Keynote Speaker
Naveed Sherwani, Ph.D.
Chief Executive Officer
Collaborative Semiconductor Ecosystem to be built in MENA
Day 1 / 11:20 - 11:40
Dr. Naveed Sherwani is a world-renowned semiconductor expert, entrepreneur, and leader in chip design. He holds a PhD in computer engineering from the University of Nebraska-Lincoln, and his career spans academia, industry leadership, and entrepreneurship. Early in his career, he served as a professor at Western Michigan University before joining Intel in 1994, where he focused on design automation for complex chips.
Dr. Sherwani has founded or co-founded numerous influential semiconductor companies, including Open-Silicon, Brite Semiconductor, PeerNova, and Rapid Silicon. His ventures have been instrumental in advancing semiconductor technology, raising over $1 billion in funding across these projects. A key figure in the RISC-V movement, he has led the growth of companies like SiFive and SemiFive, contributing to the global rise of RISC-V technology.
In addition to his leadership roles in the private sector, Dr. Sherwani is the Chairman of the National Semiconductor Hub of the Kingdom, where he works on fostering innovation and semiconductor advancements at a national level. He continues to influence the global semiconductor landscape through his contributions to the RISC-V ecosystem and domain-specific FPGA innovations at Rapid Silicon.
Dr. Sherwani has authored multiple textbooks, including the widely-used “Algorithms for VLSI Physical Design Automation,” and has published over 125 technical papers. His leadership in both academia and the industry has earned him numerous accolades, including the Sitara-e-Quaid-e-Azam awarded by the President of Pakistan in 2019.
Company Profile
Keynote Speaker
Habib Hichri, Ph.D.
EVP, Senior Fellow, Global Applications and Business Development
Keynote: Material Science for High-Performance Packaging
Day 2 / 09:10 - 09:30
Education:
- PhD in Chemical Engineering
- MBA
Experience:
- Executive Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
- Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
- Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation.
Habib Hichri is an Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine-Techno Corporation USA. Prior to joining AFT USA, Habib was Director of Applications Engineering at SUSS MicroTec Photonics Systems USA where he provided patterning solutions for advanced semiconductors packaging customers. Before joining SUSS MicroTec, Habib spent about 12 years with IBM Semiconductors Research and Development Center (IBM SRDC) in East Fishkill, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management positions within IBM on process development in the front end of line area for microprocessor fabrication. Habib holds over 40 U.S. patents and authored over 75 publications and presentations and a book chapter in “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies” (Wiley – IEEE) first Edition. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France, and an MBA degree from the State University of New York at Buffalo. Habib is the chair of the Orange County California IEEE/Electronic Packaging Society (EPS) Chapter. He is also a member of the technical committees of Electronic Components and Technology Conference (ECTC), International Microelectronics Assembly and Packaging Society (IMAPS). He was the general chair of IMPAS 2020. Habib is IMAPS Society Fellow. He is currently member of the IMAPS executive council. Habib is Board member of International Electronics Manufacturing Initiative (iNEMI) since April 2024 and International Semiconductor Industry Group (ISIG) since April 2025.
Company Profile
Ajinomoto Fine-Techno Co., Inc. (AFT) is a subsidiary of the Ajinomoto Group responsible for the fine chemicals division. AFT (est. 1942) continues to deliver materials that can suit a wide range of customer needs in our four main strengths: molecular design, formulation, process development, and solutions. Our customers have commended us for our electronic materials. We have grown to play a major part in their value chains for electronics, automotive, and a variety of other products. We continue to refine our ability in materials science through research and development to continue creating value with our customers. We strive to provide the highest quality products, services, and information for our customers. Beyond our Ajinomoto Build-up film®, we’ve expanded our material portfolio to include molding, photo dielectric, magnetic, and optoelectronics. To maintain our leadership in our specified industry, we are devoted to providing state-of-the-art material, technology know-how, and customer service.
- Insulation film: Ajinomoto Build-up Film (ABF)
- Magnetic materials (Film and Liquid Format)
- Semiconductor encapsulants (AEF )
- Adhesives & Encapsulants (PLANSET)
- Functional adhesive / encapsulation film “AFTINNOVA EF series”
- Latent curing agent “AJICURE”
- Pigment dispersants, coupling agents
- Flame retardants, polymer co-stabilizer
- Activated carbon
Please visit the website: Product information – Ajinomoto Fine-Techno Co.,Inc. (aft-website.com)
Speaker
Chloe Ma
Chief Business Officer
From Power to Performance: EPIC Silicon Stack for the AI Era
Day 1 / 14:00 - 14:15
AI is rewriting compute—from chiplets and advanced packaging to cloud-to-edge specialization. This talk frames the industry shift (“design for AI”) and introduces EPIC Semi’s KSA-rooted answer: a sovereign silicon stack that turns power into performance across E·P·I·C—Edge AI (Echelon), Physical AI (Pegasus), IoT (Ionos), and Cloud AI (Contrail). We’ll outline the mission, the cloud-first portfolio, and a pragmatic strategy—partner to accelerate, acquire to anchor, and co-design with the Kingdom—to deliver outcomes, not parts, while compounding Saudi local content for Vision 2030 and beyond.
Chloe Jian Ma is Chief Business Officer at EPIC Semi, leading global partnerships, strategy, and go-to-market to build a KSA-rooted silicon portfolio for AI deployment from cloud to edge. A veteran of Arm, Intel, Mellanox, SiFive as well as tenure in networking system companies including Cisco System and Juniper Networks, she blends deep technical fluency (AI/ML, silicon, systems, robotics) with commercial execution. At Arm she led Edge AI & Robotics GTM and ecosystem growth; at Intel and Mellanox she drove cloud compute and networking solution marketing across the Super 7 hyperscalers. A frequent keynote speaker and recognized industry voice, Chloe holds an MBA from Wharton and an MSEE from USC.
Company Profile
Saudi Arabia’s Vision 2030 will demand hundreds of billions of dollars in semiconductors—from edge to cloud. EPIC Semi is building a world-class, KSA-rooted fabless company to meet that demand with locally designed chips and IP. As Saudi Arabia’s 1st fabless semiconductor technology and solutions company, EPIC Semi is positioned at the forefront of the AI revolution, developing cutting-edge silicon solutions for the next generation of intelligent, immersive and interconnected applications. As a strong KSA-rooted brand, EPIC is creating an E+P+I+C portfolio of Edge AI, Physical AI, IoT and Cloud AI solutions to power AI computing from cloud to edge, enabling AI buildout with local innovation in Saudi Arabia, extending to Middle East and global markets.
EPIC’s extensive AI chip and solution portfolio addresses four critical market segments:1. EPIC Echelon™ — Edge AITiered, low-latency inference that lives where your data is born—factory lines, smart cities, and energy sites. Scale from single node to fleet without changing the control stack.2. EPIC Pegasus™ — Physical AIComputer vision, reasoning, planning, and actuation for robots and autonomous systems. From inspection to pick-and-place, Pegasus turns intent into safe, smooth motion.3. EPIC Ionos™ — IoT & InterconnectDeterministic device connectivity through cellular, WiFi/BLE or power line communications, with secure telemetry, and over-the-air control.4. EPIC Contrail™ — Cloud AIRich portfolio of modern CPU compute, AI accelerations, data center interconnect, memory and storage, and liquid cooling, to support state of the art AI data center build-out at rack scale.
Speaker
Mo Maghsoudnia
Founder & CEO
Day 2 / 12:05 - 12:20
Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.
Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.
Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.
Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.
Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.
Company Profile
UltraSense Systems is pioneering the next generation of human–machine interface intelligence, built on its proprietary ultrasound and piezoelectric platform that fuses sensing, haptics, and edge processing into compact, solid-state systems. Its multimodal sensor-fusion architecture—integrating touch, force, ultrasound, lighting, and haptic feedback—creates a unified tactile interface layer that transforms how users interact with devices and environments. The company’s silicon and systems portfolio enables software-defined smart surfaces that operate across diverse materials and form factors, delivering the responsiveness, precision, and design freedom demanded by advanced mobility and next-generation consumer electronics. In automotive, UltraSense Systems powers intelligent cabin interfaces that integrate sensing, actuation, and illumination into seamless surfaces for a futuristic in-cabin experience. In high-end consumer devices, including smartphones and AR glasses, its solutions enable thinner, more immersive, and spatially aware user experiences. Built on deep expertise in ultrasound physics, MEMS, and mixed-signal ASIC design, UltraSense Systems is extending its technology platform into new domains where tactile perception and spatial awareness will define the next era of user experience—combining precision sensing, embedded intelligence, and solid-state reliability to bridge the physical and digital worlds. For more information, visit www.UltraSenseSystems.com.
UltraSense Systems delivers the most advanced solid-state HMI technology for the next generation of user interfaces. Our TouchPoint™ family of silicon controllers integrates multi-modal sensing — ultrasound, capacitive, and piezoelectric — with lighting, haptic feedback, and on-chip intelligence.
From TouchPoint C (CapForce™) to Z (UltraForce™), Q (TapForce™), and Edge, each device fuses sensing, control, and communication into a single SoC — enabling touch and force interaction through metal, glass, fabric, and composite surfaces.
Complemented by our UltraSwitch™, UltraSlide™, and UltraTouch™ system modules, UltraSense provides a full-stack platform that transforms static surfaces into intelligent, software-defined interfaces — powering the future of automotive, AR glasses, and high-end consumer devices.
UltraSense Systems — The Future of Solid-State HMI
| Layer | Offering | Description |
| Silicon Platform | TouchPoint™ HMI Controllers | Multi-mode SoCs integrating touch + force sensing, lighting, haptics, and AI-based algorithms |
| C – CapForce™ | Capacitive + Force sensing controller | |
| Z – UltraForce™ | Ultrasound + Force sensing controller | |
| Q – TapForce™ | Piezoelectric Force sensing controller | |
| Edge – Cluster/Slider | Multi-channel HMI SoC with Neural Touch Engine™ + LIN | |
| System Modules | UltraSwitch™ / UltraSlide™ / UltraTouch™ | Complete smart-surface solutions integrating sensing, feedback, and lighting |
| Applications | Automotive • AR Glasses • Consumer Devices | Solid-state, software-defined interfaces that modernize the user experience |
Speaker
Anton Hofmeister
Group Vice President – GM Central R&D
Day 2 / 11:25 - 11:40
MEMS Driving Smart Systems from Europe to MENA
Anton Hofmeister is Group Vice President and General Manager of R&D in ST’s Analog, Power & Discrete, MEMS & Sensors Group. He is also Managing Director of ST’s German subsidiary since 2016.
Hofmeister joined Thomson Semiconductors (a predecessor company to STMicroelectronics) as a marketing engineer in 1986. He subsequently held management positions in product marketing, key account management and corporate strategic marketing. In 1997, Hofmeister was appointed Director of a System R&D team in San Diego, USA, and became subsequently Director of the Print Head Business Unit. In 2005, he was appointed General Manager of the Microfluidics Division and has broadened his responsibility with the MEMS Microactuator Division in 2015, managing the MEMS business for a variety of applications in Consumer Electronics, Automotive, Industrial, and Medical markets.
Hofmeister has served as a board member of the Singapore-based Molecular Diagnostics company Veredus Laboratories. He is currently a member of the Governing Council of the MEMS&Sensor Industry Group (MSIG) at SEMI and a board member of the European Association on Smart Systems Integration (EPoSS).
Anton Hofmeister was born in Munich and graduated with a Master’s degree in Engineering from the University of Munich.
Anton Hofmeister is Group Vice President and General Manager of R&D in ST’s Analog, Power & Discrete, MEMS & Sensors Group. He is also Managing Director of ST’s German subsidiary since 2016.
Hofmeister joined Thomson Semiconductors (a predecessor company to STMicroelectronics) as a marketing engineer in 1986. He subsequently held management positions in product marketing, key account management and corporate strategic marketing. In 1997, Hofmeister was appointed Director of a System R&D team in San Diego, USA, and became subsequently Director of the Print Head Business Unit. In 2005, he was appointed General Manager of the Microfluidics Division and has broadened his responsibility with the MEMS Microactuator Division in 2015, managing the MEMS business for a variety of applications in Consumer Electronics, Automotive, Industrial, and Medical markets.
Hofmeister has served as a board member of the Singapore-based Molecular Diagnostics company Veredus Laboratories. He is currently a member of the Governing Council of the MEMS&Sensor Industry Group (MSIG) at SEMI and a board member of the European Association on Smart Systems Integration (EPoSS).
Anton Hofmeister was born in Munich and graduated with a Master’s degree in Engineering from the University of Munich.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Speaker
Kieran Harney
Chief Executive Officer
Optical MEMS breaking performance barriers in sensors
Day 1 / 15:20 - 15:35
sensiBel is shipping the world’s first studio quality MEMS microphone using breakthrough optical MEMS technology. The optoKore(TM) platform that is the basis of the sensiBel SBM100B microphone will be used to create a wide range of other high-performance sensors. This technology is being scaled to address multi-billion unit opportunities in consumer, industrial and other markets. This presentation will outline the audio capture capabilities that are enabled with this 80dB SNR MEMS microphone and will describe some of the innovations that are at the heart of this technology.
Kieran Harney is CEO of sensiBel, a deep tech optical MEMS company. He has worked in the MEMS industry for over 30 years with over 20 years in the MEMS microphone business. He has held senior management positions at Analog Devices, InvenSense and TDK.
Kieran joined Analog Devices in 1986 in Ireland as a semiconductor packaging engineer. He was engineering manager in ADI Philippines for three years and then joined the ADI MEMS group in Cambridge Massachusetts in 1997 with responsible for assembly and test operations for MEMS accelerometers and gyroscopes. In 2004 he started a successful MEMS microphone product line that was sold to Invensense in 2013. He held senior management roles in Invensense and TDK in the MEMS microphone group.
He joined sensiBel in 2022 and served as COO before becoming CEO in 2025.
Kieran is from Limerick Ireland and has a Bachelor of Engineering and MBA from the University of Limerick.
Company Profile
sensiBel is a deep-tech company who has developed the new generation of optical MEMS microphones that deliver studio-quality sound in a miniature MEMS package. By replacing traditional capacitive sensing with advanced optical readout technology, sensiBel achieves unprecedented performance in signal-to-noise ratio, dynamic range, and sound fidelity. Founded by experts in micro-optics and acoustics, the company’s mission is to revolutionize how sound is captured across consumer electronics, professional audio, and industrial applications. With innovation at its core, sensiBel is redefining what’s possible in microphone technology.
SBM100B
The SBM100B is a high-performance MEMS microphone based on sensiBel’s deep-tech, patented optical technology platform. This microphone delivers studio-quality audio, with 80 dB SNR, 146 dB AOP and 24-bit audio, in a miniaturized package. By combining the MEMS system with advanced optical sensing, sensiBel’s technology enables crystal-clear audio capture in applications where high fidelity and small size are critical. These applications include microphone arrays, enterprise conferencing systems, industrial sound detection, spatial audio, high end smart phones and wearables.
Keynote Speaker
Oreste Donzella
Strategic Advisor, Board Member, Former C-Suite Executive
Semiconductor Technology Innovation to Enable the AI Era
Day 1 / 09:40 - 09:55
We are at a pivotal moment in the semiconductor industry with a more diversified end market driven by the AI revolution. This shift is bringing innovation and new challenges.
In the recent months, significant investments have been made in data centers to build infrastructure and run new large language models that promise to drastically change every aspect of our lives.
While Moore’s law continues with the introduction of high NA EUV, the shift to the new gate-all-around (GAA) transistor architecture and the introduction of backside power distribution network, the pace of scaling in front end manufacturing has slowed and become more expensive.
Consequently, semiconductor packaging has started to play a more crucial role in driving performance, power, connectivity and cost advantages.
The acceleration of heterogeneous integration, being implemented with several new 2.5 and 3D architectures, is bringing unprecedented process, process integration and process control challenges in the wafer-level packaging and assembly fabs.
While AI compute platforms, such as GPU, HBM and other accelerators, continue to expand their presence in data centers, the semiconductor technology roadmap must adapt to enable AI edge applications where performance per watt across all compute domains (data center, client and mobile) will be the new performance metric moving forward.
A Semiconductor industry veteran with over three decades of experience in semiconductor manufacturing and capital equipment companies, holding various engineering and leadership positions at Texas Instruments, Micron Technology and KLA Corporation. Frequent keynote speaker at industry events and featured in several technical publications, awarded with VLSI Semiconductor All Star in 2020. Oreste is currently Senior Advisor at KLA, imec, KronosAI, AlixPartners, and ISIG and he serves the board of Aion Silicon and Synergie CAD group as independent director. Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy
Company Profile
Keynote Speaker
Jean-Christophe Eloy, Ph.D.
Chairman
What are the changes of the Semiconductor industry and what can we expected for the next years at market and supply chain level ?
Day 1 / 10:00 - 10:15
The semiconductor industry is changing dramatically with the growth of AI related applications and supply chain, the stabilization of the automotive and industrial applications and the change of the geopolitical environment, without talking about technology changes. The presentation will focus on the opportunities and challenges facing the industrial companies and governments to take benefit of the semiconductor industry.
Jean-Christophe Eloy is Yole Group’s CEO and President. Created in 1998, the market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. His mission is to oversee the strategic direction of Yole Group and the related brands including Yole Intelligence and Yole SystemPlus.
All year long, Jean-Christophe builds deep relationships with leading semiconductor companies, discussing and sharing information across his global network. His aim is to get a comprehensive understanding of their strengths and guide their success.
Jean-Christophe is a graduate from EMLyon Business School (Lyon, France) and has a Ph.D. in Semiconductor Engineering from the National Polytechnic Institute of Grenoble (France).
Company Profile
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
Speaker
Steve Stoffels, Ph.D.
Co-Founder and CEO
Aluvia: Next generation Ultra-high performance AlOx Photonics IC’s for amplication & light guiding
Day 1 / 14:20 - 14:35
Aluminum oxide (AlOx) has emerged as a breakthrough material for photonic integrated circuits (PICs), offering ultra-low propagation loss, wide spectral transparency (UV to mid-IR), high power handling, and rare-earth-ion–based on-chip amplification. As the first company worldwide to commercialize an AlOx PIC platform, Aluvia demonstrates amplification performance approaching high-end fiber amplifiers while maintaining full on-chip integration. . In this presentation, we will introduce Aluvia’s AlOx PIC platform, highlight recent results in amplification and low-loss light guiding, and discuss how these capabilities unlock new applications in quantum computing, advanced telecommunications, LiDAR, AR/VR, and precision sensing. The talk will also outline scaling pathways toward industrial adoption and high-volume manufacturing.
Steve Stoffels is an entrepreneur and technology leader with over 20 years of experience in deep-tech, medtech and integrated photonics. He is CEO and co-founder of Aluvia Photonics, the world’s first company dedicated to aluminum oxide photonic integrated circuits, advancing applications in telecommunications, quantum computing, AR/VR, healthcare, and AI data centers. Previously, he founded and served as CTO of Pulsify Medical, developing wearable ultrasound for continuous organ monitoring. Steve holds a Ph.D. in Electrical Engineering, an M.Sc. in Applied Physics (Magna Cum Laude), and was a visiting scholar at Stanford University. He is inventor on 10+ patents, author of 150+ papers, contributor to the European roadmap for power semiconductors, and a frequent invited speaker.
Company Profile
Aluvia Photonics is a pioneering photonic integrated circuit (PIC) platform provider, built on its proprietary aluminum oxide (Al₂O₃) technology. As the first company worldwide dedicated to Al₂O₃ PICs, Aluvia offers unmatched advantages including ultra-low propagation losses, broad spectral transparency from UV to mid-infrared, high power handling, and on-chip optical amplification. Delivering amplification performance comparable to high-end fiber amplifiers, the Aluvia platform unlocks breakthroughs in quantum computing, advanced telecommunications, and LiDAR, while its wide transparency window also supports AR/VR and precision sensing applications.
Through partnerships with leading foundries, Aluvia ensures scalable, volume manufacturing and provides access to multi-project wafers, dedicated runs, and tailored processes that serve both emerging startups and established global leaders. With its unique material benefits and scalable platform model, Aluvia Photonics is accelerating the adoption of next-generation, high-performance PICs and strengthening Europe’s position at the forefront of integrated photonics.
Aluvia Photonics provides a cutting-edge integrated photonics platform based on our proprietary aluminum oxide (Al₂O₃) technology. Our platform delivers unique advantages including ultra-low propagation losses, broad transparency from the UV to mid-infrared, high power handling, and on-chip optical amplification. These capabilities enable applications ranging from quantum computing and advanced telecommunications to LiDAR, AR/VR, and precision sensing.
To support diverse customer needs, Aluvia offers multiple engagement models. Customers can access our technology through multi-project wafer (MPW) runs, which provide cost-efficient prototyping and early testing. For advanced development, dedicated wafer runs and tailored process modules enable optimization for specific performance requirements and scaling to volume production.
Aluvia also collaborates closely with partners and end-users to accelerate innovation, providing tested dies, design support, and integration guidance. By combining unmatched material benefits with scalable, CMOS-fabrication compatible manufacturing, Aluvia delivers the foundation for next-generation photonic integrated circuits across multiple industries.
Speaker
Ara Philipossian, Ph.D.
Co-Founder, President and CEO
Revolutionizing Silicon Carbide Substrate Polishing via Environmentally-Conscious Slurry and Tool Designs
Day 2 / 17:35 - 17:50
Standard SiC polishing processes employ aggressive, environmentally harmful redox chemistries containing potassium permanganate to achieve acceptable polishing outcomes. Polisher wear and tear caused by such an aggressive chemical remains a significant concern. Instead, we have chosen a two-pronged approach to improve SiC polish. Firstly, we have patented a hydrogen peroxide-based SiC slurry containing alumina nanoparticles and aspartic acid complexes for final polishing. The second approach utilizes a novel polisher that we have designed, are now manufacturing, and are selling worldwide. We call our invention CARE-TEC® or “CAtalyst-Referred Etching Technology”. The technology employs a polymeric pad onto which a catalytic platinum or ruthenium film is sputtered. With pH-adjusted water as the slurry substitute, an electric potential is applied to the SiC substrate and the pad. The principal mechanism of polishing SiC is the continuous etching of the substrate by catalytically converting the top layers of SiC into monolayers of silicon dioxide, which are then removed mechanically (via polishing) at moderate pressures.
Dr. Ara Philipossian has been a professor of Chemical Engineering at the University of Arizona since 2001, where he holds the Koshiyama Chair of Planarization. Since its establishment in 2004, he has also been the Co-Founder, President, and CEO of Araca Incorporated, the premier provider of services and equipment to the polishing and planarization industry worldwide. He received his BS, MS, and PhD in Chemical Engineering from Tufts University in 1983, 1985, and 1992, respectively. From 1992 to 2001, he was the Materials Technology Manager at Intel Corporation (Santa Clara, CA, USA), responsible for the development, characterization, implementation, and sustaining of new and existing CMP and post-CMP cleaning consumables, low-k dielectrics, and electroplating chemicals. From 1986 to 1992, he worked at Digital Equipment Corporation (Hudson, MA, USA) as a process development manager focusing on thermal silicon oxidation, diffusion, LPCVD of dielectric and gate electrodes, and wafer cleaning technology. Dr. Philipossian has authored approximately 180 archival journal publications and 210 conference proceedings articles. He holds 36 patents in semiconductor processing and device fabrication.
Company Profile
Founded in 2004 and headquartered in Tucson, AZ (USA), Araca Inc. provides unique, enabling, and fully customized solutions to our clients in IC planarization and semiconductor polishing for silicon and wide band-gap material applications. Clients include leading IC makers, consumables suppliers, OEMs, universities, and research centers. Our products lower the cost of ownership (COO) of CMP or polishing modules, allowing clients to save money and preserve the environment by reducing slurry and rinse water consumption, increasing pad and diamond disc life, while increasing polisher availability, throughput, and yield.
Our key equipment add-on products, namely, Flucto-CMP®, ESE-100® and the Slurry Injection System (SIS®) are compatible with all polishers. SIS® continues to be rapidly adopted in HVM due to its proven COO and environmental benefits, while Flucto-CMP® is undergoing extensive beta-testing at multiple major OEMs. We provide sensorized and affordable polishers-tribometers and PVA brush scrubbers-tribometers (up to 300 mm wafers), which offer significant reductions in process and consumables characterization costs and R&D expenses. CARE-TEC® is our revolutionary SiC and GaN final polishing system; it requires no slurry or conditioning disc. In our brand-new Class 100 clean room at the University of Arizona, we provide research and foundry services for all sizes and types of substrates. We perform high-quality and highly scientific analytical and functional tests on pads, slurries, conditioners, retaining rings, brushes, and cleaning chemicals. Our pad surface preparation and grooving services are second to none. We develop customized CMP, polishing, and cleaning consumables and processes for various applications, including SiC and GaN, and remain open to co-development programs. We also offer delayering services for 3D NAND and DRAM structures for diagnostics.
Speaker
Sam Bordbar
Sr Account Technical Executive
Powering the Middle East’s Rise in the Global Semiconductor Value Chain with Cadence
Day 2 / 16:55 - 17:10
Sam Bordbar is a Sr Account Technical Executive with nearly three decades of experience shaping the semiconductor and electronic design automation (EDA) landscape. His career spans the full evolution of digital back-end design, from the early days of EDA to today’s advanced multi-die architectures, that gives him a unique view on the industry’s transformation.
As a recognized Implementation Solutions Leader and a key member of the Global Account Management team, Sam has driven strategic partnerships and delivered implementation excellence across Semiconductor, AI, Cloud, and Data Center ecosystems. In his current role at Cadence, he leads business development and strategic initiatives across the Middle East, helping customers on rapidly evolving technology areas.
Sam holds a BS in Electronic and Computer Engineering from the KTH Royal Institute of Technology in Stockholm. His blend of technical depth and practical industry insight, developed over 26 years in EDA, makes him an influential voice in conversations about the future of semiconductor design.
Company Profile
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics.
Speaker
Giorgia Longobardi, Ph.D.
Founder and CEO
Day 1 / 15:00 - 15:15
Dr. Giorgia Longobardi, founder and CEO of Cambridge GaN Devices (CGD), is an accomplished engineer and business leader with nearly two decades of experience in power semiconductors and high-efficiency power electronics. As the inventor of several high-impact patents in GaN power devices, she combines deep technical expertise with strong commercial acumen—one of her greatest strengths.
Driven by curiosity and a passion for making a positive impact, Giorgia founded CGD to bring advanced, energy-efficient power electronics solutions to market. She now leads a diverse team of 60+ employees across Europe, Asia, the US, and Canada. Under her leadership, CGD has raised over $65 million in private and public investment and launched multiple GaN-based power device products into mass production. Her vision includes one day driving an electric vehicle powered by CGD technology and using ICeGaN to help make AI more sustainable by reducing its environmental footprint.
Giorgia serves on the Energy Management Committee of the Power Sources Manufacturers Association (PSMA) and the Advisory Board of the International Semiconductor Industry Group (I.S.I.G.).
Company Profile
A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
Speaker
Oleh Krutko, Ph.D.
Senior Vice President of Design and Systems R&D
European Innovations and Deep Tech Transfers to the Middle East
Day 2 / 16:15 - 16:30
Imec has been driving chip roadmap for over 40 years not only continuously remaining at the forefront of semiconductor technologies, but also building and growing global partnership ecosystem of equipment manufacturers, material suppliers, foundries, EDA companies, and design houses. Exponential growth in demand for computing power driven by AI requires both novel transistor technologies and advanced packaging techniques. Even more global collaboration is necessary to overcome these challenges with Middle East being uniquely positioned to become the next major player.
Oleh Krutko is a Senior Vice President of Design and Systems R&D at imec. In this role, he leads global research and engineering organization responsible for developing systems and circuits IP and solutions as well as managing ASIC volume production operations. Previously he was a General Manager of IC-Link by imec, imec division that offers ASIC solution development and manufacturing services.
Prior to joining imec, Oleh Krutko was a Senior Director of Engineering at AMD, managing Analog and Digital RF organization responsible for developing SOCs and ASICs for wireless infrastructure, defense, aerospace, test, and measurement applications. Previously, he was a Director of Engineering at Qorvo Texas, where he was responsible for RF, millimeter wave, broadband and power product development organization, and RF Design Specialist at Nokia North America R&D, where he was working on high efficiency power amplifiers and transmitters for wireless infrastructure.
Oleh Krutko has PhD in Electrical Engineering from the University of Cincinnati, Ohio, USA. He co-authored 40 journal and conference papers and has 7 patents. Oleh Krutko is a senior member of IEEE and Technical Program Committee member of IEEE RFIC conference.
Company Profile
Imec is a world-leading research and innovation hub in advanced semiconductor technologies. Leveraging its state-of-the-art R&D infrastructure and the expertise of over 6,500 employees, imec drives innovation in semiconductor and system scaling, artificial intelligence, silicon photonics, connectivity, and sensing.
Imec’s advanced research powers breakthroughs across a wide range of industries, including computing, health, automotive, energy, infotainment, industry, agrifood, and security. Through IC-Link, imec guides companies through every step of the chip journey – from initial concept to full-scale manufacturing – delivering customized solutions tailored to meet the most advanced design and production needs.
Imec collaborates with global leaders across the semiconductor value chain, as well as with technology companies, start-ups, academia, and research institutions in Flanders and worldwide. Headquartered in Leuven, Belgium, imec has research facilities in Belgium, across Europe and the USA, and representation on three continents. In 2024, imec reported revenues of €1.034 billion.
Further information on imec can be found at www.imec-int.com.
Speaker
Xiaohang Li, Ph.D.
Associate Professor & Associate Director
Session info not yet published
Prof Li has been the Principal Investigator of the KAUST Advanced Semiconductor Lab in Saudi Arabia since Jan 2016. Also he serves as the Founding Taskforce Chair of Technology Innovation and Entrepreneurship Program and Associate Director of International Innovation Hub at KAUST. He received Ph.D. in Electrical Engineering from Georgia Institute of Technology where he received the Institute’s highest PhD student honor, the Edison Prize. His research focuses on epitaxy, devices, and monolithic integration based on ultrawide bandgap semiconductors for next-generation electronics and photonics. His scholarly output in this area consistently ranks top-3 globally in the last 10 years, including many pioneering results and breakthroughs. A top-2% scientist recognized by Stanford University and Elsevier, he is also a recipient of many prestigious awards from IEEE and other leading organizations and conferences. He has driven many semiconductor initiatives at KAUST and in Saudi Arabia. Also he has consulted and supported many semiconductor projects worth millions to billions of USD globally.
Company Profile
KAUST is a world-class research university in the world. It has ranked No. 1 in the Times Higher Education Arab University Ranking since 2023. In the semiconductor area, KAUST has amassed the largest cluster of top-notched researchers and entrepreneurs in MENA and operated state-of-the-art nanofabrication and characterization facilities. Through research, innovation, entrepreneurship activities as well as numerous alumni it has trained, KAUST has been a pioneer and catalyst of the semiconductor ecosystem in Saudi Arabia and MENA region.
Education, training, research, innovation, entrepreneurship, consulting.
Speaker
Abdullatif Alblowi
Country General Manager of MemryX – Saudi Arabia
Session info not yet published
Abdullatif AlBlowi is a technology and business leader with nearly 20 years of experience at telecommunications, digital transformation, AI and emerging technologies, and semiconductor innovation. As Country General Manager at MemryX Saudi Arabia, he leads the company’s strategic operations, driving the development and deployment of advanced compute-in-memory architectures and AI solutions that enable next-generation digital systems across the Kingdom.
Abdullatif combines deep technical expertise with business acumen, bridging innovation with market execution. He has held leadership roles in global technology companies including Ericsson and Saudi Telecom Company (STC), overseeing large-scale technology projects, AI adoption, and digital transformation initiatives.
Passionate about shaping future-ready ecosystems, Abdullatif focuses on leveraging AI, semiconductors, and data-driven strategies to accelerate digital transformation, foster innovation, and create sustainable business growth, contributing to Saudi Arabia’s Vision 2030 and its ambition to become a regional and global hub for advanced technologies.
Company Profile
MemryX, Inc. (memryx.com) is a leading company in AI and semiconductor chips, headquartered in Ann Arbor, Michigan, with branches in Taipei, Hsinchu, Taiwan, and Saudi Arabia. MemryX develops high-performance AI accelerator chips that deliver server-level performance and precision at low power and cost, making them perfectly suited for Edge AI applications including autonomous driving, robotics, machine vision, and other advanced AI-driven solutions.
Speaker
Mohammed Tmimi, Ph.D.
Founder, Principal Analyst
From Fragmentation to Advantage: The Role of M&A in Semiconductor Value Creation
Day 1 / 12:10 - 12:30
The Fabless industry is structurally concentrated but still strategically fragmented. This talk explains where value, power, and bottlenecks really sit across the semiconductor chain, and how today’s valuation environment is reshaping M&A versus organic growth. Using recent “wins” and costly misses, it shows when deals actually create advantage and when they just burn capital. Finally, it outlines a practical M&A playbook for Middle East investors and corporates seeking to build credible semiconductor positions without overpaying for hype.
Dr Mohammed Tmimi is the Founder and Principal Analyst of NANOCHIPS Consulting, a Paris-based advisory firm focused on semiconductors and deep-tech markets. He earned his PhD while working on mmWave on-chip interconnects at STMicroelectronics. Mohammed previously worked in market intelligence at Yole Intelligence and later in Corporate Development and Corporate Venture Capital at AAC Technologies, where he evaluated M&A and partnership opportunities across multiple semiconductor verticals outside China. This combined technical and financial background enables him to bridge advanced technology, market dynamics and investment decisions.
Company Profile
At Nanochips Consulting
Our expertise spans from high-frequency semiconductor design to deeptech market analysis, offering bespoke services in market research, strategic planning, and due diligence.
We empower investors and companies in the semiconductor and telecom sectors with strategic insights and advanced market intelligence.
Your Partner in Navigating Market Dynamics and Advancing Technological Innovation.
Our services include the following key areas to support your growth and success. If you have additional needs in mind, please reach out to discuss how we can assist.
Market Research and Analysis
Conduct specialized market research to identify trends, niche markets, and opportunities for differentiation, providing in-depth data beyond standard $xB TAM/SAM metrics.
Track technological and market shifts to stay ahead of disruptions.
Develop and refine go-to-market strategies, including positioning, pricing, and channel selection, to accelerate market entry and growth.
Support product/market fit validation, e.g., through customer insights and feedback.
Identify key players in complementary or competitive technologies.
Strategic Planning and Business development support
Develop and refine company strategy and create compelling, data-driven story/pitch decks for value creation scenarios.
Support growth strategy execution, including market entry and expansion.
Identify and recommend strategic partnerships (academia, startups, industry) aligned with technological capabilities and future needs/roadmap.
Advise on M&A and strategic investments to strengthen market position and create synergies.
Assess acquihiring opportunities to acquire key talent, innovative technologies and capabilities.
For Investors
Identify high-potential investment opportunities, including niche and emerging markets, particularly in deep tech, Semiconductor, RF, imaging, and related sectors.
Conduct pre-due diligence and comprehensive evaluations on potential targets, assessing strategic alignment, market potential, and competitive positioning.
Evaluate technology roadmaps of potential targets to ensure alignment with emerging industry trends and investor goals.
Advise on growth, expansion, and integration strategies for portfolio companies to maximize synergies and operational efficiency.
Speaker
Ole Gerkensmeyer
VP EMEA Sales
Joint Case Study: Powering Electronics with Active and Passive Devices
Day 2 / 09:35 - 09:55
Ole Gerkensmeyer is VP Sales EMEA at Nexperia, a leading semiconductor manufacturer for essential and power semiconductors. He started his semiconductor career over 25y ago with Texas Instruments, where he held several management positions over his 17year tenure. He then became General Manager of Future Electronics’ distribution business in Central Europe. Most recently, he spend over 5 years with Wolfspeed, where he not only led their EMEA Automotive business but also was influencial in establishing corporate business development projects. – Next to Nexperia, Ole is also active as an advisory board member at the world’s power electronics conference: PCIM. His interest is focussed on semiconductor business growth as well as power electronics.
Company Profile
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Speaker
Eric Aguilar
Chief Executive Officer
The World’s Most Powerful Micromachine
Day 2 / 10:00 - 10:15
An award-winning entrepreneur, Eric Aguilar is a visionary leader in the field of advanced sensor systems for complex systems, such as robotics and autonomous platforms.
Throughout his distinguished two-decade career, Eric’s passion for sensor design and innovation has made him a key player in the industry. His expertise includes leading teams at renowned companies such as Tesla, where he managed a crew of 300 engineers on the firmware for Model 3, and at X, where he spearheaded the development of Google Project Wing, an autonomous drone delivery service.
Eric’s expertise in sensor integration includes leadership positions at autonomous vehicle and robotics companies. His role in steering product development for a sensor company later acquired by Google — as well as for his pioneering work building sensors for drones at US Navy Research Labs — further showcases his depth of experience.
Eric earned a BS in Electrical Engineering from California State Polytechnic University and has pursued advanced studies in Electrical and Electronics Engineering at the University of Southern California. His work continues to shape the future of MEMS and sensor technology, making him a sought-after thought leader and speaker in the field.
Company Profile
Omnitron Sensors is rewriting the script on building high-performance low-cost sensors for the world of tomorrow. Leveraging its executive team’s extensive experience designing, fabricating, and using MEMS sensors, Omnitron has developed a “new topology for MEMS” that addresses some of the most pressing pain points in MEMS manufacturing.
Featuring the clever arrangement of silicon process steps and a new packaging method, Omnitron’s topology significantly improves performance to produce robust, rugged, reliable, repeatable, and low-cost MEMS sensors in high volumes by leveraging commercial MEMS foundries.
The company’s first proof point of its new topology for MEMS is a large, robust, low-cost, MEMS scanning mirror for long-range LiDAR.
Speaker
Karim Hamzaoui
VP of Global Business Development
An AI-Semiconductor Nexus: Custom 3D-Stacked Memory & Accelerated Materials Discovery
Day 2 / 16:35 - 16:50
For the past decade, Preferred Networks has been at the forefront of co-creating physical AI solutions with industry-leading companies in Japan, while designing a novel AI ASIC series focused on energy-efficient compute to power the wider, unprecedented growth of AI-based applications. In this talk, we will explore An AI-Semiconductor Nexus—a synergistic acceleration driven by specialized generative AI ASICs and AI-based material discovery—as a key driving force for future industrial scalability. We will first examine how Custom 3D-Stacked DRAM Architectures can deliver the desperately needed memory bandwidth to sustain the massive throughput required by the shift toward longer context in AI agent applications. We will then look at the transformative potential of Accelerated Materials Discovery, where AI-driven workflows are drastically compressing the R&D timeline. This ensures that innovations in the physical hardware foundation can keep pace with the continued exponential growth of AI and its industrial applications.
Thank you again for all your support and arrangements, and sorry for all your trouble.Very much looking forward to meeting everyone at the event tomorrow.
Karim Hamzaoui is the Vice President of Global Business Development at Preferred Networks, a leading AI unicorn in Japan advancing technologies from custom AI ASICs to fully integrated industrial solutions.
Karim began his career at IBM Japan’s Software R&D Laboratory as an engineer and later strategist, where he developed a strong passion for creating business value through deep-tech innovation. Since joining Preferred Networks, Karim has led a broad portfolio of industrial AI initiatives—from early-stage R&D to commercialization—across domains such as cancer diagnostics, autonomous driving, plant automation, materials discovery, and generative AI foundation models. He now oversees the company’s global go-to-market strategy and partnerships.
Outside his professional roles, Karim is a founding and current board member of the Moroccan Business Club in Japan (MBC-J), an NPO dedicated to strengthening economic and cultural ties between Morocco and Japan.
Company Profile
Preferred Networks (PFN) is a leading Japanese AI technology company known for its vertically integrated development of cutting-edge technologies—from custom AI chips, generative AI foundation models to real-world AI solutions and products. PFN plays a key role in advancing Japan’s AI sovereignty and has earned a strong domestic reputation. PFN’s AI solutions span across diverse industries including manufacturing, materials, energy, pharmaceuticals, healthcare, finance, retail, and entertainment. The company is currently developing a novel AI inference chip, leveraging its highly energy-efficient MN-Core™ logic and a new memory technology, with a release targeted for early 2027.
Preferred Networks (PFN) develops cutting-edge technologies across the AI value chain from semiconductors, supercomputers, generative AI foundation models to AI solutions and products:
MN-Core™ — a series of highly energy-efficient AI chips, which made a debut topping the Green500 list of the world’s most energy-efficient supercomputers three times in 2020/21. PFN is currently developing a new line of MN-Core chips focused on AI inference, set for release in early 2027.
Preferred Computing Platform™ (PFCP™︎) — a cloud-based service that provides users with access to the computing power of MN-Core 2. PFN has also announced a joint venture with Mitsubishi Corporation and IIJ aiming to launch an MN-Core™-based IaaS commercial service in 2026.
PLaMo™ — a series of Large Language Models developed fully from scratch by PFN, delivering top-tier performance in Japanese-language capabilities. These models power a wide range of AI applications in sectors such as finance, healthcare, and the public sector.
Matlantis™ — a cloud-based, high-speed universal atomistic simulator. Powered by a machine learning interatomic potential (MLIP), Matlantis significantly accelerates the simulation workflow in new materials discovery across industries such as semiconductor, automotive, and energy, by bypassing traditional heavy electronic state calculations.
Speaker
Ahmad Alfaifi, Ph.D.
Senior Expert
Building the Semiconductor Innovation Ecosystem in Saudi Arabia
Day 2 / 14:40 - 14:55
Experienced semiconductor expert with 15+ years in chip design, fabrication, and process optimization. Passionate about localizing Saudi Arabia’s semiconductor industry through talent training and technology development. Proactively stays updated on industry changes to predict future trends, leveraging technical leadership, analytical skills, and extensive R&D and industry engagement.
Company Profile
Speaker
Ahmer Syed
VP Operations
Qualcomm – Leading Technological Transformation
Day 1 / 11:45 - 12:05
This presentation will showcase Qualcomm’s innovations in Mobile, PC, Auto, XR, and AI and how these technologies are helping transform the middle east in collaboration with Saudi Arabia and UAE based companies
Ahmer Syed is VP, Operations at Qualcomm, heading sourcing operations for Packaging and Test services. He leads the team in supplier relations, capacity investments, supply assurance, and cost optimization and drives supply chain expansion – identifying, selecting, and bringing-up new OSAT and substrate suppliers for capacity assurance.
Prior to his current role, Ahmer led the Package Engineering team at Qualcomm for 8 years in developing and deploying new packaging technologies such as PoP, FOWLP, 600x600mm panel level packaging, SiP, and 2.5D and 3D advanced RDL based interposer technology.
Before joining Qualcomm in 2013, Ahmer worked at Amkor Technology for 16 years, supporting advance packaging development with Simulations, Mechanical and Reliability Testing, and Applications Engineering.
Ahmer has authored over 70 technical papers and articles on packaging and interconnects performance and reliability and has delivered numerous Keynotes at International Conferences.
Company Profile
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Speaker
Abdullah Alshehri, Ph.D.
Business Development Unit Manager
Transforming Challenges into Opportunities: The Journey of the First Saudi Fab
Day 2 / 11:45 - 12:00
When we first set out to build Saudi Arabia’s first semiconductor fab, we faced significant challenges: limited supply chains, a shortage of local talent, and few academic programs in the field. But rather than seeing these as obstacles, we saw them as opportunities. We partnered with universities to develop new programs, provide training and internships, and build the skills needed for a thriving semiconductor workforce. Today, our company is not only helping shape a robust local ecosystem but also serving as the bridge between international technology leaders and the Kingdom, driving innovation and empowering the next generation of talent.
Dr. Abdullah earned his undergraduate degree from the University of Brighton and pursued both his Master’s and PhD at King Abdullah University of Science and Technology (KAUST), specializing in circuit design and developing low-power, high-performance ASICs for MEMS sensors. He is currently an Assistant Professor at Umm Al Qura University and serves on the KAUST Saudi Alumni Executive Committee. Dr. Abdullah has authored and co-authored more than 10 research papers, co-founded TRYSL Tech and DeepCARES, and leads the Business Development Unit at the Saudi Electronics Material Company, with professional experience collaborating with Aramco, STC, and Cadence.
Company Profile
The Saudi Electronic Materials Company (SEMC) is a pioneering semiconductor company driving innovation across Saudi Arabia, the MENA region, and beyond. With expertise in MEMS and infrared (IR) technologies, we deliver end-to-end solutions covering design, fabrication, packaging, and testing.
Equipped with a state-of-the-art cleanroom and advanced facilities, SEMC works alongside leading global research institutions and equipment providers to shape the next generation of semiconductor technologies that support national priorities and meet international standards.
Guided by Saudi Vision 2030, we are building a sustainable semiconductor ecosystem that fuels innovation, accelerates industrial growth, and strengthens the Kingdom’s role as a competitive force in the global semiconductor industry.
Our Services:At SEMC, we combine advanced expertise and cutting-edge facilities to deliver end-to-end semiconductor services for industries, scientists, and researchers. From concept to finished device, our capabilities cover the full value chain:– Design & SimulationProviding advanced design services through EDA, Multiphysics, and process simulations (TCAD) to accelerate innovation and reduce development risks.– FabricationUtilizing our state-of-the-art cleanroom for semiconductor processing, including lithography, etching (wet & dry), thin film deposition, implantation and furnace operations to produce high-quality IC and MEMS devices.– Packaging & AssemblyOffering complete packaging solutions — from dicing, die bonding, wire bonding, sealing, and wafer bonding, ensuring performance, reliability and scalability.– Testing & CharacterizationDelivering robust validation and performance testing, including wafer- and package-level measurements, noise, and vibration tests, as well as nano-scale analysis using SEM, TEM, FIB, EDX, and MSA.– R&D SolutionsPartnering with industries and researchers to co-develop and customize solutions that address both national and global technological demands.
Speaker
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Day 2 / 15:55 - 16:10
Dr. Mohssen Moridi is an expert in microtechnology with over 20 years of experience in the development of MEMS devices. He holds a Master’s and Ph.D. in Microtechnology from École Polytechnique Fédérale de Lausanne (EPFL), Switzerland. After completing his doctoral studies, he held various research positions in Switzerland, contributing to advancements in microsystems technology. In 2016, he moved to Austria to lead the Microsystem Division at CTR AG, where he established a MEMS department and managed the development of a new cleanroom dedicated to industrial R&D. Since 2019, he has been part of Silicon Austria Labs (SAL) and currently serves as Senior Executive Director and Head of the Microsystems Research Division. In this role, he leads a team of over 60 researchers, driving innovation in thin-film technologies, integrated photonics, and magnetic and piezoelectric microsystems. With extensive experience at the intersection of research and industry, Dr. Moridi plays a key role in shaping cutting-edge microsystem technologies, bridging fundamental research with industrial applications.
Company Profile
Silicon Austria Labs (SAL) has been founded to be a top European research center for electronic-based systems. In the network of science and economy, we carry out research at a global level and create the basis of groundbreaking products and processes.
Speaker
Aly Mashaly
Founder & CEO
Wide Bandgap Semiconductors: The Catalyst of the Next Energy Revolution
Day 1 / 14:40 - 14:55
Wide Bandgap (WBG) semiconductors such as SiC and GaN are redefining the limits of power conversion efficiency and system performance. As global demand for electrification, renewable integration, and AI-driven infrastructure accelerates, WBG devices are becoming the catalyst of the next energy revolution. This presentation explores how advanced materials and smart system integration enable unprecedented efficiency gains, reduced carbon footprint, and scalable energy solutions — from electric mobility to hyperscale data centers. Verotera’s innovative approach bridges material science, system design, and AI-driven optimization to power a smarter, cleaner, and more sustainable future.
Aly Mashaly is the Founder and CEO of Verotera, a German company pioneering next-generation power semiconductor technologies. With over 20 years of experience in power electronics, Aly is a renowned expert in power electronic systems and semiconductors. He holds several patents in the field and is a keynote speaker at numerous international conferences.
Aly earned his degree in Electrical Engineering with a focus on Power Electronics from Ain Shams University in Cairo and moved to Germany in 2002 to pursue his master’s degree at the University of Hanover.
He began his career pioneering the development of power electronic systems for avionic applications before focusing on advancing power electronics for electric mobility. In his most recent role as Technical Director at ROHM Semiconductor Europe, he played a key role in driving the company’s vision to become a global leader in power devices and contributed to growing the business through multi-billion-dollar projects.
Company Profile
Verotera is a German startup and a next-generation semiconductor company driven by deep system-level expertise and a vision for a smarter, cleaner world. Our team brings hands-on experience in inverter development, semiconductor design, and real-world system integration. We operate across the full stack — from chip physics to complete systems — designing technologies that address the actual needs and constraints of modern applications.
This unique positioning allows us to reduce integration costs, accelerate design cycles, and deliver higher system efficiency. With strong industry networks and credibility in both the OEM and semiconductor domains, we bridge the gap between demand and innovation — enabling faster validation, strategic partnerships, and more effective go-to- market execution.
Please visit Verotera’s website for more information: www.verotera.com
Speaker
Sherin Ahmed El-Badry Sadek, Ph.D.
Strategic Partnership Manager
Joint Case Study: Powering Electronics with Active and Passive Devices
Day 2 / 09:35 - 09:55
Dr. Sherin Ahmed El-Badry Sadek is a multilingual expert in international relations and strategic partnerships, currently Strategic Partnership Manager EMEA at Würth Elektronik in Munich. She holds a Ph.D. in Educational Sciences and a Master’s in Advanced European and International Studies. Her career emphasizes engagement with the Middle East, including leading partnership development for a new Egyptian-European University in Cairo and diplomatic roles in Berlin and Qatar. Dr. Sadek’s experience in building institutional alliances, driving innovation projects, and her proficiency in seven languages enable her to operate effectively in complex, intercultural environments.
Company Profile
Würth Elektronik eiSos Group is a manufacturer of electronic and electromechanical components for the electronics industry and a technology company that spearheads pioneering electronic solutions. Würth Elektronik eiSos is one of the largest European manufacturers of passive components and is active in 50 countries. Production sites in Europe, Asia and North America supply a growing number of customers worldwide.
The product range includes passive components, power modules, digital isolators, optoelectronics, electromechanical components, thermal management solutions, sensors and wireless modules. The portfolio is rounded off by customer-specific solutions.
The unrivaled service orientation of the company is characterized by the availability of all catalog components from stock without minimum order quantity, free samples and extensive support through technical sales staff and selection tools.
Würth Elektronik is part of the Würth Group, the global market leader in the development, production, and sale of fastening and assembly materials, and employs around 7,500 people. In 2024, the Würth Elektronik Group generated sales of 1.02 Billion Euro.
Würth Elektronik: more than you expect! Further information at www.we-online.com
Speaker
Behrooz Abdi
Chief Executive Officer
Building an Essential Sensor for Next Generation Physical AI
Day 2 / 12:25 - 12:40
Physical AI, such as robots, rely on high precision sensors and sensor fusion, such as cameras, microphones, inertial sensors, and more recently, 3D imaging sensors such as LiDARs. High resolution imaging radars deliver non-line-of-sight visibility to next generation of autonomous robots, industrial machines, and remote monitoring systems, enabling them to see clearly in the dark, through dust, fog, and smoke.
Zadar Labs Software Defined Imaging Radars combine unprecedented range and resolution performance with rich meta-data in every point cloud, enabling next generation of physical AI to process the information with extreme low latency for realtime action. Field reconfigurability is performed by changing hundreds of parameters in a matter of milliseconds.
Finally, Zadar Labs has taken a CapEx lite approach to system development, focusing on optimum waveform design and signal processing. By building a single platform based on multiple silicon suppliers, the business is able scale efficiently across multiple verticals and applications.
Behrooz is an executive and investor, leading several companies to exits, creating billions of dollars of value for investors.
He is currently the CEO of Zadar Labs, a Silicon Valley based company developing Imaging Radars.
Throughout his career in the semiconductor industry, Behrooz has led many transformations, including creating a world leading provider of intelligent sensors at InvenSense, leading the first wave of multi-core date-plane processors at RMI/NetLogic, driving a multi-foundry platform at Qualcomm, and RF miniaturization at Motorola.
Behrooz holds a MSEE from Georgia Tech and holds over 20 patents in semiconductor circuits, systems, software, and sensors.
Company Profile
Zadar Labs is a leader in high performance 4D imaging radar technology for safety and security in the mobility and infrastructure markets. Zadar’s disruptive imaging radars are being utilized by many leading OEMs and system integrators to deliver unprecedented high resolution and all weather clear vision, in markets such as agriculture and mining, autonomous mobile robots, traffic monitoring, transportation and logistics, and security. Zadar Labs is headquartered in Silicon Valley.
Zadar Labs ship Software Defined Imaging Radar (SDIR) devices in a number of form factors and connectivity options such as automotive ethernet and POE.
Zadar’s imaging radars are field configurable for multiple applications and can output raw data such as 4D+ point clouds, information such as distance/elevation/velocity, or higher level object classification, such as human detection, crowd heat map, automobile and truck detections and tracking information, etc.
Zadar Labs products come in different sizes, typically smaller than 10cm on a side, and consume 3W-18W of power depending on performance needed.
Speaker
Kamel Ait Mahiout
President & CEO
Electrification, Sustainable Smart Infrastructure
Day 2 / 17:15 - 17:30
Over 35 years in Semiconductor and high-tech industry,
President & CEO ZCE Group Energy Innovation & Decarbonation
President & CEO Novasensing, Neuromorphic ML/AI Edge AI company
President of International Semiconductor Executive Summits as of end on June 2024.
ATLANT3D as a CCO, ALD Process direct deposition,
Worked at Applied Material on the advance packaging corporate business on Hybrid bonding Cluster, Digital Lithography and Metrology & Inspection.
Prior to AMAT he served as CEO of Unity SC, inspection, and Metrology company where he reengineered the company from the product and organization to alignment with tiers 1 customers,
Prior to Unity, Kamel Served Amkor Technology as a President and General manager for Europe & Singapore over 18 years aligning and growing the company with European key players and starts up.
Started in the industry over 35 years ago as RF and Microwave R&D Engineer designing product & Modules for Aerospace, Military, and telecom markets, then served managing internal and external Operations Front end and Back end.
Kamel holds a Bachelor in Electronics from University HB in Algeria and a master’s in electronic from Reims University France.
Company Profile
WATTELZCE® by ZCE
Registered Trademark | BPI Deeptech | JEI (Jeune Entreprise Innovante)
Patented Technological Solutions: FR2508679, FR2510175
About Us
WATTELZCE® by ZCE is a pioneering Deeptech company recognized by BPI France for its breakthrough innovations in sustainable energy and electric mobility. As a JEI (Young Innovative Company), we are committed to developing smart, secure, and shareable charging infrastructure designed to make electric mobility accessible to all.
Our patented solutions and connected ecosystem bridge the gap between technology, sustainability, and accessibility — turning every power outlet into a smart charging station
Vision
To become the “AirBnB of electric charging,” transforming every outlet into a smart, secure, and sharable charging station.
Mission
To make electric mobility accessible, convenient, reliable, and equitable everywhere, while reducing carbon emissions and promoting clean energy adoption.
Our EcosystemThe WATTELZCE ApplicationA unique mobile platform designed to:• Create a friendly charging experience by connecting users to points of interest and service providers.• Enable private energy trading through WATT (energy) and ELSE (services) modules.Results in:• The expansion of domestic EV charger and electric outlet networks.• The growth of community-based energy sharing and local business services.Promotes:1. Electrical mobility adoption2. Energy equality3. Job and business creationOur Product LineEV Charging Solutions• 7 kW Domestic Charger• Hybrid Single-Phase/Solar In 22 kW Output• WattelWALL Infrastructure – a modular, smart, and connected wall plug for EV charging• WattelGo – portable, flexible, and user-friendly charging solutions for e-mobility
Panel Moderator
Nitin Dahad
Editor-in-Chief
Panel Discussion: Powering MENA’s High-Tech Future: Investment Pathways & Partnerships
Day 1 / 16:35 - 17:20
Nitin Dahad is Editor-in-Chief of EE Times, covering the global semiconductor and electronics industry. An electronic engineering graduate from City University, London, U.K., he started his career as an engineer at National Semiconductor, and then in his 40+ year career he’s had roles as journalist, entrepreneur, mentor, and government advisor. His key achievements include being part of ARC International’s startup team that took it to the U.S. market, and also to IPO; and he co-founded one of the early publications serving the electronics industry startup scene in the early 2000s, called The Chilli. Nitin has also worked with many electronics and fabless companies, including GEC Plessey Semiconductors, Dialog Semiconductor, Marconi Instruments, Coresonic, Center for Integrated Photonics, IDENT Technology and Jennic. Nitin also held a role with government promoting U.K. technology globally in the U.S., Brazil, Middle East and Africa, and India. In other areas, he has served on the board of governors of two universities in the U.K., plus the boards of regional development agencies. In addition, he is also a mentor on the London Business School Entrepreneurship Summer School program.
Company Profile
Panel Moderator
Tong Wu, Ph.D.
Leader of China Automotive Solution Team
Panel Discussion: China-Middle East Semiconductor Supply Chain Complementarity: From Technology Export to Localized Collaboration
Day 2 / 13:50 - 14:35
Dr. Tong Wu is leading the onsemi Automotive Application and Marketing team in China. He graduated from Shanghai Jiao Tong University with a bachelor in Semiconductor Physics, minoring in Mathematics, and holds a Ph.D. in Electrical Engineering from the University of Tennessee, USA. Dr. Wu has over 10 years of R&D and industrial experience in semiconductor packaging and the design and application of silicon carbide.
He is now responsible for automotive technology engagement in China, covering from product definition, manufacturing, marketing, to system applications. He maintains in-depth cooperation with multiple automotive OEMs and Tier 1 suppliers.
Dr. Wu previously worked at the Oak Ridge National Laboratory (ORNL) in Oak Ridge, Tennessee, USA, and also with solid industrial R&D backgrounds. He has published more than 40 papers in international conferences and journals and has also been granted multiple US patents in the field of semiconductors.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Panelist
Xiaoming Wu
Chief Executive Officer
Panel Discussion: China-Middle East Semiconductor Supply Chain Complementarity: From Technology Export to Localized Collaboration
Day 2 / 13:50 - 14:35
Company Profile
Panelist
Dominique Reverdy
Director of Investments
Panel Discussion: Powering MENA’s High-Tech Future: Investment Pathways & Partnerships
Day 1 / 16:35 - 17:20
Seasoned ICT M&A professional leading the Investments for Ithca, branch of the Omani Sovereign Fund OIA, focussed on emerging tech.
Company Profile
ITHCA Group (formerly knows as Oman Information and Communication Technology Group) was established in 2019 to play a key role in ensuring that the investments focus on supporting the technologies of the 4th industrial revolution as well as investing in the necessary infrastructure to achieve this goal. Soon after its inception, ITHCA integrated companies like Oman Broadband, Oman Technology Fund, Oman Towers and Space Communications Technology under its umbrella. After obtaining the approval for the Group’s Strategy in the same year, ITHCA signed in for strategic investment in 2020 with Oracle for building a complete cloud services system as well as with Onsor Technologies. 2021 saw the official launch of Withaq Services, which was basically centralizing the support services.
The core functionalities of ITHCA are to actively work on building Oman’s IT infrastructures, up-scale its networks and enhance Oman’s digital capabilities. Guided by the dictum of accelerate, integrate and centralize, ITHCA would scale up data center/cloud facilities, build up cybersecurity infrastructure, enhance centralized digital capabilities and expand hub for telecom interconnections.
Panelist
Weiping (Bill) Li, Ph.D.
Former CEO and Founder of Yibu Semiconductor
Panel Discussion: China-Middle East Semiconductor Supply Chain Complementarity: From Technology Export to Localized Collaboration
Day 2 / 13:50 - 14:35
Weiping Li is a seasoned executive in the semiconductor and IT industry with vast experience both in the US and China. He founded Yibu Semiconductor in 2020 that pioneered Si bridge chiplet packaging in China. Prior to that, he served as the Senior Vice President with Unigroup and was the Chairman of the Board of its subsidiary, Unimos. He was Vice President of Jiangsu Changjiang Electronics Technolgy (JCET) for 8 years before Unigroup. He also worked in the US at Amkor, Motorola SPS and Delphi Delco in R&D and product management roles.
Weiping Li held a Ph.D. degree from Georgia Institute of Technology in Materials Science and Engineering. He received the “Extinguished Alumni in Engineering Award” from the same school in 2012. He has over one hundred of patents and numerous technical and industrial publications/talks in electronics packaging.
Company Profile
Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.
Panelist
Raghu Panicker
Chief Executive Officer
Panel Discussion: Powering MENA’s High-Tech Future: Investment Pathways & Partnerships
Day 1 / 16:35 - 17:20
•An Electronics and Communication engineer, self-motivated and business professional with over 35 years of experience across industries, cross cultures in various roles & responsibilities and multi-geographic locations.
•Raghu started his career from Semiconductor Complex Ltd.,(SCL, a govt Fab) in 1991 for 10years as R&D engineer. Then as Country Manger for Mentor Graphics (now Siemens EDA) for 20years. Before Kaynes, Raghu was with Tessolve Semiconductor for 3years running the APAC business.
Company Profile
Kaynes Semicon Private Limited, a proud subsidiary of Kaynes Technology India Limited, is leading the charge in India’s semiconductor revolution. With over 35 years of expertise in end-to-end electronics manufacturing services, Kaynes Technology has built a legacy of innovation, quality, and excellence.
Kaynes Semicon marks a historic milestone as the first company in India to package semiconductor chips, a breakthrough that significantly enhances the nation’s capabilities in advanced electronics and manufacturing.
As India accelerates towards self-reliance in the semiconductor sector, in alignment with the Make in India and Atmanirbhar Bharat initiatives, Kaynes Semicon is positioned at the forefront of innovation. With state-of-the-art facilities and a future-focused vision, we are set to transform the semiconductor packaging and testing ecosystem, driving India’s emergence as a global hub in semiconductor technology.
Panelist
Bingan Chen, Ph.D.
Chief Executive Officer
Panel Discussion: China-Middle East Semiconductor Supply Chain Complementarity: From Technology Export to Localized Collaboration
Day 2 / 13:50 - 14:35
Company Profile
Naso Tech founded in 2018, has been focused on designing and manufacturing high-end equipment for advanced materials. Our core team members are from University of Cambridge and well- known industry firms, who bring strong and wealth of expertise to the company.
We are experienced in the field of advanced semiconductor manufacturing equipment, including chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), Atomic Layer Deposition(ALD) and ETCH(etching).
CVD:NASO TECH’s SiC Epitaxial Reactor is a specialized equipment designed for the epitaxial layer growth—a core process in silicon carbide chip production. This step is critical for manufacturing diodes and power semiconductor devices.
PVD:NASO TECH’s PVD Equipment primarily deposits various metallic and non-metallic thin films on wafer surfaces during semiconductor fabrication. It plays a key role in forming essential conductive pathways, electrode contacts, and protective barriers or integrated circuits.
ALD:NASO TECH’s ALD System is used in perovskite solar cell manufacturing for depositing high-quality functional layers with extreme uniformity and conformity—such as electron transport layers (ETL) and interface passivation layers. It addresses critical challenges in cell stability and efficienc.
Speaker
Ayman Sejiny
Fund General Partner
Day 1 / 16:15 - 16:30
Ayman Sejiny is a distinguished leader in Islamic finance and corporate banking with over 22 years of experience.
• Currently serves as Chairman of Apex Saudi Arabia, Dar Al-Aila, and Tarh, leading significant investment and financial services firms focused on sustainable growth and innovation.
• Successfully structured and signed deals responsible for USD 20 billion in sukuk finance and USD 100 billion in lending and credit, demonstrating his expertise in large-scale Islamic and corporate finance.
• From 2018 to 2022, he was CEO of the Islamic Corporation for the Development of the Private Sector (ICD) n the rank of Excellency, where he spearheaded projects aimed at fostering competition, entrepreneurship, employment, and export potential across Islamic finance markets.
• Prior to ICD, he was CEO at Ibdar Bank and Alkhair Bank, overseeing strategic business areas including Corporate and Investment Banking and Private Banking.
• Held senior leadership roles at major international banks including Barclays Capital Saudi Arabia as Board Member and CEO, managing Barclays Capital, Barclays Wealth, and Barclays Sales and Treasury divisions.
• Served as Chairman and Board Member in various companies across sectors and geographies, including Open Silicone, Inc. (semiconductors, USA), Bahrain Financing Company Group Holdings (foreign exchange and remittance), Al-Khair Capital Menkul and Al-Khair Portfoy Yonetimi in Turkey (asset management and brokerage), and Al-Khair International Islamic Bank in Malaysia.
• Brings over 22 years of corporate and investment banking experience with global institutions such as Barclays, Citi, and ABN Amro. Educated in finance at Eastern Michigan University, he combines deep expertise with visionary leadership to drive innovation and growth in global markets.
Company Profile
Panelist
Jianhui Wang
Founding Partner
Panel Discussion: Powering MENA’s High-Tech Future: Investment Pathways & Partnerships
Day 1 / 16:35 - 17:20
A venture capitalist focusing on semiconductor and electronics industry investment. He has over 15 years of investment and entrepreneurial experience, including various positions at Fosun Capital and ZTE Ventures. He has studied at Huazhong University of Science and Technology in China, the Autonomous University of Barcelona in Spain, and the University of Konstanz in Germany.Wang Jianhui serves on the Shenzhen Stock Exchange Science and Technology Investment Advisory Committee, Guangdong Provincial Pan-Semiconductor Industry Financial Experts Committee and the Mentor for the Huazhong University of Science and Technology Global Alumni Innovation and Entrepreneurship Competition. He is awarded “Best Investor of the Year,” and “Best Early-Stage Investor of the Year” by Jiwei.com. and “Best Young Investor in China’s Equity Investment Industry” by Chinese Venture.
A venture capitalist focusing on semiconductor and electronics industry investment. He has over 15 years of investment and entrepreneurial experience, including various positions at Fosun Capital and ZTE Ventures. He has studied at Huazhong University of Science and Technology in China, the Autonomous University of Barcelona in Spain, and the University of Konstanz in Germany.
Wang Jianhui serves on the Shenzhen Stock Exchange Science and Technology Investment Advisory Committee, Guangdong Provincial Pan-Semiconductor Industry Financial Experts Committee and the Mentor for the Huazhong University of Science and Technology Global Alumni Innovation and Entrepreneurship Competition. He is awarded “Best Investor of the Year,” and “Best Early-Stage Investor of the Year” by Jiwei.com. and “Best Young Investor in China’s Equity Investment Industry” by Chinese Venture.
Company Profile
South China Venture Capital (SCVC) is a venture capital company, which manages RMB 5 billion and USD 100 million in assets. SCVC has invested in nearly 100 companies across the globe, including China, Singapore, the United States, Japan, and others.It has been awarded “Best Investment Institution in China,” “Best Early-Stage Investment Institution in China,” “Best Investment Institution in the Industry (Equipment and Materials) of the Year,” by Jiwei.com. and “Best Early-Stage Venture Capital Institution in China” by China Venture.
South China Venture Capital (SCVC) is a venture capital company, which manages RMB 5 billion and USD 100 million in assets. SCVC has invested in nearly 100 companies across the globe, including China, Singapore, the United States, Japan, and others.
It has been awarded “Best Investment Institution in China,” “Best Early-Stage Investment Institution in China,” “Best Investment Institution in the Industry (Equipment and Materials) of the Year,” by Jiwei.com. and “Best Early-Stage Venture Capital Institution in China” by China Venture.
Panelist
Allan Zhou, Ph.D.
Senior Executive Advisor
Panel Discussion: China-Middle East Semiconductor Supply Chain Complementarity: From Technology Export to Localized Collaboration
Day 2 / 13:50 - 14:35
Allan Zhou holds a Ph.D. in Chemistry and Materials Science from the University of Connecticut, USA.
He has served as CEO of Shanghai GTA Semiconductor Co., Ltd., Professor at Fudan University, Distinguished Professor and Adjunct Dean of the School of Excellence in Engineering at Shanghai Dian Ji University, Senior R&D Scientist at Applied Materials Inc. (USA), as well as Senior R&D Manager, Fab Director of Large-Scale Manufacturing, and Senior Director of the Operations Center at Semiconductor Manufacturing International Corporation (SMIC).
With extensive expertise in the engineering principles and methodologies of large-scale production for semiconductor micro-nano devices, he has dedicated his career to the research, development, and industrialization of intelligent manufacturing equipment and materials for semiconductor micro-nano devices—particularly focusing on the large-scale industrialization of domestic semiconductor equipment and materials in China. He is recognized as one of the key pioneers in the large-scale industrialization of copper interconnect technology for semiconductor integrated circuits in China.
He has been awarded the 1st Level Prize of the Shanghai Science and Technology Progress Award, published over 20 academic papers, and holds 21 international patents.
He has been selected as a National and Shanghai Distinguished Expert (Innovation Category), honored as an Outstanding Entrepreneur of the Year by China Electronics Corporation (CEC), and received the inaugural Shanghai Outstanding Talent Award.
Company Profile
Panelist
Wilson Hong
CTO & Partner
Panel Discussion: China-Middle East Semiconductor Supply Chain Complementarity: From Technology Export to Localized Collaboration
Day 2 / 13:50 - 14:35
Wilson Hong, Chair of ISIG China, Partner and CTO of Wuxi Leapers Semiconductor. He has 20 years R&D experience on power electronic engineering, software engineering, electric drive system and high voltage architecture in EV.
He used to be senior director in NIO, built the power electronic and software team from 1 person in 2015 to ~200 people in 2023. He led the team to deliver over 1.6 million inverters with several classes and different semiconductors, incl. first highest NEDC efficiency SiC Inverter, first 3-in-1 240kW IM system, first 3-in-1 160kW PM system and 4-in-1 HV ECU.
He hold over 50 power electronic, software, electric drive system patents cross China, US and EU. He won the first Prize and second Prize of Science and Technology Progress of China Association of Automobile Manufacturers in 2021 and 2024.
He is now working on power module advanced packaging, super charging and AI power.
Company Profile
Wuxi Leapers Semiconductor Co., Ltd. brings together experienced professionals at home and abroad, including wafer process and device design, module packaging design, product application, marketing and product operation. Major products include high-reliability SiC and IGBT modules for new energy vehicles and industrial applications. Products are used in new energy vehicles, smart grids, renewable energy, industrial motor drives, medical equipment, power supplies and other scenarios and fields; the company is headquartered in Wuxi, China, and has a research and development center in Japan.We adopts innovative packaging materials and processing technology to provide complete module application solutions for the miniaturization, efficiency and light weight of electric drive systems and inverters for new energy vehicles. Meet the needs of high-performance, high-reliability new energy vehicles and high-end industrial power semiconductor modules.
Panelist
Leon(Yenan) Wu, Ph.D.
Founding Partner & CEO
Panel Discussion: Powering MENA’s High-Tech Future: Investment Pathways & Partnerships
Day 1 / 16:35 - 17:20
- Master’s degree from Xi’an Jiaotong University
- PhD from the School of Integrated Circuits, Tsinghua University
- With a background in Electronic Engineering, he has served as a member of the investment committee for integrated circuit and related industry funds under well-known large central enterprises such as Yizhuang Holding Co., Ltd., achieving remarkable investment performance
Company Profile
Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.
西安龙鼎投资管理有限公司（简称“龙鼎投资”）成立于2014年，是一家以国家发展需求为核心导向，以“金融”+“产业”为核心引擎，专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。
Panelist
Sanad Bushnaq, Ph.D.
Mixed Signal Design/Verification Expert (Toshiba/MIT/Intel)
Panel Discussion: Powering MENA’s High-Tech Future: Investment Pathways & Partnerships
Day 1 / 16:35 - 17:20
Dr. Sanad Bushnaq is a semiconductor and microchip technology expert with a track record of world-first chips. With more than 15 years of experience spanning industry and academia, his groundbreaking inventions at the nanometer–scale shaped the evolution of modern memory and logic chips, driving innovation at Toshiba Memory (Japan) – now Kioxia Corp- , MIT (USA), and Intel (USA). Dr. Bushnaq was vital in developing several cutting-edge breakthroughs, with over 25 patents and publications for his inventions in the world’s first 48-layer 3D flash chip, the world’s first 96-layer 3D flash chip, and the world’s fastest flash memory chip developed by Toshiba in Japan.
Dr. Bushnaq pioneers strategies and solutions that break the conventional trade-off between chip’s performance, power consumption and its area. He led multi-disciplinary design and verification teams across analog, digital, mixed-signal domains to deliver next-generation chips and IPs. Dr. Bushnaq achieved first-time-right silicon with use of AI in chip design, automation techniques, and rigorous sign-off methodologies that prioritizes quality, completeness and on-time deliveries.
With deep ties in the region and impact at the highest levels that strengthened ties between the far East, far West and the Middle East. He has served as an advisor to the president of the Royal Scientific Society in Jordan, HRH Princess Sumaya Bint El Hassan, an advisor to the Board of Trustees of Princess Sumaya University for Technology, and an advisor to Japan Science and Technology Agency. He built relationships between institutions in the region and global semiconductor companies, including initiating a fully-funded scholarship program to dispatch students from Jordan to train in Toshiba in Japan. In 2017, Dr Bushnaq received a royal recognition from His Majesty King Abdullah II Ibn Al Hussein at the 8th World Science Forum, organized by UNESCO, the International Science Council and the Royal Scientific Society of Jordan.
Dr Bushnaq was born and raised in Jordan, before he moved to Japan in 2007. He obtained his Masters and PhD degrees in Electrical Engineering from the University of Tokyo.
Company Profile
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