Speaker
TK.KU, Ph.D. 顾子琨
VP of Process Technology Development, CPO
Day 1 / 12:00 - 12:20
Over 29 years R&D and Manufacture experience in semiconductor process & device technologies including wide bandgap power electronics, advanced Si CMOS， More than Moore technologies and 3D TSV stack packaging.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Keynote Speaker
Dinesh Ramanathan, Ph.D.
Senior Vice President, Corporate Strategy
Day 1 / 14:40 - 15:00
Dinesh Ramanathan joined onsemi in May 2023 and currently serves as vice president for corporate strategy, responsible for driving our strategy development and annual strategic planning initiatives.
He has been in the hardware industry for 25 years, designing semiconductor devices software and systems. He is experienced in transforming commodity device businesses to proprietary, software defined device businesses with higher gross margins and larger addressable markets.
Before joining onsemi Dinesh focused on vertical gallium nitride (GaN) technology and products; co-founding NexGen Power Systems in 2017. He successfully secured over $100M in funding for a state-of-the-art GaN manufacturing facility where NexGen created the first manufacturable, cost competitive vertical GaN transistors, enabling the business to address a $6B power semiconductor market. Prior to that, Dinesh was CEO and president of Avogy Inc., and was executive vice president at Cypress Semiconductors for over 9 years.
Dinesh holds a Ph.D. in Information and Computer Science from the University of California, Irvine, as well as a Bachelor of Engineering in Computer Science and a Master of Science in Mathematics from BITS, Pilani, India.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Speaker
Prof. Shaojun Wei
Professor
Welcome Speech
Day 1 / 09:00 - 09:05
Dr. Shaojun Wei is the professor of Tsinghua University; Member of the National Integrated Circuit Industry Development Advisory Committee; Vice President of China Semiconductor Industry Association (CSIA) and President of Fabless Chapter CSIA. Dr. Wei was the President & CEO of Datang Telecom Technology Co., Ltd. and the CTO of Datang Telecom Industry Group between 2001-2006.
Dr. Wei has been working on VLSI design methodologies research and reconfigurable computing technology research. He has published more than 200 peer-reviewed papers and 6 monographs. He owns more than 130 patents, including 18 US patents. Dr. Wei is the IEEE Fellow, the Fellow of Chinese Institute of Electronics (CIE), the Fellow of Asia-Pacific AI Association, and the academician of the International Eurasian Academy of Science (IEAS).
Dr. Wei had won many awards including China National Second Award for Technology Invention (2015), China National Second Award for Technology Progress (2001), SIPO & WIPO Patent Golden Award (2003, 2015), First Award for Science and Technology of Ministry of Education (2014, 2019), China, First Award for Technology Invention of CIE (2012, 2017, 2020), EETimes China IC Design Achievement Award (2018), Aspencore Outstanding Contribution Award of the Year/Global Electronic Achievement Awards (2018), SEMI Special Contribution Award (2019) and IEEE CAS Industrial Pioneer Award (2020).
魏少军，现任清华大学教授，国际电气和电子工程师协会会士（IEEE Fellow），中国电子学会会士（CIE Fellow），亚太人工智能学会会士（AAIA Fellow），国际欧亚科学院院士，国家集成电路产业发展咨询委员会委员，北京超弦存储器研究院院长。曾任“核高基”国家科技重大专项技术总师，八六三计划微电子与光电子主题召集人，大唐微电子技术有限公司总经理/董事长、大唐电信科技股份有限公司总裁兼首席执行官、大唐电信科技产业集团总工程师。
魏少军长期致力于超大规模集成电路设计方法学的研究、可重构计算架构研究和通信专用集成电路技术研究，发表学术论文近 300 篇，出版专著 5 册，先后获得国家科技进步二等奖、国家技术发明二等奖、教育部技术发明一等奖（2项）、中国电子学会技术发明一等奖（4 项），国家知识产
权局和世界知识产权组织中国专利金奖（2 项）、国际半导体产业协会（SEMI）突出贡献奖、第五届世界互联网大会全球领先科技成果等。2020 年 5 月，获 IEEE 电路与系统协会产业先驱奖，旨在表彰他为当代计算机和通信系统智能芯片和电子身份证芯片的设计实现和批量生产所做出的开拓性
贡献。魏少军曾获全国五一劳动奖章，中国科协求是青年奖，享受国务院特殊津贴，是百千万人才工程国家级人选.
Company Profile
The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.
Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.
The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.
Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.
After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.
Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.
With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.
Speaker
Francesco Muggeri
VP Marketing & Applications, Power Discrete & Analog, China
Day 1 / 14:15 - 14:35
Francesco Muggeri is Vice President, Power Discrete and Analog Products China at STMicroelectronics. In his role, Francesco leads ST’s Industrial Focused Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and coordinates ST’s global Mass Market Industrial Task Force, with regards to consumer segment. He has been further appointed Industrial Power and Energy Segment Global Leader in July 2024. In recognition of his contribution to the electronics industry, Muggeri was awarded the 2023 Asia Executive of the Year by EETimes and EDN from Aspencore.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Speaker
Bruno Schuster
Head of Product Area Power Semiconductors
Day 1 / 11:35 - 11:55
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Speaker
Tobias Keller
Vice President, Head of global Product Mgt., Portfolio & Marketing
Day 1 / 16:30 - 16:50
Tobias Keller graduated from University of applied science Aargau with a degree in power electronics, thermodynamics and el. machines. He joined ABB’s Excitation and Synchronizing business. He was the Vice President global Products and Marketing. Afterwards he held the Vice President position for Vehicle Integration Engineering in ABB’s traction business. Since 2019, he is the Vice President global Product Management, Portfolio & Marketing in Hitachi Energy Semiconductor. Tobias Keller is a senior member of IEEE.
Company Profile
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Speaker
Gary Huang
Corporate VP, Asia
Innovations in Power Electronics for xEV and Data Center Applications: The Evolving Roles of Silicon, SiC, and GaN
Day 1 / 17:50 - 18:10
The global push for electrification and digitalization is accelerating innovation in power electronics, especially in two critical sectors: electric and hybrid electric vehicles (xEVs) and data centers. This presentation explores the latest technological trends and market dynamics shaping the future of power devices in these applications, with a special focus on the evolving roles of Silicon, Silicon Carbide (SiC), and Gallium Nitride (GaN) semiconductor technologies.
In the xEV domain, sustainability goals and electrification trends are driving long-term growth, with the market expected to reach 64.3 million vehicles by 2030. The corresponding power device market is projected to reach nearly $14.9 billion, fueled by the trend toward full vehicle electrification and the increased adoption of Wide Bandgap (WBG) technologies and high-voltage architectures such as 800V and the emerging 1,000V systems. These platforms are being accelerated by advances in SiC technology, reduced substrate costs, and expanded high-power charging infrastructure. SiC’s superior efficiency, thermal performance, and compactness are key enablers of higher power density, longer driving range, and smaller system footprints—particularly in traction inverters for BEVs. Chinese OEMs are leading this shift through the aggressive integration of SiC. PHEVs, currently still almost exclusively based on IGBTs, are also beginning to adopt SiC in their main inverters as battery capacities increase. Silicon devices remain the technology of choice primarily for hybrid electric vehicles and low-power electric vehicles. GaN remains a promising contender in xEVs, with potential deployment in onboard chargers and DC-DC converters—and, in the longer term, in main inverters—though its adoption is hindered by cost, supply chain, and technology challenges.In data centers, the surge in AI workloads has triggered an urgent need for higher-efficiency power conversion. Power Supply Units (PSUs) are central to this transformation, with the market expected to grow at a 15.5% CAGR, reaching $14.1 billion by 2030. The introduction of the 80 PLUS Ruby certification sets a new efficiency benchmark, demanding up to 96.5% efficiency at 50% load. To meet such stringent targets and rising power densities—now exceeding 100 W/in³—PSU designers are rapidly adopting WBG semiconductors. SiC and GaN together are expected to account for 24% of PSU power device shipments by 2030.
Hybrid designs combining Si, SiC, and GaN in optimized topologies are emerging as the new standard. Infineon’s new 400V SiC class targets three-level PSU topologies to further push efficiency boundaries. These innovations are key to addressing the dual challenges of energy efficiency and power scalability in future AI-driven data centers.
Company Profile
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
Speaker
Hidenori Abe
CTO, Semiconductor Materials, Resonac Holdings Corporation
Day 2 / 15:00 - 15:20
Hidenori Abe CTO for semiconductor materials, Resonac Holdings Corporation Executive director, Electronics Business Headquarters, Resonac Corporation. He is leading electronics materials R&D and strategy for semiconductor, substrate and display. Until 2023, he was the head of Electronics R&D Center and Packaging Solution Center, which is open innovation hub in advanced packaging development. I launched JOINT2, new advanced packaging consortium targeting 2.xD and 3D package in 2021.Prior to the above mission, he have been a General Manager of CMP Slurry Business Sector for three years. Before that he was a Manager of Marketing Promotion Group in Innovation Promotion Center at Hitachi Chemical (HC) for 2 years. When the career, he was promoted new R&D projects, especially targeting new business field using new technologies, and also to promote developing R&D products. As a side note, HC is one of the merged companies of Resonac. Hidenori Abe was Manager of Business Development Group in Packaging Solution Center at HC for 1 year with responsibility to promote open laboratory to partners such as customers and equipment makers, responsibility of marketing wearable related materials. Before that, he was epoxy molding compounds (EMC) engineer. During his 16 years carrier as engineer, he spent time doing responsibility of development of non-conductive carbon, green EMC, Cu wire compatible EMC, wafer level compression compounds, power module EMC and so on. His Cu wire compatible EMC development work contributed to the promotion to Cu wire conversion through several published papers. He received a master degree in chemical engineering field from Tokyo Institute of Technology, Japan and a master degree at the EMBA course from Oxford, UK.
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Speaker
Johnny Guo
Director Solutions – User Experience
Day 1 / 16:50 - 17:10
Company Profile
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Speaker
Jun Shi, Ph.D.
Power Module Division Deputy General Manager
Technological development and application, challenges and future trends of SiC power devices
Day 1 / 15:05 - 15:25
This article introduces the current development status and applications of SiC devices, especially in popular fields, the various problems faced by SiC devices, especially the reliability issue of SiC devices. Finally, the author provides the future and prospects of SiC devices, as well as the progress made by Yangjie Technology in SiC devices.
From 1995 to 2005, studied at Zhejiang University and obtained bachelor’s and doctoral degrees. In 2005, was an academic visitor at the University of Sheffield in the United Kingdom; Subsequently, I was employed as a senior engineer at Siemens (China) Research Institute for the next 5 years, focusing on power electronics technology and its applications in the new energy industry. I have experienced several major power electronics related projects and achieved world leading technology. 3 years of entrepreneurial experience, focusing on the design and development of photovoltaic inverter products. Led a team to develop the 500KW photovoltaic inverter with the highest power density at that time. In 2012, selected as a “double innovation” entrepreneurial talent in Jiangsu Province; I started working at Infineon Technologies for 8 years in 2013 and worked at State Grid subsidiary company Nari Semiconductor for 4 years, focusing on the development and application of power devices (IGBT, SiC) products themselves. I have developed more than 30 IGBT and SiC power devices, which have been widely used in wind power, photovoltaics, energy storage, charging piles, electric vehicles, industrial power supply and other fields. I was selected for the “Purple Mountain Talent Plan High level Innovation and Entrepreneurship Talent Project” in 2023; The current Vice General Manager of Yangjie Technology’s Power Device Division is responsible for the product development, application, and market promotion of power devices such as IGBT and SiC. I have obtained over 10 invention patents.
Company Profile
Yangzhou Yangjie Electronic Technology Co., Ltd. is one of China’s leading vertically integrated (IDM) semiconductor enterprises, covering the entire industrial chain from the design and manufacturing of discrete semiconductor chips to device packaging and testing, as well as end-user sales and services. The company offers a comprehensive product portfolio, including discrete device chips, MOSFETs, IGBTs and power modules, SiC devices, rectifiers, protection devices, and small signal products, providing customers with one-stop product solutions.
Yangjie Electronic’s products are widely used in various key fields, including automotive electronics, clean energy, industrial control, 5G communications, security, artificial intelligence (AI), and consumer electronics. Through continuous efforts in technological innovation and market service, the company is committed to meeting the diverse needs of customers worldwide.
The company was listed on the Shenzhen Stock Exchange on January 23, 2014, under the stock code 300373.
扬州扬杰电子科技股份有限公司是国内少数集半导体分立器件芯片设计制造、器件封装测试、终端销售与服务等产业链垂直一体化（IDM）的杰出厂商。产品线含盖分立器件芯片、MOSFET、IGBT&功率模块、SiC、整流器件、保护器件、小信号等，为客户提供一揽子产品解决方案。
公司产品广泛应用于汽车电子、清洁能源、工控、5G通讯、安防、AI、消费电子等诸多领域。
公司于2014年1月23日在深交所上市，证券代码300373，相信在您的关怀支持下，我们一定能够成为世界信赖的功率半导体伙伴。
Speaker
Henryk Dabrowski
SVP of Global Sales
Day 2 / 11:15 - 11:35
Company Profile
A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
Speaker
Gang Jung
VP & GM Automotive BU & Corp. Quality
Day 2 / 14:10 - 14:30
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Speaker
KeDa Xu
Founder & CEO
Day 2 / 09:30 - 09:50
eVTOL marketing trend
Mr. Xu Keda holds a master’s degree from Renmin University of China and brings over 20 years of experience from the General Armament Department.
He has deep insights into both the Chinese and global aviation engine markets, which allow him to set a clear strategic direction for the company and to navigate opportunities in today’s complex, fast-changing environment.
许可达，中国人民大学硕士毕业，曾在总装工作20余年，对中国乃至世界航空发动机市场 的现状、趋势有着深刻理解，清晰定位企业发展方向，助力企业在复杂多变的市场环境中把 握发展机遇。
Company Profile
Falcon Aerospace Power Group, founded in 2020, specializes in the research and development, production, sales, and maintenance of power systems for general aviation and low-altitude applications. The company has established an R&D center in Zhuzhou, Hunan, and a heavy-fuel piston engine assembly base in Zhuhai, Guangdong. As of June 2025, Falcon has been recognized as a “Specialized and Innovative Enterprise” in Sichuan Province and as a National High-Tech Enterprise, holding over 40 patents. With leading capabilities in engine technology development, the company has launched three product lines—piston engines, turboprops, and hybrid power systems—providing practical power solutions for various types of low-altitude aircraft.
Panel Moderator
Alan Zhou, Ph.D.
CEO, Shanghai
Panel Discussion: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
Day 2 / 17:15 - 18:00
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Company Profile
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Panel Moderator
Joseph Chou
General Manager
Panel Discussion:
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Chinese Practices in the Automotive Chip Industry — How Standardization Synergy Empowers a Globalized New Ecosystem for the Automotive Industry 车规级芯片产业的全球格局与中国实践 —— 标准化协同如何赋能汽车产业全球化新生态
Company Profile
POMME was established in 2015 and is located in Hsinchu, Taiwan. It is engaged in high-end wafer test integration and design services for the semiconductor industry, focusing on providing you with the most efficient wafer parameter test solutions. Such as IC Design house, foundry, IDM, testing company, assembly and packaging company, etc., to simplify work for engineers in different departments (such as: technology research and development, quality and reliability assurance, failure analysis, manufacturing, etc.). POMME can help turn all the measurement and analysis under numerous test results into a simple job, speeding up product throughput throughout semiconductor production.
POMME is the solution partner of Keysight Technologies, a world-renowned instrument manufacturer. With more than 16 years of long-term cooperation experience, POMME has developed into the only and most reliable partner of customers among semiconductor industry test integration system providers, with the most professional The technical team, adhering to the spirit of quality first and customer satisfaction, grows together with customers and employees.
Since its establishment, it has served the semiconductor industry chain in the Asia-Pacific region, with more than 300 customers. We use experienced teamwork to run your test work quickly and efficiently. We can provide test solutions that meet your unique needs every time.
POMME possesses the leading wide-bandgap semiconductor automotive electronic components and module test solution technology, and has officially become the exclusive distributor of ipTEST LTD. in the UK. It can provide a full range of measurement solutions more efficiently to meet your needs.
main products:
Power semiconductor wafers, chips, components, and power module testing solutions.
Electrical test probe station (manual/semi-automatic/automatic), all electrical test probe station standard/custom configuration.
Electrical test system upgrade/maintenance/calibration/expansion (HP/Agilent/HP/Keysight/Keithley).
OST (Entrusted Measurement)/WBG/Low Current/Reliability/Burn-In.
Panelist
Tim Yeh, Ph.D.
Technical Director
Panel Discussion:
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Chinese Practices in the Automotive Chip Industry — How Standardization Synergy Empowers a Globalized New Ecosystem for the Automotive Industry 车规级芯片产业的全球格局与中国实践 —— 标准化协同如何赋能汽车产业全球化新生态
Tim Yeh holds a Ph.D. in Electrical Engineering from National Central University in Taiwan and serves as a member of the Executive Advisory Committee of the International Semiconductor Executive Summit (ISES China). He has long been engaged in the research and industrialization of compound semiconductor materials and devices, with 25 years of industrial R&D experience, particularly in the field of third-generation semiconductor materials and devices. He is well-versed in the design and industrial manufacturing of compound semiconductor devices.
Dr. Ye has previously worked as a researcher at the Telecommunication Laboratories of Chunghwa Telecom in Taiwan and served as a technical director for a publicly listed company in Taiwan. His research achievements have led to the granting of more than 30 patents across the United States, Japan, Mainland China, and Taiwan, and he has published over 70 papers in international journals. He has led or participated in several major projects under China’s Ministry of Science and Technology and key national R&D programs.
He currently serves as the Technical Director at Hunan Sanan Semiconductor, where he is responsible for the R&D and mass production integration of compound semiconductor power electronic devices. He has successfully established a full industrial chain production line for third-generation semiconductor power electronic devices, covering the entire process from epitaxy to device fabrication.
叶念慈，台湾中央大学电机工程博士，国际半导体高管峰会 (ISES China）执行顾问委员会成员，长期从事化合物半导体材料和器件研究及产业化，特别是在 第三代半导体材料和器件 领域拥有 25 年的产业研发经验，精通化合物半导体器件设计和产业化制造。曾先后任台湾中华电信公司电信研究所研究员及台湾上市公司技术负责人。研究成果获美国、日本、中国大陆和台湾地区专利授权30 余件，发表国际期刊论文 70 余篇，曾作为项目或课题负责人参与数项国家科技部重大专项和国家重点研发计划项目。现担任湖南三安半导体技术总监，负责 化合物半导体功率电子器件研发与量产导入，成功打造从外延到器件全产业链 第三代半导体功率电子器件产线。
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Panelist
Marcus Kneifel, Ph.D.
Sr. Vice President, Systems Engineering
Panel Discussion:
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Chinese Practices in the Automotive Chip Industry — How Standardization Synergy Empowers a Globalized New Ecosystem for the Automotive Industry 车规级芯片产业的全球格局与中国实践 —— 标准化协同如何赋能汽车产业全球化新生态
Dr. Marcus Kneifel currently serves as senior vice president of systems engineering, responsible for delivering cutting-edge systems and executing best-in-class engineering practices to expand and support the automotive, industrial, AI and new emerging technologies in adjacent growth markets.Dr. Kneifel is a seasoned leader with deep industry knowledge and a proven track record, bringing valuable expertise into key target markets for the company.Before joining onsemi, Marcus was the Chief Technology Officer and Board Member at Preh Group, and the General Manager of Portfolio Management 800V BEV Power Electronics, Electrified Powertrain Technology at ZF Friedrichshafen. Prior to that, he spent more than 20 years at Robert Bosch, moving through the ranks to ultimately be the General Manager of Engineering Customer Projects, Driver Assistance Systems.He holds a master’s degree in electrical engineering from both the University of Applied Sciences Braunschweig and the University of Bremen, as well as a PhD. in Power Electronics from the University of Bremen.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Panelist
Jun Li
General Manager (FAE Head Quarter), Shanghai
Panel Discussion
Day 2 / 16:30 - 17:15
Topic: Innovations in Power Electronic Packaging: Pathways to Energy Efficiency and Reliability
JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.
Company Profile
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
Moderator
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
Welcome speech by Day 2 moderator
Day 2 / 09:00 - 09:05
Closing speech by moderator
Day 2 / 18:25 - 18:35
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
Moderator
Tong Wu, Ph.D.
Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications
Moderator:
Day 1 / 10:07 -
I.S.I.G. China Regional President
Closing Speech
Day 1 / 18:10 - 18:20
吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。 目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项 半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Speaker
Gerald Yin, Ph.D.
Chairman and CEO
Welcome and Product speech
Day 1 / 09:05 - 09:20
Company Profile
Advanced Micro-Fabrication Equipment Inc. China (AMEC, stock code: 688012) is an innovative Asia-based semiconductor equipment company with a range of proprietary fabrication solutions designed to advance technology, increase productivity, and reduce manufacturing costs for leading global manufacturers of semiconductors and LEDs. Headquartered in Shanghai, the company is an entrenched supplier of dielectric and TSV etch tools, helping chipmakers build devices at process nodes as low as 5nm and beyond. In addition, AMEC’s MOCVD system has become a market leader in China for producers of LEDs and power devices. AMEC products are used today by technology leaders in Chinese mainland and Taiwan region, as well as Singapore, Korea, Germany, Italy and so on.
Speaker
Salah Nasri
CEO and Co-Founder
I.S.I.G. 15th Year Anniversary Panel Discussion
Day 1 / 09:20 - 10:05
Topic: Chinese Enterprises Going to Middle East (TBC)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Speaker
Heming Li
Product Marketing VP
Session info not yet published
Company Profile
Alpha Power Solutions (APS) is China’s leading supplier of wide band gap power semiconductor devices. It is one of the pioneering companies in China to engage in the research and development of SiC devices and is the first to successfully use 6-inch SiC technologies , helping China make a breakthrough in this field.
APS adopts the CIDM strategy and has successfully deployed applications in leading domestic companies in the renew energy, photovoltaic energy storage, and EV-charging industries, providing them with Silicon carbide products and solutions for carbon neutrality.
SiC MOSFET, SiC Diode
Panelist
Wei Wenyuan
Secretary General
Panel Discussion:
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Chinese Practices in the Automotive Chip Industry — How Standardization Synergy Empowers a Globalized New Ecosystem for the Automotive Industry 车规级芯片产业的全球格局与中国实践 —— 标准化协同如何赋能汽车产业全球化新生态
Company Profile
Panelist
Liu Yongshun
Senior Chief Engineer of Chips
Panel Discussion:
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Chinese Practices in the Automotive Chip Industry — How Standardization Synergy Empowers a Globalized New Ecosystem for the Automotive Industry 车规级芯片产业的全球格局与中国实践 —— 标准化协同如何赋能汽车产业全球化新生态
Company Profile
Speaker
Lam Research Corporation
Session info not yet published
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Panel Moderator
Onto Innovation
Session info not yet published
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
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