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Curtis Zwenger

Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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CS Chua

CS Chua oversees regional sales, marketing and distribution, supply chain, R&D, and manufacturing. He is also responsible for strategy, quality management, human resources, and communications for the Asia Pacific region with local presence in Australia, India, Indonesia, Korea, Malaysia, Philippines, Thailand, and Vietnam. He has held the current role since 2017. CS joined Infineon in 2000 and has taken on roles in product marketing for industrial microcontrollers and regional marketing covering Asia Pacific’s automotive electronics segment. Previously as the Vice President of Automotive Regional Centre. CS has a Bachelor of Electrical and Electronics Engineering degree from the Nanyang Technological University in Singapore.

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Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Amarjit Sandhu

Mr Amarjit Singh Sandhu is the Corporate Vice President, Assembly and Test NAND Operations for Micron Technology. He has 30 years of Operations Management expertise in locations such as Singapore, China and Malaysia. He currently oversees 4 Assembly and Test captive sites namely in Micron Singapore, Muar (Johor) and Penang engaged in manufacturing NAND and DRAM components, Solid State Devices (SSD) and Memory Modules. He is currently leading the new state-of-the-art Batu Kawan semiconductor plant that will process wafers into semiconductor components and subsequently shipping it out as SSD or Memory Module to major customers worldwide. He has pioneered 4 Green field manufacturing startups in different geographies and led 3 successful turnarounds of matured organizations in the last 10 years in China, Singapore and Malaysia. Amarjit built up his career in the semiconductor industry with Texas Instruments Singapore, United Test and Assembly Center (UTAC), Western Digital Corporation (WDC) prior to joining Micron Semiconductor Asia in 2018. He earned his MBA from the Warwick Business School and Bachelor degree in Mechanical Engineering from the National University of Singapore.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Kam Lee

  • eputy Head of TSMC Advanced Packaging Technology and Service.
  • TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Dato Seri Lee Kah Choon

Dato’ Seri Lee Kah Choon is currently the Independent Non-executive Chairman of Aemulus Holdings Berhad, a company listed on Bursa Malaysia, which engages in the design & assembly of automated test equipments in the electronic industry.

He is the Chairman of Federal Oats Mills, South East Asia’s largest oats manufacturer producing quality oats & oats based products for the Asian, Middle East and African markets.

Dato Seri Lee also sits on the boards of Nationgate Holdings Berhad & L&P Global Berhad (both listed on Bursa Malaysia) as their Senior Independent Director.

Additionally, Dato Seri Lee is a member of the Investment Committee of Areca Capital, a licensed fund manager for individuals, corporations and institutions.

Industries covered by these companies include: electronic testing equipments manufacturing; electronic manufacturing services; box & crate packaging; food production; wealth management.

Dato Seri Lee had served as board member of various federal & state government linked companies & corporations; Parliamentary Secretary; Member of Parliament & Municipal Councillor.

He was a practicing lawyer with his own private legal practice from 1987 to 2004, after being called to the Bar of Malaya in 1987 and Bar of England & Wales in 1986.

Dato’ Seri Lee holds a LLB from the Southampton University, UK and a MA from the City University, London.

Dato Seri Lee is a Barrister at Law (Middle Temple) & a Certified Financial Planner.

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Aemulus

TBC

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Siobhan Das

SIOBHAN DAS Chief Executive Officer American Malaysian Chamber of Commerce Siobhan Das joined the American Malaysian Chamber of Commerce (AmCham Malaysia) as its Executive Director in 2016 and was promoted in 2020 to become the organization’s first Chief Executive Officer in its 43 year history. Siobhan has created an action-oriented policy platform at the Chamber that is designed to address both the strategic concerns of American multinational companies and the tactical day-to-day challenges faced by operations on the ground. By working closely with business leaders and various stakeholders in the Malaysian and U.S. governments, Siobhan has been able to represent the membership and ensure that AmCham Malaysia fulfills its role as the Voice of U.S. Businesses in Malaysia. Siobhan spent 11 years in Shanghai, five of which as a director at AmCham Shanghai. Siobhan is a Sloan Fellow from London Business School with a Masters in Leadership and Strategy; she also holds two undergraduate degrees from Boston University in Broadcasting and Film, and English. She enjoys golf and is still reveling in her first hole-in-one (2023)!

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American-Malaysian Chamber of Commerce (AMCHAM)

The American Malaysian Chamber of Commerce (AMCHAM) was founded in 1978 as an international, non-profit, private-sector business association. It comprises more than 1200 members representing about 290 American, Malaysian, and other international companies. The Chamber is a member of the AmChams of Asia Pacific (AAP) a non-governing association of 27 AmChams in the region that come together to support engagement in the Asia Pacific.

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Dr. JinYoung Khim

JinYoung joined Amkor Technology in 2000 and is currently Sr. Vice President, Global R&D Strategy. He has more than 23 years’ experience in semiconductor package development and design including Wafer Level, Flip Chip, and MEMS & Sensors. JinYoung has been awarded thirty-five patents and published fifteen papers on advanced packaging technologies at several industry conferences. He holds a Ph.D. in mechanical engineering from Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, Korea.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Dr. Yul Koh

Graduated from the Department of Electrical and Electronic Engineering at Seoul National University in Korea. Following graduation, he embarked on a journey of research at LG Electronics Sensor Solution Lab, where he focused on the developing of MEMS sensor platform and its application in products. Afterward, he assumed his current position at the Institute of Microelectronics in Singapore, where he delved deep into research at the acoustic MEMS device. His expertise spans a wide spectrum, from MEMS devices to sensor solutions, acquired through 15 years of experience in the field. He is currently engaged in various research and development initiatives in the field of piezoelectric micromachined ultrasound transducers and low-power MEMS switches.

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A*Star IME

Established in 1991, the Institute of Microelectronics (IME) is a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). In IME, we focus on delivering high impact research and development for the global semiconductor industry. IME’s role is to collaboratively develop and innovate next-generation technologies to enable a dynamic semiconductor ecosystem. Together with our highly skilled talent pool, we develop strategic capabilities and innovative technologies through state-of-the-art infrastructure. IME’s core research areas are in Advanced Packaging, piezoMEMS, SiC, mmWave GaN, and photonics & sensors. We will continue to shape the semiconductor industry’s roadmap for many years to come.

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Dr. Abderrazzaq Ifis

  • Engineering Director
  • AT&S

As Engineering Director, Dr. Abderrazzaq Ifis is leading the new AT&S IC-Substrate plant qualification and ramp-up in Kulim. He has over 13 years of engineering experience in developing and manufacturing innovative and high-end technologies and products. Dr. Ifis hold a Ph.D. in Mechanics of Materials and Ing. degree in Processes Engineering from prestigious Moroccan and French institutions. Abderrazzaq and his family have been relocated to Malaysia in 2022, seeking not only career development but also exploring life in a joyful, rich and diversified culture and environment here.

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AT&S

AT&S has chosen Malaysia for its pioneer production site in Southeast Asia. With a planned total investment of €1.7 billion (RM8.5 billion) over the next 6 years, this is by far the largest investment in the corporate history of AT&S. The new campus of AT&S is being built at Kulim Hi-Tech Park, which is approximately 350km north of the capital city, Kuala Lumpur. The ongoing construction work started in November 2021 and the start of series production is tentatively scheduled for the end of 2024.

At AT&S Kulim site, there are 3,000 – 4,000 construction workers performing different tasks at site to deliver the fast track construction progress. This manufacturing facility, once completed, will be responsible for the production of high-end IC substrates for high-performance processors at the location in Southeast Asia. These processors are primarily used in high-performance computers, data centres, gaming, 5G, automotive and Artificial Intelligence (AI).

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Arjun Kumar Kantimahanti

Arjun is an R&D Engineer with Broadcom Inc. He is presently working on Silicon Photonics.

Formerly, Arjun was the SVP of Technology Development (TD) and Design Technology (DT) departments at SilTerra Malaysia Sdn Bhd. He has been with SilTerra since 2001 and has been instrumental in setting up various technologies at SilTerra.

He has a total experience of 29 years in Semiconductor Foundry and throughout his career has been working in Technology Development.

He has experience in leading various teams to develop technologies from the start and take them through various phases (such as feasibility, prototyping, qualification, risk release and full production ramp). He has worked on various technology nodes starting from 0.6um through 80nm covering High Voltage, Logic, RF, Mixed Signal, BCD, Flash, MEMS, Silicon Photonics and others.

He also experience in leading the Design Technology group to develop key capabilities such as RF modeling, PDK and library development.

Arjun holds a Master’s degree in Microelectronics from Texas A&M University, USA and a Bachelor’s degree in Electrical and Electronics from Sri Venkateswara University, India.

He has been granted 7 US patents and authored various technical publications.

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Broadcom

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Fouzun Naseer

  • Director R&D, Technology, Industry
  • CREST

Fouzun Naseer had been involved in semiconductor industry over 30 years with wide ranging experience on assembly, test, packaging, manufacturing systems, quality, reliability, material and supplier management. He was previously at Hitachi Semiconductor and Altera Corporation prior to joining CREST. In his current role, he leads R&D group at CREST, and he is also involved in E&E technology and industry development related to Industry 4.0, IC Design, Smart City and Precision Agriculture. He is often engaged for formulation and advocacy of E&E related eco system and directions for various government agencies.

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CREST

Collaborative Research in Engineering, Science and Technology (CREST) established in 2012 to catalyst triple helix collaboration between industry, academia and government on E&E technology and ecosystem development. In over 10 years, CREST also undertake talent development initiatives to support E&E industry. Recently, CREST had become an agency under Ministry of Investment, Trade and Industry.

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Charng Yee Heng

Heng Charng Yee is the CEO of Globetronics Technology Berhad. For the past 10 years, she led technology roadmap, product developing, quality and efficiency innovation in the organization’s fastest growing optoelectronics segments. Charng Yee held various role in global strategy, regional expansion and operations, digitalization and operation excellence during her tenure in Tyco Fire and Security. She is current the committee member of FREPENCA and FMM as well as the Industrial Advisor for the Faculty of Business and Finance of UTAR ( University Tunku Abdul Rahman).

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Globetronics

Globetronics Technology Berhad provides Design, Development and Outsource Semiconductor Assembly and Test services. Product portfolio include highly miniaturised optoelectronics, sensors, IC devices and timing devices for mobile, networking, automotive and emerging medical segments. The company is collaborating with leading technology partners in the areas of wafer level packaging, silicon photonics and wafer level MEMS.

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Noorazidi Che Azib

Noorazidi is currently attached to Inari Technology Sdn. Bhd. (a wholly owned subsidiary of Inari Amertron Berhad) as Deputy Vice President for OTSP (Operation Technology and Strategic Programs) and EHS (Environment, Health and Safety). Possessing a Mechanical Engineering degree from University Of Nevada, Reno, USA, Azidi started his career in the semiconductor related high-volume manufacturing, process engineering, automation system design, Industry 4.0 and environment sectors for the past 30 years with experience working with multinational companies like AMD, Hewlett Packard, Agilent and Avago. Beside transforming Inari into digitalization and cyber-physical-system adoption, Azidi has strong relationship with local academia (secondary and tertiary levels) for the work on developing new industrial-ready talents in the preparedness, exposure and pre-experience prior to joining the industry. Established strong collaborations with government agencies such as MPC, MIMOS, MIDA and MITI for the internal adoptions of advanced technology development and supporting local SME productivity and business developments.

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Inari Amertron Berhad

Inari Amertron Berhad is an investment holding company with wholly-owned subsidiaries involved in the Outsourced Semiconductor Assembly and Test (OSAT) & electronics manufacturing (EMS) industries. Products manufactured involved the RF filters module in mobile communications, optoelectronic products segment, sensors and indicators in automotive segment and others. Manufacturing capability includes prost wafer processing operations, surface mount technology, package assembly and full RF and electrical test capabilities.

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Teng Chow Ooi

  • Sr Director Program Office
  • Intel

Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations.

As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor’s degree on EE engineering from University of Technology Malaysia.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Herbert Oetzlinger

Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics,

Herbert worked in the Semiconductor industry for 30+ years, focused on wet processing .

Special focus on advanced packaging in electroplating and wet etching/cleaning of wafers and substrates. For many years he was VP of Sales with Semitool Inc, where he excelled with his in-depth knowledge of process and hardware. During this time, Herbert worked with many worldwide leading companies on Fan-out, E-WLB and other new developments in wafer level advanced packaging.

In 2012, he founded Semsysco GmbH and is also heading the company as CEO.

Semsysco is a world leader in high speed electrochemical deposition with a pedigree and expertise in all-around wet processing for wafer and panel level.

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Lam Research

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.co

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Dato’ Seri Siew Hai Wong

Dato’ Seri Wong Siew Hai has 29 years of working experience in the electronics industry. He served Intel for most of his illustrious career and retired from Intel after 27 years of service. His last position with Intel was Vice President of Technology and Manufacturing Group (TMG) and General Manager of Assembly and Test Manufacturing (ATM), responsible for all assembly test factories worldwide. He also served as the Vice President and Managing Director of Dell’s Asia Pacific Customer Centre for approximately 2 years. Currently, Dato’ Seri Wong is involved in the electronics industry as Champion of the E&E Productivity Nexus (EEPN) and President of the newly formed Malaysia Semiconductor Industry Association (MSIA).

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Malaysia Semiconductor Industry Association (MSIA)

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Sivasuriyamoorthy Sundara Raja

  • Deputy CEO, Investment Promotion and Facilitation
  • MIDA

A Business Administration graduate from the University of Malaya, Sivasuriyamoorthy Sundara Raja joined Malaysian Investment Development Authority (MIDA) in 1989 as an Assistant Director in the Food, Beverages and Chemical Division. Over the last 33 years he had served in the Strategic Planning and Policy Advocacy Division, Investment Promotion Division and Incentive Coordination and Collaboration Office (ICCO). Mr.Siva was posted to Germany twice to head MIDA’s office in Cologne (2006-2009) and Frankfurt (2013-2017). He was responsible to move MIDA’s office from Cologne to Frankfurt and to establish MIDA’s second office in Germany in Munich. As an overseas Director in Germany, Mr.Siva was responsible to attract foreign direct investments from Germany and the Benelux countries, namely Belgium, the Netherlands and Luxembourg. Throughout most of his 33 years career with MIDA, Mr.Siva was involved in various projects on Malaysia’s industrial development, such as the 2nd and 3rd Industrial Master Plans (IMP), 8th-10th Malaysia Plans, equity liberalisation of the manufacturing sector, formulation of investment incentives and policies, and empowerment of MIDA. Mr.Siva was also responsible for the coordination of the Study on Exit Strategy for Foreign Labour Intensive Industries, formulation of policies and guidelines for the establishment of Domestic Investment Strategic Fund (DISF) to accelerate the shift of Malaysian-owned companies in high technology industries, as well as the establishment of One Stop Centre and Business Travellers Centre for Short Term Business Travellers during COVID 19 Pandemic. Mr.Siva was promoted as the Executive Director (Investment Promotion) on 1st November 2018 and moved to his current position as the Deputy Chief Executive Officer (Investment Promotion & Facilitation) effective 1st May 2021.

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MIDA

MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be the strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era.

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Thiagesh K Lingam

Thiagesh K Lingam is the Senior Director for Industrial Development and Technology Transfer at MIMOS Berhad. He plays a crucial role in engaging the Electrical and Electronics industry in Malaysia and globally. His focus is on facilitating technical and commercial interactions to enhance the industry’s competitiveness. With degrees in Electrical and Electronics Engineering and Materials Engineering from the University of Sunderland, UK, and a Lead Auditor qualification, he brings a strong educational background. Over his 25-year career, Mr. Lingam excelled in IC Design, wafer fabrication, Analytical Services, Product Reliability, Embedded Technology, and Rapid Prototyping, working at Chartered Semiconductor and Hitachi Nippon Steel. His proactive, strategic, and problem-solving skills make him a standout leader in the field.

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MIMOS

MIMOS is a leading innovation center in Semiconductors, Microelectronics, and ICT technologies, operating under Malaysia’s Ministry of Science, Technology, and Innovation (MOSTI). It plays a pivotal role in Malaysia’s socio-economic advancement by developing patentable technology platforms, products, and solutions. With over 1,300 filed patents, MIMOS contributes to Malaysia’s international digital transformation efforts and rebranded as MIMOS Global in 2022. The organization focuses on research excellence in Semiconductor & Thin Film Research, Embedded Microelectronics, Manufacturing, and Smart Nation technologies. MIMOS collaborates with strategic partners, explores new opportunities, nurtures technology ventures, and prioritizes innovation, trust, and high performance.

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