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Dr. Bill En

  • CVP, Foundry Technology and Operations
  • AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Walter Chen

Walter joined Amkor in 2020 and is currently Sr. Vice President responsible for Sales & Marketing in Greater China. Prior to joining Amkor, Walter worked for Cree, Inc 17 years as a position for VP of LED Chips Marketing WW & LED Component Marketing in Asia. Also as a Board member of Lextar representative for Cree. Prior to Cree, he had 6 years of IC design house experience. He has 29 years of Semiconductor industry experience in total, focused on Sales & Marketing field. He holds a Master degree of Engineering Business Management from University of Warwick in UK.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Jian Zhang

Jian is a semiconductor industry veteran with more than 25 years of experience in process technology development, foundry operations, product engineering. Jian has extensive experience in leading and integrating global teams from various regions and businesses, having spent more than a decade in the U.S. and Asia.

Jian is the Vice President in Qualcomm, leading the Product Test Engineering (PTE) in APAC, responsible for new product test development, characterization, and test deployment, yield management, integrating and optimizing performance for all products across the BUs. She also oversees technical and management coordination with the PTE teams in the U.S.

Prior to Qualcomm, Jian served as VP of technology at NXP, responsible for technology roadmap planning and execution, both for in-house fabs and foundries. She also partnered with foundry and internal teams to ensure all new products and foundry processes would meet the automotive quality requirements and work

Jian held various management positions, including Global Foundries and Hewlett Packard. She holds master’s and bachelor’s degree in Electrical Engineering from Purdue University

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Qualcomm Technologies Inc.

Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

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Albert Lan

Experience:

  • Over 30 years of job experience in semiconductor industry, especially focusing on advanced packaging technologies.
  • Senior Engineering Center RD Head, 13 years, SPIL, which is top 3 biggest assembly house in the world.
  • PD, Quality, & Sales, 5 years, Amkor Taiwan(Bumping)
  • Vice Chairman of SEMI Taiwan PKG&TEST Committee.
  • Executive Co-Chair – PKG Committee of IMPACT / TPCA.
  • Chairman of TILA (Taiwan Intelligent Leader Association).
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Applied Materials

We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.

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Stephen Coates

Stephen has previously held executive level engineering & operations roles in silicon & compound semiconductor & displays technology companies including VP Operations at DigiLens, VP Operations at Symmorphix Thin Films Inc, VP Operations at Fultec Semiconductor Inc/Bourns & VP Production Engineering at MaxQ Technology heading up power module design & manufacture. A seasoned technology executive with 30 years’ experience in engineering, manufacturing operations, supply chain management and quality. Stephen has substantial experience in establishing and developing strategic supply chain relationships to support full product commercialization and high volume manufacturing, while also being an expert in device packaging, process development and integration. Stephen also previously held lead assessor qualifications for 3rd party audit to ISO 9000 & equivalent standards (eg TS16949/AS9100).

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GaN Systems
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Ian Chan

Education

  • PhD EECS, University of Michigan USA (1992)

Professional Experience:

  • CEO, Episil Holding Inc. (2013-2016)
  • CSO, Hermes-Epitek (2016-2018)
  • Independent Director, UNIVERSAL CEMENT CORPORATION(2017~ )
  • CTO&Managing Director, Cyntec Co., Ltd. (2019~ )
  • Chairman, Power Forest Technology Corporation(2019~ )
  • Independent Director, Excelliance MOS Corporation(2021~ )
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Cyntec

Since 1991 Cyntec’s team of scientists and engineers have been known to lead the way in the research and development of the miniaturized and highly integrated products and solutions. The product lines consist of magnetic components, passive components, power modules, RF & optical modules which serve the client, cloud computing equipment, automotive, IOT, industry, and other market segments.

Using our insight into market trends and the in depth knowledge of electronic materials and processes, we have been able to produce a wide variety of products with the highest levels of performance, high power handling, high density packaging and tight accuracy.

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Bruce Lu

Bruce Lu joined Goldman Sachs in 2018 as a Vice President and works in the Global Investment Research team where he is responsible for covering Asia technology stocks. He previously worked at Barclays, HSBC and CLSA, with a combined experience of 17 years in equity research covering semiconductor industry. Prior to equity research, Bruce worked at UMC, Applied Materials and JAFCO Asia as a senior investment manager. Bruce has a Master’s degree in Mechanical Engineering from Cornell University.

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Goldman Sachs

The Goldman Sachs Group, Inc. is a leading global financial institution that delivers a broad range of financial services to a large and diversified client base that includes corporations, financial institutions, governments and individuals.

Founded in 1869, the firm is headquartered in New York and maintains offices in all major financial centers around the world.

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Dr. Wei-Chung Lo

Dr. Lo received his Ph.D. from National Taiwan University and joined Industrial Technology Research Institute to work in advanced electronic packaging, such as WLP, 3D IC/3D stacking, fan-out, heterogeneous integration technology for more than 20 years, 85 papers and 40 patent granted. Currently, he also serves as TWG chair of IoT Chapter of IEEE Heterogenous Integration Roadmap(HIR) and chairman of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan chapter.

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Industrial Technology Research Institute (ITRI)

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Dr. Kuan-Neng Chen

Dr. Kuan-Neng Chen is Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, and M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He was Vice President for International Affairs and Associate Dean of International College of Semiconductor Technology in NYCU, Program Director of Micro-Electronics Program in National Science and Technology Council in Taiwan, and a Research Staff Member at IBM Thomas J. Watson Research Center. 

Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NSTC Futuristic Breakthrough Technology Award, NCTU Distinguished Faculty Awards, NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Awards (7 times), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 67 book chapters, and holds 87 patents. He was Guest Editor of MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society. 

In addition to his faculty position, Dr. Chen is Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration. 

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NYCU

NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.

At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.

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