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CS Chua

CS Chua oversees regional sales, marketing and distribution, supply chain, R&D, and manufacturing. He is also responsible for strategy, quality management, human resources, and communications for the Asia Pacific region with local presence in Australia, India, Indonesia, Korea, Malaysia, Philippines, Thailand, and Vietnam. He has held the current role since 2017. CS joined Infineon in 2000 and has taken on roles in product marketing for industrial microcontrollers and regional marketing covering Asia Pacific’s automotive electronics segment. Previously as the Vice President of Automotive Regional Centre. CS has a Bachelor of Electrical and Electronics Engineering degree from the Nanyang Technological University in Singapore.

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Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Amarjit Sandhu

Mr Amarjit Singh Sandhu is the Corporate Vice President, Assembly and Test NAND Operations for Micron Technology. He has 30 years of Operations Management expertise in locations such as Singapore, China and Malaysia. He currently oversees 4 Assembly and Test captive sites namely in Micron Singapore, Muar (Johor) and Penang engaged in manufacturing NAND and DRAM components, Solid State Devices (SSD) and Memory Modules. He is currently leading the new state-of-the-art Batu Kawan semiconductor plant that will process wafers into semiconductor components and subsequently shipping it out as SSD or Memory Module to major customers worldwide. He has pioneered 4 Green field manufacturing startups in different geographies and led 3 successful turnarounds of matured organizations in the last 10 years in China, Singapore and Malaysia. Amarjit built up his career in the semiconductor industry with Texas Instruments Singapore, United Test and Assembly Center (UTAC), Western Digital Corporation (WDC) prior to joining Micron Semiconductor Asia in 2018. He earned his MBA from the Warwick Business School and Bachelor degree in Mechanical Engineering from the National University of Singapore.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Kam Lee

  • Deputy Head of TSMC Advanced Packaging Technology and Service
  • TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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