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Dr. Bill En

  • CVP, Foundry Technology and Operations
  • AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Dr. Ofer Shacham

  • VP, Head of Silicon, at Meta Reality Labs
  • Meta

Dr. Shacham is Vice President, Head of Silicon, at Meta Reality Labs. He takes pride in building a vertically integrated Silicon organization from the ground up. Shacham works to constantly redefine what is possible with custom silicon, and in turn how humans and computers interact. To co-design hardware-software systems in order to give the world seamlessly blended virtual and real experiences.

Before Meta, Shacham worked for Google leading Silicon Design and Implementation for Consumer Hardware. Shacham initiated and led Google’s Pixel Visual Core & Pixel Neural Core, from idea to deployment on all Pixel Phones. Shacham also led some generations of Titan security chip, the early phases of the Pixel 6 Tensor Chip, and more.

Shacham joined Google as part of Google’s acquisition of Chip Genesis–a company he co-founded as a spin-out of the research he led at Stanford. Before Stanford Shacham worked for IBM R&D labs in Israel. Shacham also served in an elite Israeli Navy Unit.

Ofer Shacham holds a BSc degree from Tel Aviv University, and MSc and PhD degrees from Stanford University where he also served as academic staff. Dr. Shacham is a highly cited author for dozens of patents and scientific papers. Areas of interest are research, development and productization of outstanding research where hardware and software meet under strict power, form factor, and performance requirements.

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Meta

Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.

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Bor-Sung Liang, Ph.D

  • Senior Director, Corporate Strategy & Strategic Technology
  • MediaTek

Dr. Bor-Sung Liang is currently a Senior Director of Strategic Technology Exploration Platform at MediaTek, Hsinchu Science Park, Taiwan, and concurrently serving as a Visiting Professor at Department of Computer Science and Information Engineering, EECS and GSAT in National Taiwan University, as well as a Professor Ranked Specialist at Institute of AI Innovation, IAIS in National Yang Ming Chiao Tung University. He received his Ph.D degree from Institute of Electronics, National Chiao Tung University, and graduated from EMBA, College of Management, National Taiwan University.

Dr. Liang has received several important awards, such as Ten Outstanding Young Persons, Taiwan, R.O.C., National Invention and Creation Award for three times on Invention (one Gold Medal and two Silver Medals) from Intellectual Property Bureau of the Ministry of Economic Affairs, Taiwan, Outstanding Youth Innovation Award of Industrial Technology Development Award from Department of Industrial Technology of the Ministry of Economic Affairs, Taiwan, Outstanding ICT Elite Award of ICT Month, R.O.C., and K. T. Li Young Researcher Award from Institute of Information & Computing Machinery and ACM Taipei/Taiwan Chapter. He is also the major inventor of more than 80 patents worldwide.

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MediaTek

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do.

Visit www.mediatek.com for more information.

Telephone: +886-3-567-0766 ( more sites )
Email: https://corp.mediatek.com/about/contact-us

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Steve Pawlowski

Steve Pawlowski is corporate vice president of advanced computing solutions at Micron Technology. He is responsible for defining and developing innovative memory solutions for the enterprise and high-performance computing markets.

Prior to joining Micron in July 2014, Steve was a senior fellow and the chief technology officer for Intel’s Data Center and Connected Systems Group. His extensive industry experience includes 31 years at Intel, where he held several high-level positions and led teams in the design and development of next-generation system architectures and computing platforms.

Steve earned bachelor’s degrees in electrical engineering and computer systems engineering technology from the Oregon Institute of Technology and a master’s degree in computer science and engineering from the Oregon Graduate Institute. He also holds 58 patents.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Dr. Seungwook Yoon

Dr. YOON is currently working as Corporate VP/Head of Group, PKG group, Product Technology, S.LSI, Samsung Electronics. Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC, JCET Group. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. ”YOON” received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Served as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.

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Samsung Electronics

Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

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Kam Lee

  • Deputy Head of TSMC Advanced Packaging Technology and Service
  • TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Abul Nuruzzaman

  • VP, Technology and IP Licensing
  • Adeia

Abul Nuruzzaman is VP of Semiconductor Technology and IP Licensing at Adeia, Inc. (formally known as Xperi), San Jose, California. Prior licensing role, he led the marketing of Adeia’s hybrid bonding technology and semiconductor IP portfolio. Throughout his successful semiconductor industry career, Abul worked in product management, marketing and business development roles at AMD, Infineon (Cypress Semiconductor), TE Connectivity and Lattice Semiconductor. He holds BSEE degree from Osaka University, Japan, and MSEE degree from the University of California, Los Angeles (UCLA).

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Adeia

Adeia invents, develops and licenses fundamental innovations that shape the way millions of people explore and experience entertainment and enhance billions of devices in an increasingly connected world. Leveraging the combination of highly experienced technologists, scientists, engineers and advanced R&D labs in San Jose, California and Raleigh, North Carolina, Adeia develops industry-leading 3D integration solutions such as hybrid bonding that meet the demand for greater functionality, higher performance and smaller size for next generation electronics.

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Michael Chang

Michael Chang is the Vice President and General Manager of Advantest Cloud Solutions (ACS), a strategic business unit within Advantest Corporation to enable customers in the Advantest value chain to deliver improved yield, quality, and time to volume / market. Michael boasts 25 years of diverse experience leading product innovations and business growth across AI/Machine Learning, Cloud Datacenter and Semiconductor spaces. Before joining Advantest, Michael was the General Manager of AI Solutions business at Supermicro Computer. Prior to Supermicro, he was the Co-founder of a deep learning startup company. He has also held multiple leadership roles at several IC companies including LSI, Marvell, and Vitesse semiconductor. Michael holds an MBA degree from Haas Business School at UC Berkeley, a bachelor degree in Electronics and Communications Engineering from the National Chiao Tung University and has completed the Executive Leadership Program from Stanford’s Graduate School of Business.

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Advantest

Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

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Aziza Dada

Aziza Dada is a logistics professional with 15 years experience in International supply chain and time critical logistics. She has extensive knowledge of the global semiconductor industry. Her goal is to be result-oriented with a focus on continuous process improvement and high quality service. Aziza keeps close track of changes to regulations by country as wells processes involved in international supply chain and transportation. Welcome to the future of Logistics with Airspace. Let her show you how how AI and modern technology will improve your most critical deliveries.

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Airspace

Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.

Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.

With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.

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Walter Chen

Walter joined Amkor in 2020 and is currently Sr. Vice President responsible for Sales & Marketing in Greater China. Prior to joining Amkor, Walter worked for Cree, Inc 17 years as a position for VP of LED Chips Marketing WW & LED Component Marketing in Asia. Also as a Board member of Lextar representative for Cree. Prior to Cree, he had 6 years of IC design house experience. He has 29 years of Semiconductor industry experience in total, focused on Sales & Marketing field. He holds a Master degree of Engineering Business Management from University of Warwick in UK.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Albert Lan

Experience:

  • Over 30 years of job experience in semiconductor industry, especially focusing on advanced packaging technologies.
  • Senior Engineering Center RD Head, 13 years, SPIL, which is top 3 biggest assembly house in the world.
  • PD, Quality, & Sales, 5 years, Amkor Taiwan(Bumping)
  • Vice Chairman of SEMI Taiwan PKG&TEST Committee.
  • Executive Co-Chair – PKG Committee of IMPACT / TPCA.
  • Chairman of TILA (Taiwan Intelligent Leader Association).
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Applied Materials

We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.

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Dr. C.P. Hung

  • Corporate VP RD
  • ASE

Dr. C.P. Hung currently holds the position of Vice President, Corporate R&D, at ASE Group. Based in Taiwan, he leads teams responsible for next-generation product development featuring integrated technologies, as well as a broad range of advanced chip, package, and system integration solutions with multiple ASE and USI Sites.

During his tenure, Dr. Hung has performed a variety of management roles at ASE, including VP of Corporate Design, VP of Central Engineering & Business Development and VP of Logistic Services Integration. He holds 180 patents encompassing IC packaging structure, process, substrate and characterization technology. He has also published over 104 conference and journal papers.

Dr. Hung is a board of governor of IEEE EPS since 2019. He has being the SEMICON Taiwan PKG & TEST Committee Chair since 2013, and currently Co-Chair since 2021.

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ASE

ASE is the leading global provider of semiconductor manufacturing services in assembly and test. With a proven track record spanning almost 40 years, ASE today is at the forefront of flexible, powerful, integration technologies that achieve criteria for improved power, performance, area, and cost requirements. Our comprehensive toolbox leveraging innovative technologies, such as die interconnection, wafer level fan out, embedded devices, conformal and compartmental shielding, integrated antenna, and others, are being refined and enhanced to support future generations of system integration. Heterogenous Integration through SiP is enabling significant innovation across dynamic application areas including AI, 5G, automotive, mobile, IoT and more. Our industry is driven by innovation, and through ASE’s miniaturization technologies, we are enabling transformative solutions that are literally changing lives, from health to transportation, from Robotics to AI, from IoT to 5G.

Website: ase.aseglobal.com

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Nelson Fan

Nelson, VP of Business Development, Advance Packaging Technology focuses on High Precision Bonding and “Pick & Place” Solutions for Advanced Packaging. He has worked for more than 30 years in Semiconductor Packaging Industry. Prior to joining ASMPT, he held multiple senior management roles in R&D and manufacturing in both OSAT and design house. He has more than 40 US patents in semiconductor packaging technologies. Nelson holds a Bachelor degree in the field of Electrical Engineering from the University of Colorado at Colorado Springs, USA.

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ASMPT Limited

ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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CJ Hsieh

Experiences:

  • Advisory board, ISES Taiwan
  • Co-chair of Test Committee, SEMI Taiwan
  • General Manager, INTEL Innovation Tech. Ltd.
  • Spokesperson, INTEL Taiwan
  • Consulting Committee, National QUEMOY University
  • VP of Global Operations, LANTIQ Deutschland GmbH
  • GM & VP of Professional Services Lab, SPIROX Corp.
  • AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
  • Technical Manager of CPU / Memory Design, UMC
  • Project Leader of EDA DFT, SYNTEST Tech. Ltd.

Education:

  • MSEE, University of Southern California, Los Angeles, USA
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ASPEED

Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.

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Dr. Christian Ohde

  • Global Product Director SC/FEC
  • Atotech

Christian finished his PhD in chemistry and joined MKS Atotech in 2010. After holding various management positions, he was appointed Head of R&D in 2013 for the company’s electrolytic copper plating activities, mainly focusing on plating of various metals in different equipment tool sets (horizontal and vertical).

Christian Ohde is leading MKS Atotech’s global Semiconductor and Functional Electronics Coatings activities. He is a reputable industry expert and thought-leader in this field.

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Atotech

Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com

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Ian Chan

Education

  • PhD EECS, University of Michigan USA (1992)

Professional Experience:

  • CEO, Episil Holding Inc. (2013-2016)
  • CSO, Hermes-Epitek (2016-2018)
  • Independent Director, UNIVERSAL CEMENT CORPORATION(2017~ )
  • CTO&Managing Director, Cyntec Co., Ltd. (2019~ )
  • Chairman, Power Forest Technology Corporation(2019~ )
  • Independent Director, Excelliance MOS Corporation(2021~ )
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Cyntec

Since 1991 Cyntec’s team of scientists and engineers have been known to lead the way in the research and development of the miniaturized and highly integrated products and solutions. The product lines consist of magnetic components, passive components, power modules, RF & optical modules which serve the client, cloud computing equipment, automotive, IOT, industry, and other market segments.

Using our insight into market trends and the in depth knowledge of electronic materials and processes, we have been able to produce a wide variety of products with the highest levels of performance, high power handling, high density packaging and tight accuracy.

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Dr. Justin Chueh

Dr. Justin Chueh is the Director of the Monolithic and Heterogeneous Integration Department at Etron Technology, and he holds a Ph.D. in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor. His research focused on low power circuit design and resonant clock generation and distribution, which led to the granting of four US patents that were later utilized in CPU products by AMD.

Dr. Chueh has extensive experience in the semiconductor industry, having previously worked for AMD and TSMC before joining Etron Technology in 2019. During his time at AMD, he led the exploration of new standard cell architecture, managed the Memory Compiler Team, and contributed to the development of CPUs and GPUs. At TSMC, he incubated new technology platforms for Lidar, ADAS, and mmWave applications, overseeing product development from definition to mass production.

Dr. Chueh has authored papers published in prestigious conferences and journals and has been granted eleven patents, with more pending. He currently serves on the Memory TPC at ISSCC and also served on the Memory TPC at A-SSCC 2022.

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Etron Technology Inc.

Etron Technology Inc. (TPEx: 5351.TW) is a world renowned fabless IC design and product company founded by Dr. Nicky Lu in the Hsinchu Science Park (February 1991). The company specializes in the production and research of buffer memory, logic chip designs, electronic applications, and system-on-chips.

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Ralph Zoberbier

  • SVP & Head of Business Unit Advanced Packaging
  • Evatec

After completing his first degree in applied sciences, Ralph completed his MBA in 2006 and gained over 20 years experience in the semiconductor equipment business across roles in engineering, product management and global business and sales management before joining Evatec in 2019 as Head of BU Advanced Packaging. In addition to thin film technology, his technical expertise covers areas including lithography and ECD for both wafer and panel level applications.

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Evatec

Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

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Andy Chuang

  • Consultant

Mr. Chuang received his M.S. degrees in Electrical Engineering of National Tsinghua University. After graduated, he joined UMC R&D to start his professional career. Starting from R&D to give him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales and expat to Europe to manage key customers. Completely training to make him realize wafer business and supply chain. After UMC, he joined EDA vendor, Synopsys. This experience helped him connecting chip design to wafer manufacturing. After that, he joined CSMC in China as VP of marketing and sales. He led company to have creative ideas to customize BCD processes targeting to specific application and won the China market, such as Class A/B, Class D, Charger, PMIC, LED display, and LED lighting. In 2013, he joined Episil, started business in compound semiconductor (SiC and GaN-on-Si). He is the one who run both SiC and GaN-on-Si at the same, and delivered supreme manufacturing cycletime, production yield to customers. He started new career in GaN Systems from 2022. GaN Systems is a trusted company which can deliver GaN devices to Automotive and High Rel application. GaN Systems enables power conversion companies to revolutionize their industries and transform the world.

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Stephen Coates

Stephen has previously held executive level engineering & operations roles in silicon & compound semiconductor & displays technology companies including VP Operations at DigiLens, VP Operations at Symmorphix Thin Films Inc, VP Operations at Fultec Semiconductor Inc/Bourns & VP Production Engineering at MaxQ Technology heading up power module design & manufacture. A seasoned technology executive with 30 years’ experience in engineering, manufacturing operations, supply chain management and quality. Stephen has substantial experience in establishing and developing strategic supply chain relationships to support full product commercialization and high volume manufacturing, while also being an expert in device packaging, process development and integration. Stephen also previously held lead assessor qualifications for 3rd party audit to ISO 9000 & equivalent standards (eg TS16949/AS9100).

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GaN Systems
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Bruce Lu

Bruce Lu joined Goldman Sachs in 2018 as a Vice President and works in the Global Investment Research team where he is responsible for covering Asia technology stocks. He previously worked at Barclays, HSBC and CLSA, with a combined experience of 17 years in equity research covering semiconductor industry. Prior to equity research, Bruce worked at UMC, Applied Materials and JAFCO Asia as a senior investment manager. Bruce has a Master’s degree in Mechanical Engineering from Cornell University.

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Goldman Sachs

The Goldman Sachs Group, Inc. is a leading global financial institution that delivers a broad range of financial services to a large and diversified client base that includes corporations, financial institutions, governments and individuals.

Founded in 1869, the firm is headquartered in New York and maintains offices in all major financial centers around the world.

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Dr. Wei-Chung Lo

Dr. Lo received his Ph.D. from National Taiwan University and joined Industrial Technology Research Institute to work in advanced electronic packaging, such as WLP, 3D IC/3D stacking, fan-out, heterogeneous integration technology for more than 20 years, 85 papers and 40 patent granted. Currently, he also serves as TWG chair of IoT Chapter of IEEE Heterogenous Integration Roadmap(HIR) and chairman of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan chapter.

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Industrial Technology Research Institute (ITRI)

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Dr. Ming-Der Shieh

Ming-Der Shieh received the B.S. degree in electrical engineering from National Cheng Kung University, Taiwan, in 1984, the M.S. degree in electronic engineering from National Chiao Tung University, Taiwan, in 1986, and the Ph.D. degree in electrical engineering from Michigan State University, East Lansing, in 1993. From 1988 to 1989, he was an engineer at United Microelectronic Corporation, Taiwan. After receiving the Ph.D. degree, he joined the Department of Electronic Engineering, National Yunlin University of Science & Technology (NYUST). Since 2002, he has been with the Department of Electrical Engineering, National Cheng Kung University (NCKU), where he is currently a professor. His research interests include VLSI design and testing, VLSI for signal processing, and digital communication.

Dr. Shieh was the Chairman of EE Department at NYUST (1999-2002) and NCKU (2014-2017), and Dean of Miin Wu School of Computing at NCKU from 2021-2022. He also served as the Deputy General Director of Information and Communications Research Laboratories (ICL) at Industrial Technology Research Institute (ITRI) from 2010 to 2014, and was an Adjunct Research Fellow at the Office of Science and Technology, Executive Yuan, Taiwan from 2017 to 2019. In addition, he served as the Chairman of Taiwan IC Design Society (TICD) (2016-2018), Associated Editor of IEEE Transactions on Circuits and Systems – Part I (2010~2012), and General Chair/Program Chair/Technical Committee Member of several international conferences. Currently, as the Chief Technology Officer of Electronic and Optoelectronic System Research Laboratories (EOSL) at ITRI, he is responsible for strategic planning and cross-disciplinary collaboration. He is in charge of the IC research and development in EOSL, particularly in the area of AI chip design from different aspects, heterogeneous chiplet design and integration, and automotive IC designs.

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Industrial Technology Research Institute (ITRI)

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Ray Yang

Ray Yang is consulting director at Industry, Science and Technology International Strategy Center of ITRI (Industrial Technology Research Institute), which is one of influential think tanks in Taiwan. Ray currently serves as principal investigator of semiconductor cross-disciplinary research group for National Science and Technology Council of Taiwan. He is also appointed by ITRI HQ as BD director at Office of Business Development. Ray is responsible for emerging technology and market dynamics research especially about semiconductors as well as industry-related geo-political issues.

Ray has more than 30 years’ experience with semiconductor industry, and had been advisor to Horizon 2020 “NanoElectronics Roadmap for Europe: Identification and Dissemination” 3-years’ project, and continues to serve as international advisor to Horizon Europe project “International Cooperation on Semiconductors” since 2023. Ray is serving as committee member at SEMI Taiwan Packaging & Testing, Smart Manufacturing, and MEMS & Sensors committees.

Ray’s analysis and commentary have been featured in the New York Times, the Wall Street Journal, Al Jazeera, Deutsche Welle, Voice of America, Radio Free Asia, Le Monde, among others. He also regularly appears on Taiwan’s media such as Central News Agency, Radio Taiwan International, United Daily News, Liberty Times, and has provided commentary for ERA TV, a Taiwanese broadcast media outlet.

Ray holds a MBA from Tel-Aviv International School of Management in Israel, and receives bachelor degree of electrical engineering with honor from National Tsing Hua University of Taiwan in 1986.

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Industrial Technology Research Institute (ITRI)

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Elpin Goh

Elpin Goh is Senior Director of Specialty Technologies Business Development at Lam Research. She is responsible for business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.

Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.

Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.

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Lam Research Corporation

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com

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Marco Mezger

Marco Mezger is a global entrepreneur, investor, and advisor with over 25 years of experience in the semiconductor industry. Born in Germany and based in Taipei, Marco has a unique understanding of global semiconductor businesses with their challenges, resulting in a track record at various companies and as a matchmaker in the industry. As a thought leader focusing on memory technology, Marco has a sizeable global follower base on LinkedIn. He is also a regular guest on the business TV program “Taiwan Talks” commenting on the semiconductor industry news and market trends.

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Neumonda

Neumonda has been founded with profound know how and the ‘DNA’ of former German memory powerhouse ‘Qimonda’. It has the ability to provide memory and storage solutions to worldwide customers, especially targeting the industrial and specialty market segments.

“Deep understanding of the technical/supply chain aspects of product design and developments, in addition to sales and marketing are building the foundation of the the global management team to serve these markets with real ‘Memory Competency‘.”

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APIS4

APIS4 wields decades of executive experience across the global markets of Europe, the Middle East, and Africa (EMEA), Asia Pacific (APAC), and the Americas (AMER). From our headquarters in Taiwan, we operate both domestically or internationally to lead you into your newest horizons.

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Dr. Kuan-Neng Chen

Dr. Kuan-Neng Chen is Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, and M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He was Vice President for International Affairs and Associate Dean of International College of Semiconductor Technology in NYCU, Program Director of Micro-Electronics Program in National Science and Technology Council in Taiwan, and a Research Staff Member at IBM Thomas J. Watson Research Center. 

Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NSTC Futuristic Breakthrough Technology Award, NCTU Distinguished Faculty Awards, NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Awards (7 times), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 67 book chapters, and holds 87 patents. He was Guest Editor of MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society. 

In addition to his faculty position, Dr. Chen is Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration. 

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NYCU

NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.

At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.

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