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Deepak Kulkarni

  • Senior Fellow Advanced Packaging
  • AMD

Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Rahul Manepalli, Ph.D.

  • Intel Fellow; Director Substrate TD Module Engineering
  • Intel

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Jackie Sturm

  • CVP Global Supply Chain Operations
  • Intel

Jackie Sturm leads operations for Intel’s multi-billion-dollar Global Supply Chain, which has been cited as a #8 or better for nine consecutive years in Gartner’s Supply Chain Top 25. Her international team supports Construction and Facilities sourcing, Indirect procurement, business continuity, supply chain systems and analytics, and Supply Chain Environmental and Social Governance program, which includes Intel’s first-mover Conflict Minerals initiative. Jackie is a committed advocate for the criticality of value-added manufacturing, engineering and trade as the economic foundations of thriving societies. Within Global Supply Chain, Jackie sponsors targeted advancement programs to address challenges faced by women and unrepresented minorities in technology.

Jackie is a board director for KM Labs and on the board of advisors for Banff International Research Station, Gartner/SCM Word, Howard University Center for Supply Chain Management, and Women’s Business Enterprise National Council (WBENC). Prior to joining supply chain, Jackie held various finance positions at Intel, including CFO for Technology and Manufacturing, as well as at Hewlett Packard, Ridge Computer, and Apple.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Dr. Ann Kelleher

  • EVP & GM Technology Development
  • Intel

Dr. Ann Kelleher is the executive vice president and general manager of Technology Development at Intel Corporation. Since 2020, she is responsible for the research, development and deployment of the next-generation silicon, advanced packaging, and test technologies that power Intel’s innovation. She joined Intel in 1996 as a process engineer and has worked in areas spanning from litho, thin films, yield, to managing all of Intel’s Global operations including Fab and Assembly Test factories, supply chain and construction. She did her Ph.D. in electrical engineering from University College Cork in Ireland and her post-doc at IMEC.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Nana Tseng

  • Chief Procurement Officer
  • onsemi

Nana Tseng is Chief Procurement Officer of onsemi, a leading semiconductor company rooted in the combined heritage of Motorola and Fairchild. Today, onsemi is driven to innovate intelligent power and sensing solutions focusing in automotive and industrial markets. In her role, she is directly responsible for the procurement and supply partnership strategy, manage multibillion dollar spend ranging from capital equipment, wafer start materials, wafer fab and back end direct and indirect materials, external manufacturing services and corporate services. Prior to joining onsemi, she was the Vice President of Sales at Advanced Semiconductor Engineering (ASE), the world’s largest provider of independent manufacturing services in assembly and test. Her insights on the semiconductor ecosystem and supply chain are built upon her experience working with a broad portfolio of fabless, IDMs, OEMs and EMS companies. Her passion in this industry comes from working with innovative companies committed to bring the next revolutionary technology to the market. Nana was born in Taiwan, grew up in Saudi Arabia, educated in the US, and worked extensively in SE Asia before settling back to Silicon Valley. She has an MBA from MIT Sloan School of Management, and an undergraduate degree from UC Berkeley. In her spare time, she is also very active in her community. She is currently the Vice Chair of Monte Jade West Science and Technology Association, a nonprofit organization focusing to provide mentorship, investment and technology opportunities within the Asian American community and across the Pacific.

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onsemi

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

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Maitreyee Mahajani

Maitreyee Mahajani is Vice President of Fab Operations at Western Digital and manages the Western Digital-Kioxia (previously Sandisk-Toshiba) JV Fabs and is also responsible for managing the NAND supply strategy for Western Digital.

Prior to joining Western Digital, Maitreyee worked at Applied Materials in various technical leadership positions. She has extensive experience developing semiconductor processing equipment which includes the very first 300mm CVD W deposition system, High K/Metal Gate systems and new ALD platforms to name a few.

As Process and Device Integration Engineer at Matrix Semiconductors (Acquired by SanDisk), Maitreyee developed many innovative ideas for building 3D Memory Devices.

Maitreyee holds a Bachelor of Engineering degree from the College of Engineering in Pune, India and a Master’s degree in Material Science from University of Alabama, Tuscaloosa. She holds over 40 patents and is a recipient of YWCA TWIN award (Tribute to Women in Industry). She is on the council for Global Semiconductor Alliance (GSA) Women Leadership Initiative and actively participates in promoting women in engineering at Western Digital and through GSA.

She is based at the company’s San Jose, CA headquarters location.

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Western Digital

Western Digital Corporation is an American data storage company renowned for its innovative solutions. With a wide range of products including hard drives, solid-state drives, and data center solutions, Western Digital prioritizes data security and protection, consistently pushing the boundaries of storage technology to meet evolving customer needs.

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Ryan Rusnak

Ryan Rusnak is a software engineer with a master’s degree in Human Computer Interaction from Carnegie Mellon University. Before co-founding Airspace, Ryan wrote software solutions for the Federal Government. Throughout his career, he has built robots and other projects that have been featured in Popular Science, the Discovery Channel, NBC, BBC, WIRED, Gizmodo, and other media outlets. Ryan teamed up with Nick in 2016 to create Airspace in order to solve the two main inefficiencies in critical logistics: transparency and speed.

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Airspace

Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.

Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.

With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.

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Ahmer Syed

Ahmer Syed is a VP of Engineering at Qualcomm in Global Manufacturing Technology and Operations organization. He leads a global team responsible for packaging technology development, NPI, HVM deployment for 5G, mobile, IoT, Connectivity, Automotive, and Compute markets.

A 30+ years veteran of Semiconductor and electronics industry, Ahmer has extensive experience in developing advanced packaging technologies such as Flip Chip, WLCSP, FO-WLP, Package on Package (PoP), QFN, and System in Package (SiP). He has authored and contributed to more than 70 technical papers and articles on advanced packaging and reliability and has been a keynote speaker in various international conferences.

 

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Qualcomm

Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

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Najwa Khazal

Najwa Khazal has more than 20 years’ experience in the delivery of business transformation programs across a range of industries, including energy, aerospace and automotive, in America, China, EMEA, India and Mexico. Her successful track record in driving value creation programs spans supply chain management, product lifecycle management, process integration, digital transformation and organizational change.

Najwa joined Edwards as General Manager for the Service Technology Centres (STC) Americas organisation in April 2021, responsible for defining, implementing and facilitating the strategic initiatives needed to support the future growth of Edwards and its customers in the semiconductor industry. Najwa has responsibility for the operational performance and management of remanufacturing facilities located in Glenwillow and Hillsboro in the US, Nogales in Mexico, and Sao Paulo in Brazil.

Prior to joining Edwards, Najwa was General Manager for Collins Aerospace.

Najwa has a broad education, achieving a distinction from the Harvard Business Analytics Program, a Master of Business Administration and a Bachelor of Science in Mechanical Engineering Technology.

Najwa is a passionate advocate for STEM (science, technology, engineering, maths) education, and has spent more than a decade facilitating international business and organizational development classes for undergraduate and master level students.

Najwa is a US citizen and is based in Arizona.

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Edwards Vacuum

Edwards is a global leader of vacuum and abatement. We are proud to lead the industry, pushing the boundaries of science to deliver innovative products which are intrinsic to everyday life, working in partnership with our customers, and continually setting new standards.

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Christine Dunbar

  • SVP Global Sales
  • IQE

Christine Dunbar is currently Senior Vice President of Global Sales at IQE, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry. Christine joined IQE in August 2022.

Christine was previously at GlobalFoundries where she held various executive roles driving GF business growth towards the October 2022 IPO. She joined GlobalFoundries in July 2015 with the IBM Microlectronics Division acquisition, as the Vice President of Product Management for the RF Business Unit.

Christine graduated from Cornell University in 1996 with a bachelor’s degree in Materials Science and Engineering and has held various engineering, technical management, and executive positions throughout her career, including leadership roles in Sales, Business Development & Semiconductor Manufacturing Operations. In 2018 Christine was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award.

Christine is passionate about serving as an ambassador for her employers and the semiconductor industry writ large thru active participation and speaking engagements at various industry forums. Christine is also a passionate advocate for women in semiconductors, and has sponsored the establishment of women’s resource groups at IBM, GlobalFoundries and IQE.

Christine is also active in her community supporting causes important to her. She is a founding member of the Leadership Now Project, a group of non-partisan business leaders committed to the health of the US democracy, established in 2017. Christine also serves on the Board of Directors at the Boys and Girls Club of Burlington, Vermont. She lives in Shelburne, Vermont USA with her partner & two teenage children.

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IQE

IQE is the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry that enable a diverse range of applications across mobile handsets, global telecoms infrastructure, smart connected devices, electric vehicles, infrared and sensing applications.

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José J. García, Ph.D.

José J. García, Ph.D. is the Managing Director of Wafer Fab Sustainability and Autonomous Enterprise at Analog Devices. He received a B.S. Chemical Engineeering degree from the California Institute of Technology (Caltech) and a Ph.D. Chemical Engineering degree from Cornell University. Upon completion of his Ph.D., José joined Intel’s Portland Technology Development organization to develop Lithographic processes for 6 technologies down to the 32nm node. In 2009, José joined Maxim Integrated to help transform its Beaverton semiconductor facility (fab) to best-in-class safety, quality, output and cost levels thru various process, equipment and procurement directorship positions. Upon Analog Devices’ acquisition of Maxim Integrated in 2021, José secured critical items such as Silicon and Capital Equipment to enable a doubling of output in ADI’s internal fab network with minimal clean room expansion. José is now leading the Manufacturing 4.0 and Net Zero Manufacturing Enablement of ADI’s internal factory network.

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Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With reported revenues of more than $12 billion in FY22 and more than 24,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn and Twitter.

Analog Devices
Corporate Headquarters
One Analog Way
Wilmington, MA 01887

Phone: (781) 935-5565 / 1-800-262-5643

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Robin Davis

Robin Davis is the Director of Business Development at Deca Technologies, an industry leading semiconductor interconnect solutions company. She focuses on identifying new opportunities for the powerful miniaturization and performance benefits of Deca’s M-Series and Adaptive Patterning Technologies. Additionally, she works closely with both internal and customer R&D teams to drive next generation products and technological advances. She is both a contributor and lead inventor on many of Deca’s patents. Previously, Robin fulfilled the role of Senior Solutions Architect at Deca, where she collaborated with customers, suppliers, and Deca’s engineering team to advance package design and interconnect solutions. Robin started her career as a semiconductor packaging engineer at Lattice Semiconductor before transitioning to Advanced Packaging Tools Technical Marketing Engineer at Mentor Graphics (now Siemens EDA). Robin graduated with her BSEE from Portland State University. She is a member of the Tau Beta Pi and IEEE Eta Kappa Nu Honor Societies. Robin also serves as chair of the Diversity, Equity and Inclusivity committee for the International Microelectronics and Packaging Society (IMAPS).

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Deca Technologies

Deca is the semiconductor industry’s leading independent development, implementation and licensing provider of advanced packaging technology offering M-Series, the #1 volume fan-out technology and Adaptive Patterning, empowering designers with breakthrough ultra-high-density interconnect capability.

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Matthew Fulco

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The Economist Intelligence Unit
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Tony LoBianco

Tony is Sr Director of Global Packaging for Skyworks Solutions. His teams lead advanced packaging R&D and production for wireless semiconductor products, including cellular, infrastructure, automotive, defense, IoT, and others.

He holds degrees in Chemical Engineering from the University of Illinois Champaign-Urbana and an MBA in Technology Management.

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Skyworks Solutions

Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.

Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.

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Juan Velasquez

Juan is Sr Director of Global Industrial and Systems Engineering for Skyworks Solutions. He has 20 years of U.S. and international experience in semiconductor multi-site manufacturing. His experience ranges from strategic planning to data analytics that drive programs across different functional groups, business units and international sites. Recent initiatives include capacity planning for new technology introduction and the digital transformation of wafer manufacturing sites. He has a MS in Industrial and Operations Engineering from the University of Michigan and a BSEE from the University of California, Irvine.

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Skyworks Solutions

Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.

Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.

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Prof. Rao Tummala

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor and Director Emeritus at Georgia Tech in USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech in 1993, he was an IBM Fellow and Director of Advanced Packaging Lab(APTL), pioneering such major technologies as the industry’s first plasma display in the 1970’s and the first and next two generations of 100-chip MCM package integration, now called chiplet MCMs, in 1980″s for servers, mainframes, and supercomputers. He is the father of System-on-Package(SOP) concept Vs. System-on-chip (SOC.) As an educator, Prof. Tummala was instrumental in setting up the largest and most comprehensive Academic Center funded by NSF as the 1st and only NSF Engineering Research Center in Electronic Systems Packaging at Georgia Tech. Such a Center, under his leadership, pioneered an integrated approach to research, education, and global industry collaborations. It involved about 30 academic and full-time research faculty,200 Ph.D. and MS students and 50-70 industry and academic collaborators from US, Europe, Japan, Korea, India and Taiwan.. It educated thousands of engineers in packaging in classrooms and labs.,and produced more than 1000 engineers with Ph.D., MS and BS degrees,. He has published about 800 technical papers and invented technologies that resulted in over 110 patents and inventions. He has been pioneering glass-based electronics as the most leading-edge packaging technology beyond Silicon interposers that is targeted to go into production In 2023.

He wrote the first modern handbook in packaging, Microelectronics Packaging Handbook( McGraw-Hill,1988); then 1st undergrad textbook, Fundamentals of Microsystem Packaging(2001); the 1st book introducing the concept of SOP, Introduction to System-on-Package( 2006) and the 2nd edition of Fundamentals of Device and Systems Packaging (2020). He received more than 50 Industry, Academic and Professional Society awards, including. 12Invention and 4 Corporate Awards from IBM, IEEE Award David Sarnoff Award for Industry’s First MCM in 1991 ,ASM-International: Engineering Materials Achievement Award for LTCC in 1992,IEEE CPMT: Sustained Technical Achievement Award in 1992,European Electronic Materials Award from DVM in 1995,,International Microelectronic & Packaging Society’s (IMAPS): Dan Hughes Award in 1997,American Ceramic Society’s John Jeppson Award in 1998,IMAPS’: John A. Wagnon’s Award in 1991,IMAPS: John A. Wagnon’s Award , Named by US News and World Report as one of the 50 Stars in US for US competitiveness in 1999,Total excellence in Manufacturing Award from ASE in 2000,Educator of the Year for Excellence in Teaching, Research, and Innovation in Electronics from the India-America Cultural Association in 2002 andTechno-visionary Award from Semiconductor Industry Association of India in 20110. In addition, he is a distinguished Alumni of

Indian Institute of Science, Bangalore in 2000 , India,;University of. Illinois in 1988 and Distinguished Faculty of Georgia Tech in 2002

He is a member of NAE in USA. And NAE in India and IEEE, IMAPS and Am Ceramic Society Fellow, and President of IEEE CPMT and IMAPS Societies. He has been a consultant and advisor to many of Fortune 500 semiconductor and systems companies

IEEE recently named him as the father of modern Packaging and created a technical field award in his name—IEEE Rao Tummala Electrronics Packaging Award’

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Georgia Institute of Technology
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Sunil Banwari

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