and the University of Bremen, as well as a PhD. in Power Electronics from the University of Bremen.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.



Yung Shun Liu

Senior Chief Engineer

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Cynthia Zhang

Founding Partner

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Cynthia Zhang is the founder of FutureX Capital, a boutique all-stage fund focused on global high-tech and AI companies. Some of her notable portfolio includes Bytedance (TikTok), NIO (NYSE: NIO), Meituan (3690.HK), Xiaomi (1810.HK), and Kingsoft Cloud (NASDAQ: KC). She has been consistently recognized as one of the Top 50 Female Investors and Top Technology GP in China.

Prior to founding FutureX, Cynthia was the founder of the Private Equity Division at China Asset Management Company, one of the largest asset management firms in Asia.

Cynthia holds a bachelor’s degree in Computer Science from the National University of Singapore, an EMBA from Tsinghua University’s PBC School of Finance, and is an alumna of the Stanford Executive Program at Stanford Graduate School of Business.

FutureX Capital invests in visionary founders building transformative AI technologies across all stages. With $3B+ accumulated investment and deep roots in the US and China tech ecosystems, we’re positioned at the forefront of the next wave of innovation.



Jun Li

General Manager (FAE Head Quarter), Shanghai

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JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.

ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.


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