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Dr. Jun He

  • VP Quality & Reliability, Advanced Packaging Technology & Service
  • TSMC

Dr. Jun He is Vice President of Quality & Reliability as well as Advanced Packaging Technology & Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management. Within the Q&R scope, his function covers incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Besides overseeing all TSMC advanced packaging and testing manufacturing, his backend team is also accountable for key building blocks including bump/passivation/RDL process innovations and test technology development. Seamless collaboration and joint development with external partners across material, OSAT and substrate supply chain is one of his focus areas to enable customers’ product innovations at system level.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations.

Dr. He holds over 40 patents globally and published 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Koushik Banerjee

  • VP Technology Development Group
  • Intel

Koushik Banerjee is a vice president in the Technology Development Group at Intel Corporation and co-leads Assembly and Test Technology Integration. His organization is responsible for developing innovative, industry-leading packaging technologies for Intel and other customer products and transferring those technologies successfully into high-volume manufacturing. Koushik and his team also manage technology development in the external ecosystem supply chain for certain key ingredients that get integrated into Intel’s packaging. Banerjee holds more than a dozen patents in the field of microelectronic packaging. He earned his master’s degree in mechanical engineering from Georgia Institute of Technology.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Rahul Manepalli, Ph.D.

  • Intel Fellow; Director Substrate TD Module Engineering
  • Intel

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Kangwook Lee

Dr. Lee has been one of critical leaders who are leading the era of 3D TSV stack memory such as HBM (High Bandwidth Memory) in semiconductor industry.

He has contributed broadly to, and led teams in, 3D integration/packaging R&D including core technology/product development/reliability study and mass production for HBM over 27 years.

Dr. Lee received the Ph.D. degree in machine intelligence and systems engineering from Tohoku University, Japan, in 2000. During his doctoral research at Tohoku University,

Dr. Lee proposed a new 3D-IC integration technology to achieve 3D devices with high performance and multi-functionality, leading this field in the world.

From 2001 to 2002, he was a Postdoctoral Researcher with the Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.

He worked with Memory Division, Samsung Electronics Ltd., Korea, as a Principal Engineer from 2002 to 2008.

From 2008 to 2016, he worked with the New Industry Creation Hatchery Center (NICHe), Tohoku University, Japan, as a Professor.

From 2017 to 2018, he worked with R&D center, Amkor Technology Korea, as a VP.

He joined SK hynix 2018 and currently Senior VP, Head of PKG Development at SK Hynix, Korea.

Dr. Lee has led many interdisciplinary R&D programs on 3D integration, including integration of various materials and devices to achieve 3D devices/systems with high performance and new functionality,

3D-IC reliability research to investigate the impacts of 3D integration on the device performance and reliability, unique hybrid integration of nano-materials with Si, and product development of 3D stack DRAM

such as high-bandwidth memory (HBM). For over 27 years at universities and industries in Japan, US, and Korea, Dr. Lee has made exceptional technical contributions to and lasting impacts on 3D integration technology

and 3D product development in broad fields, such as material science, materials characterization/analysis, semiconductor device/process, electrical packaging, and Si micro-machining.

Dr. Lee has authored more than 230 scientific publications (peered journals, international conferences), co-edited 4 books, and given 43 tutorial/invited/keynote talks in international conferences including

IEEE IEDM, IEEE IRPS, VLSI Symposium, plus 23 US patent publications.

He has served as a frequent reviewer for a number of journals, including IEEE EDL, IEEE T- ED, IEEE CPMT, and technical program committees of international conferences, including IEEE ECTC, IEEE IRPS, IEEE EDTM, IEEE 3D SIC.

He is a Senior Member of IEEE.

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SK Hynix
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Jason Ma, Ph.D.

  • Engineering Director, Technical Site Lead Google Taiwan
  • Google

As the Engineering Director, Jason Ma oversees Google Taiwan’s site growth, business management and development, as well as leads multiple R&D projects across the board. Before taking this leadership role at Google Taiwan, Jason was a Platform Technology and Cloud Computing expert in the Platform & Ecosystem business group at Google Mountain View, CA. In his 12 years with Google, Jason has successfully led strategic partnerships with global hardware and software manufacturers and major chip providers to drive various innovations in cloud technology. These efforts have not only contributed to a substantial increase in Chromebook’s share in global education, consumer and enterprise markets, but have also attracted global talents to join Google and its partners in furthering the development of hardware and software technology solutions/services.

Prior to joining Google, Jason served on the Office group at Microsoft Redmond, WA. He represented the company in a project, involving Merck, Dell, Boeing, and the United States Department of Defense, to achieve solutions in unified communications and integrated voice technology. In 2007, Jason was appointed Director of the Microsoft Technology Center in Taiwan. During which time, Jason led the Microsoft Taiwan technology team and worked with Intel and HP to establish a Solution Center in Taiwan to promote Microsoft public cloud, data center, and private cloud technologies, connecting Taiwan’s cloud computing industry with the global market and supply chain.

Before joining Microsoft, Jason was Vice President and Chief Technology Officer at Soma.com. At Soma.com, Jason led the team in designing and launching e-commerce services, and partnered with Merck and WebMD on health consultation services and over the counter/prescription drugs/services. Soma.com was in turn acquired by CVS, the second largest pharmacy chain in the United States, forming CVS.com, where Jason served as Vice President and Chief Technology Officer and provided solutions for digital integration.

Jason graduated from the Department of Electrical Engineering at National Cheng Kung University, subsequent which he moved to the United States to further his graduate studies. In 1993, Jason obtained a Ph.D. in Electrical Engineering from the University of Washington, with a focus in the integration and innovation of power systems and AI Expert Systems. In 1997, Jason joined the National Sun Yat-sen University as an Associate Professor of Electrical Engineering. To date, Jason has published 22 research papers and co-authored 2 books. Due to his outstanding performance, Jason was nominated and listed in Who’s Who in the World in 1998.

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Google

Our mission is to organize the world’s information and make it universally accessible and useful.

Website: www.google.com
Headquarters: 1600 Amphitheatre Pkwy, Mountain View, CA 94043
Phone: +1 (650) 253-0000

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Bor-Sung Liang, Ph.D

  • Senior Director, Corporate Strategy & Strategic Technology
  • MediaTek

Dr. Bor-Sung Liang is currently a Senior Director of Strategic Technology Exploration Platform at MediaTek, Hsinchu Science Park, Taiwan, and concurrently serving as a Visiting Professor at Department of Computer Science and Information Engineering, EECS and GSAT in National Taiwan University, as well as a Professor Ranked Specialist at Institute of AI Innovation, IAIS in National Yang Ming Chiao Tung University. He received his Ph.D degree from Institute of Electronics, National Chiao Tung University, and graduated from EMBA, College of Management, National Taiwan University.

Dr. Liang has received several important awards, such as Ten Outstanding Young Persons, Taiwan, R.O.C., National Invention and Creation Award for three times on Invention (one Gold Medal and two Silver Medals) from Intellectual Property Bureau of the Ministry of Economic Affairs, Taiwan, Outstanding Youth Innovation Award of Industrial Technology Development Award from Department of Industrial Technology of the Ministry of Economic Affairs, Taiwan, Outstanding ICT Elite Award of ICT Month, R.O.C., and K. T. Li Young Researcher Award from Institute of Information & Computing Machinery and ACM Taipei/Taiwan Chapter. He is also the major inventor of more than 80 patents worldwide.

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MediaTek

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do.

Visit www.mediatek.com for more information.

Telephone: +886-3-567-0766 ( more sites )
Email: https://corp.mediatek.com/about/contact-us

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Dr. Bill En

  • CVP, Foundry Technology and Operations
  • AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Samuel Chiang

Samuel Chiang is currently the deputy technical director of Andes Technology’s marketing department, assisting in the planning and promotion of Andes RISC-V 32/64-bit processors and related products. He has 15 years of experience in semiconductor IP design and development, sales and marketing, and customer technical support. He also has four years of sales and marketing experience in the field of IoT cloud and security software. Before Andes, Samuel worked at Canonical in charge of IoT sales for the Asia-Pacific region. Prior to this, he worked at Arm for 16 years, leading the Asia-Pacific and global pre-sales technical teams to cooperate with customers. He was also in charge of business development in the Asia-Pacific region at Pelion, Arm’s IoT software service subsidiary. Samuel worked as a SRAM circuit designer in TSMC’s Design Service Department in the early days. Before that, he worked on C language compiler development in IBM Software Lab in Toronto. He holds a master’s degree in administrative management from National Taiwan University, and a master’s degree and a bachelor’s degree in computer engineering from Queen’s University Canada.

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Andes Technology

As a Founding Premier member of RISC-V International, Andes is a publicly-listed company (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099) and a leading supplier of high-performance/low-power 32/64-bit embedded processor IP solutions, and the driving force in taking RISC-V mainstream. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit Out-of-Order processors with DSP, FPU, Vector, Linux, superscalar, automotive and/or multi/many-core capabilities. By the end of 2022, the cumulative volume of Andes-Embedded™ SoCs has surpassed 12 billion. For more information, please visit https://www.andestech.com.

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CJ Hsieh

Experiences:

  • Advisory board, ISES Taiwan
  • Co-chair of Test Committee, SEMI Taiwan
  • General Manager, INTEL Innovation Tech. Ltd.
  • Spokesperson, INTEL Taiwan
  • Consulting Committee, National QUEMOY University
  • VP of Global Operations, LANTIQ Deutschland GmbH
  • GM & VP of Professional Services Lab, SPIROX Corp.
  • AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
  • Technical Manager of CPU / Memory Design, UMC
  • Project Leader of EDA DFT, SYNTEST Tech. Ltd.

Education:

  • MSEE, University of Southern California, Los Angeles, USA
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ASPEED

Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.

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Mark Wade

Mark is Chief Executive Officer and Co-Founder of Ayar Labs. His prior roles at Ayar Labs include Chief Technology Officer and Senior Vice President of Engineering. He is recognized as a pioneer in photonics technologies and, prior to founding the company, led the team that designed the optics in the world’s first processor to communicate using light. He and his co-founders invented breakthrough technology at MIT and UC Berkeley from 2010-2015 which led to the formation of Ayar Labs. He holds a PhD from University of Colorado.

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Ayar Labs

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power. Ayar Labs’ patented approach uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O. The company was founded in 2015 and is funded by a number of domestic and international venture capital firms as well as strategic investors. For more information, visit www.ayarlabs.com.

Address: 3351 Olcott Street, Santa Clara, CA 95054
Phone: 650-963-7200
Email: info@ayarlabs.com

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Radha Nagarajan

Dr. Radha Nagarajan is Senior Vice President and Chief Technology Officer of Marvell’s Optical and Cloud Connectivity Group. In this role, he manages the development of the company’s optical platform technology and products. Radha joined Marvell from Inphi, where he served as the Senior Vice President and Chief Technology Officer of Platforms.

Radha has been awarded more than 240 US patents and is a Fellow of the IEEE, OSA and IET (UK). In 2006, he was awarded the IEEE/LEOS Aron Kressel Award and in 2022, the IPRM (Indium Phosphide and Related Materials) Award, in recognition of breakthrough work in the development and manufacturing of large scale photonic integrated circuits. In 2023, Radha was named to Electro Optics’ The Photonics100 2024 which honors the industry’s most innovative people. Radha holds a B.Eng. from the National University of Singapore, M.Eng. from the University of Tokyo, and Ph.D. from the University of California, Santa Barbara, all in Electrical Engineering.

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Marvell
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Matthias Fettke

  • VP Advanced Packaging Equipment
  • PacTech
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PacTech
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Dr. Charles Li

Dr. Yun-Li (Charles) Li is the CEO and co-founder of PlayNitride, one of the most advanced MicroLED companies in the world. PlayNitride was established by Dr. Li and his partners in 2014. Under Dr. Li’s leadership, PlayNitride has steadily grown to more than 300 employees within 6 years and keeps the leader position in development of MicroLED display technology. From September 2019, PlayNitride starts running the first MicroLED production line in Taiwan to deliver products to customers.

Dr. Li received his Ph.D. degree from Rensselaer Polytechnic Institute (USA) with Prof. Fred Schubert in 2003. Dr. Li’s Ph.D. work focused on gallium nitride (GaN) based light-emitting diodes (LEDs) and LED-based applications.

In 2020, Dr. Li received Special Recognition Award from Society for Information Display (SID). It recognized Dr. Li and his team in development and commercialization of MicroLED technology. It also indicated that MicroLED has been identified as the new generation display technology and key development topic.

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PlayNitride

PlayNitride has become a leading company of MicroLED technology through the breakthrough innovations and diverse business models with PixeLED Display, PixeLED Matrix, µ-PixeLED, and SMAR・Tech solutions. PlayNitride has strong capability to integrate all required technologies to realize MicroLED display applications.

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Vikram Turkani

  • Director, Technology Partnerships and Strategic Business Development
  • PulseForge

Vikram Turkani, serves as the Director of Technology Partnerships and Strategic Business Development at PulseForge Inc., a prominent technology company specializing in advanced packaging solutions based in Austin, Texas. In this pivotal role, Vikram is instrumental in steering the development and implementation of cutting-edge technologies at PulseForge. Through close collaboration with global technology partners, he ensures the successful transition of these state-of-the-art solutions into practical applications within the market.

Beyond driving the development of innovative technologies, Vikram actively engages with PulseForge’s customers, facilitating the seamless adoption of these innovations on a large scale. In addition to his professional pursuits, Vikram enjoys hiking Texas hill country and exploring the vibrant Austin food scene.

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PulseForge

We are experts in applied energy. PulseForge, Inc. designs and manufactures revolutionary pulsed-light systems for industrial processes. PulseForge utilizes applied energy in a precise and targeted manner to enable innovation in manufacturing. Our expertise and tools empower our customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at scale.

Most semiconductor fab managers feel tremendous margin pressure, so PulseForge offers an innovative process that lowers TCO by over 30% while improving yield, so you can increase production while improving profitability. At PulseForge, we envision a future free of manufacturing limitations. A future where designers create freely and do not have to restrict or modify their designs in order to get them manufactured…a future where electronics can be integrated into textiles, plastics, and recycled materials easily, affordably, and in volume. A future with advances in semiconductors, additive manufacturing, packaging, drying, cleaning, and decontamination. Explore the possibilities www.pulseforge.com

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ST Liew

  • President, Taiwan & SEA Australia, New Zealand Vice President
  • Qualcomm

ST Liew is a Vice President of Qualcomm Technologies, Inc. and the President of Qualcomm Taiwan and South East Asia, Australia, New Zealand. ST was born in Malaysia and was educated in Malaysia, Singapore and the UK. His permanent home is Singapore.

In this role, ST is responsible for leading all business and operational functions for Qualcomm in the region. Prior to this role, ST served as the Vice President and President of Qualcomm Taiwan.

ST has more than 30 years of experience leading businesses and R&D in the telecommunication industry. Most recently ST was the President of Acer’s new Business Group SPBG that focused on R&D and Sales of non PC lines of product for the global market while living in Switzerland and later in Taiwan.

Before joining Acer, ST was in Motorola for over 18 years leading Regional R&D Teams and later in Product planning, business Teams across the world in products ranging from Mobile radios, Pagers, Data terminals to Cellular phones. ST has lived in China, Korea, USA and India during his tenure.

Liew received his MBA from the National University of Singapore, and holds a BSc. in Electrical and Electronic Engineering from the University of Leeds, UK.

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Qualcomm

Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

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Stefan Lutter

  • Master of Business and Engineering from Steinbeis University Berlin, Germany and Diploma in Microsystems Engineering from University of Applied Sciences in Regensburg, Germany
  • Held various positions in process- development and R&D for MEMS, working in Switzerland and Germany, before joining SUSS MicroTec in 2008
  • Held positions in Product Management for Coater- and Bonder Business Units
  • Business Unit Manager Bonder from 2013 – 2022
  • Business Unit Manager Coater from 2017 – 2019
  • Vice President R&D and then Senior Vice President R&D since 2022
  • Managing Director of SUSS MicroTec Lithography GmbH and SUSS MicroTec Photomask Equipment GmbH & Co. KG from 2018 – 2022
  • Managing Director of SUSS MicroTec Solutions GmbH & Co. KG since 2022
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SUSS MicroTec

SUSS MicroTec is a leading manufacturer of system and process solutions for micropatterning in the semiconductor industry and related markets. The company has more than 70 years of engineering experience and is a partner for high-volume production as well as for research and development. In close collaboration with research institutes and industry partners, SUSS MicroTec drives the development of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for MEMS and LED production. With its global infrastructure for applications and service, SUSS MicroTec supports more than 8,000 installed systems worldwide. The headquarters of SUSS MicroTec is in Garching, near Munich, Germany.

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Kam Lee

  • eputy Head of TSMC Advanced Packaging Technology and Service.
  • TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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