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Chris Camacho

Chris Camacho serves as president & CEO of the Greater Phoenix Economic Council (GPEC), one of the longest-standing public-private partnerships for economic development across the country. As chief executive, Chris leads the development and execution of the region’s strategic economic strategy, oversees domestic and international business development, and ensures the market position remains competitive through coordination with partner organizations, private sector leaders, and municipal and state leadership. GPEC has attracted more than 540 companies during his tenure, creating more than 100,000 jobs and $56.8 billion in capital investment. Some notable projects include TSMC, Apple, LG Energy Solutions, Microsoft, GoDaddy, Amazon, Garmin, General Motors, HelloFresh, KORE Power, Williams-Sonoma and headquarters including Benchmark Electronics, Carlisle Companies, Rogers Corporation and EMD Electronics. In October 2021, Chris led GPEC to being recognized as the top economicdevelopment organization globally by the International Economic Development Council a year after being named the top EDO in the U.S. in 2020.

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Greater Phoenix Economic Council (GPEC)

Established in 1989, the Greater Phoenix Economic Council (GPEC) actively works to attract and grow quality businesses and advocate for the competitiveness of Greater Phoenix. As the regional economic development organization, GPEC works with 22 member communities, Maricopa County and almost 200 private investors to accomplish its mission, and serve as a strategic partner to companies across the world as they expand or relocate. Consistently ranked as a top national economic development organization, GPEC’s approach to connectivity extends beyond the fabric of the community. Known as The Connected Place, Greater Phoenix is in a relentless pursuit of innovative and entrepreneurial technology-focused companies that are committed to changing the game. As a result, over the past 32 years GPEC has fueled the regional economy by helping more than 895 companies, creating more than 163,000 jobs and $33.4 billion in capital investment.

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Dr. Raja Swaminathan

  • CVP, Advanced Packaging
  • AMD

Dr. Raja Swaminathan is AMD’s CVP of Packaging driving the development of AMD’s industry leading advanced packaging roadmap. At Intel, Apple, and now AMD, his design-technology co-optimization expertise and relentless pursuit of PPAC optimization (power, performance, area, and cost) have fueled breakthroughs like EMIB, Apple’s Mx packages, 3D V-Cache, and the recently announced 3.5D architectures for AI. A Carnegie Mellon PhD and IIT Madras alumnus, Raja has over 100 patents and 40 publications. Recognized as an IEEE Senior Member and trusted advisor to startups, Raja’s passion for heterogeneous integration is consistently pushing capabilities of silicon.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Dr. Babak Sabi

Dr. Babak Sabi is a Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development.

Babak joined Intel in 1984. Prior to leading ATTD, he oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.

Babak received his Ph.D. in solid state electronics from Ohio State University in 1984. He has authored ten papers on reliability physics and has received five Intel Achievement Awards. He currently holds two patents.

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Intel Corporation

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Naga Chandrasekaran

Naga Chandrasekaran is senior vice president of technology development at Micron Technology. Dr. Chandrasekaran leads Micron’s global technology development and engineering efforts related to the scaling of current memory technologies, advanced packaging technology, as well as investigating emerging memory technology solutions to support Micron’s future requirements. He also manages mask technology development, corporate characterization labs, advanced modeling and data analytics, and R&D fabrication operations at Micron’s headquarters in Boise, Idaho. He was appointed to his current position in 2019.

In 2001, Dr. Chandrasekaran joined Micron as a CMP development engineer and since then has held a series of positions of increasing responsibility in process and equipment development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED and display technology. From 2007 to 2008, he also served as fab engineering manager for IM Flash, Singapore Operations. He most recently served as senior vice president of process research and technology development.

Dr. Chandrasekaran has authored several keynote publications and patents, and he has served as an invited panel speaker at several conferences. He has also received several awards, including Jiri Tlusty Outstanding Young Manufacturing Engineer of the Year, awarded by the Society of Manufacturing Engineers in 2003, and Engineering Manager of the Year, awarded by the American Society of Engineering Management (ASEM) in 2018.

Dr. Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras. He earned both a master’s and a doctorate degree in mechanical engineering from Oklahoma State University and dual executive MBAs from the University of California, Los Angeles (UCLA-Anderson School of Management) and the National University of Singapore.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Thomas Sonderman

Thomas Sonderman is the president and CEO of SkyWater Technology, a U.S.-owned and operated pure-play semiconductor manufacturer and a DOD-accredited Trusted supplier. He joined SkyWater in 2017 as the lead executive, driving the company’s successful business transformation from an IDM to a pure play foundry. He has effectively diversified SkyWater’s customer base by defining new product markets and target customers while simultaneously improving operational efficiencies. Mr. Sonderman has leveraged SkyWater’s U.S-based manufacturing operations to expand the company’s government business and to focus on reinstating a strong domestic commercial manufacturing presence. He has built a world class leadership team that inspires over 500 employees to deliver process R&D innovation and operational excellence.

Mr. Sonderman’s extensive industry experience in all aspects of fab operations has delivered market leadership and increased shareholder value to high-technology industry leaders Rudolph Technologies, Globalfoundries and AMD. Notably, he played a critical role serving as part of an executive team at AMD that spun-off manufacturing operations to form Globalfoundries.

A widely recognized subject matter expert, Mr. Sonderman is the author of 50 patents and a highly sought-after industry speaker. He received a Bachelor of Science degree in chemical engineering from Missouri University of Science Technology and a Master of Science degree in electrical engineering from National Technological University.

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SkyWater Technology

SkyWater (NASDAQ: SKYT) is a U.S.-owned semiconductor manufacturer and a DOD-accredited Trusted supplier. SkyWater’s Technology as a Servicesm model streamlines the path to production for customers with development services, volume production and advanced packaging solutions in its world-class U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology with diverse categories including mixed-signal CMOS, read-out ICs, rad-hard, power discretes, MEMS, superconducting ICs, photonics, carbon nanotubes and interposers. SkyWater serves growing markets including aerospace & defense, automotive, biomedical, cloud & computing, consumer, industrial and loT. For more information, visit: www.skywatertechnology.com.

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Dr. Jun He

  • VP Quality & Reliability, Advanced Packaging Technology & Service
  • TSMC

Dr. Jun He is Vice President of Quality & Reliability as well as Advanced Packaging Technology & Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management. Within the Q&R scope, his function covers incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Besides overseeing all TSMC advanced packaging and testing manufacturing, his backend team is also accountable for key building blocks including bump/passivation/RDL process innovations and test technology development. Seamless collaboration and joint development with external partners across material, OSAT and substrate supply chain is one of his focus areas to enable customers’ product innovations at system level.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations.

Dr. He holds over 40 patents globally and published 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Claudionor Coelho

  • Chief AI Officer, SVP of Engineering
  • Advantest

Claudionor N. Coelho is the Chief Artificial Intelligence Officer and SVP of Engineering at Advantest, being responsible for AI strategy for Advantest and leading engineering for ACS.

Previously, he was the VP/Fellow for AI – Head of AI Labs at Palo Alto Networks, where he led AI and Neurosymbolic innovation for AIOps products at Palo Alto Networks. He also led the creation of next-generation time series analysis tools at scale (MLOps on GCP) integrated with knowledge graphs and formal technology.

He worked on Machine Learning/Deep Learning at Google. He is the creator of QKeras, a Deep Learning package for quantization on top of Keras with support for automatic quantization, being used by CERN (which made it to the cover page of Nature Machine Intelligence in August 2021). He was the VP of Software Engineering, Machine Learning, and Deep Learning at NVXL Technology. He did seminal work on AI at Synopsys Inc, and he opened the site for Cadence Design Systems in Brazil, being the GM for the site, following the acquisition of Jasper Design Automation, where he was the Worldwide SVP of R&D. Under his leadership, Jasper was awarded one of the most innovative companies in the US in 2013, according to Red Herring.

He created the initial strategy for Kunumi (when he was an angel investor), and he is an investor and is on the TAB of ConDati. He has more than 100 papers, patents, academic, and industry awards. He is currently an Invited Professor for Deep Learning at Santa Clara University, and previously, he was an Associate Professor of Computer Science at UFMG, Brazil, when he took the ACM Programming Contest to the Southern Hemisphere. He has a Ph.D. in EE/CS from Stanford University, an MBA from IBMEC Business School, and an MSCS and BSEE (summa cum laude) from UFMG, Brazil.

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Advantest

Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

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Ryan Rusnak

Ryan Rusnak is a software engineer with a master’s degree in Human Computer Interaction from Carnegie Mellon University. Before co-founding Airspace, Ryan wrote software solutions for the Federal Government. Throughout his career, he has built robots and other projects that have been featured in Popular Science, the Discovery Channel, NBC, BBC, WIRED, Gizmodo, and other media outlets. Ryan teamed up with Nick in 2016 to create Airspace in order to solve the two main inefficiencies in critical logistics: transparency and speed.

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Airspace

Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.

Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.

With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.

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Deepak Kulkarni

  • Senior Fellow Advanced Packaging
  • AMD

Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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José J. García, Ph.D.

José J. García, Ph.D. is the Managing Director of Wafer Fab Sustainability and Autonomous Enterprise at Analog Devices. He received a B.S. Chemical Engineeering degree from the California Institute of Technology (Caltech) and a Ph.D. Chemical Engineering degree from Cornell University. Upon completion of his Ph.D., José joined Intel’s Portland Technology Development organization to develop Lithographic processes for 6 technologies down to the 32nm node. In 2009, José joined Maxim Integrated to help transform its Beaverton semiconductor facility (fab) to best-in-class safety, quality, output and cost levels thru various process, equipment and procurement directorship positions. Upon Analog Devices’ acquisition of Maxim Integrated in 2021, José secured critical items such as Silicon and Capital Equipment to enable a doubling of output in ADI’s internal fab network with minimal clean room expansion. José is now leading the Manufacturing 4.0 and Net Zero Manufacturing Enablement of ADI’s internal factory network.

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Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With reported revenues of more than $12 billion in FY22 and more than 24,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn and Twitter.

Analog Devices
Corporate Headquarters
One Analog Way
Wilmington, MA 01887

Phone: (781) 935-5565 / 1-800-262-5643

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Len Tedeschi

Len Tedeschi is vice president and general manager, Core Packaging Products at Applied Materials. Len is directly responsible for the Metals Packaging Products (MPP), Packaging Plating & Cleans (PPC), Tango & Plasma Dicing product groups. His focus is ensuring customers are successful with their current products, while simultaneously solving customer’s future high value problems.

Len has worked at Applied for >20 years and has over 27 years of semiconductor experience in roles ranging from product development & support, productivity, technical strategy, marketing, and general management. Len has worked with a variety of products and technologies including etch, deposition, lithography, metrology, and inspection.

Prior to joining Packaging, Len spent 14 years in Applied’s Etch Business Unit in a wide variety of customer focused positions. Len has >10 patents granted, mainly as the lead author.

Len began his career in 1995 as a lithography equipment engineer at IDT in Santa Clara, California.

He earned a bachelor of science degree in industrial technology from San Jose State University in 1995, where he served as captain of the university’s judo team, winning two collegiate national titles, and competing in the 1996 Olympic Judo Trials.

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Applied Materials

We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.

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Zachary Holman, Ph.D.

Zachary Holman is an Associate Professor in the School of Electrical, Computer, and Energy Engineering at Arizona State University, as well as the Director of Faculty Entrepreneurship within the Fulton Schools of Engineering. He received his Ph.D. in Mechanical Engineering from the University of Minnesota for his work on plasma-synthesized silicon and germanium nanocrystals, after which he spent two years as a postdoctoral researcher developing high-efficiency silicon solar cells at Ecole Polytechnique Fédérale de Lausanne in Switzerland. His research group at ASU focuses on new materials, processes, and device designs for high-efficiency silicon solar cells and silicon-based tandem solar cells. He has been named a Moore Inventor Fellow, Trustees of ASU Professor, Fulton Entrepreneurial Professor, and Joseph C. Palais Distinguished Faculty Scholar. He is the co-founder of two solar start-up companies (Sunflex Solar and Beyond Silicon) and an advanced materials start-up company (Swift Coat).

Education
  • Ph.D. Mechanical Engineering, University of Minnesota 2010
  • B.A. Physics, Reed College 2005
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Arizona State University

With 110,000+ undergraduate students, 30,000+ graduate and professional students, and 5,000+ faculty, Arizona State University (ASU) exemplifies a new prototype for the American public research university. At ASU, our culture of innovation and inclusion draws pioneering researchers to our faculty and attracts highly qualified students from all 50 states and more than 130 nations. ASU is expanding academic and entrepreneurial opportunities for every type of learner at all stages of life. Creating a resilient microelectronics innovation ecosystem is critical to America’s security and economic competitiveness. Arizona State University is responding to this need by working with industry and government partners to reestablish America’s capacity for domestic microelectronics and semiconductor manufacturing and innovation. ASU offers traditional degree programs and rapid, low-cost options for upskilling and re-skilling of the existing semiconductor workforce, as well as workers from outside the industry.

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Jon Hander

Jon Hander is Assistant Vice President of Panel Products for ASM NEXX. He has worked at NEXX since 2011 and in the semiconductor industry since 1996. In his career, Jon has served in manufacturing, service, process, sales, development & product management roles. Jon has a BS in Engineering Technology from Texas A&M University.

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ASMPT Limited

ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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Rebeca Obregon-Jimenez

  • SVP Strategic Business Engagements and Supplier Management
  • Avnet

Rebeca Obregon-Jimenez is Avnet’s senior vice president of strategic business engagements and supplier management. She creates strong, long-lasting relationships for the Avnet Integrated, Avnet United and Avnet Velocity business units. She also oversees supplier management for the Interconnect, Passive & Electromechanical (IP&E) business and drives strategy, mergers and acquisitions across the organization.

With more than 30 years of experience in the semiconductor industry, Obregon-Jimenez has built and grown teams and businesses from inception to profitable worldwide market leaders. Before joining Avnet, she served as a corporate vice president at Amkor Technology. She also held a variety of strategy, management, operations and engineering roles at IDT and Motorola.

Obregon-Jimenez earned a bachelor’s degree in electrical engineering from Arizona State University and a master’s degree in electrical engineering from the National Technological University. She serves on the board of directors of FormFactor, Inc., a provider of essential test and measurement technology for integrated circuits.

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Avnet

Avnet (Nasdaq: AVT) is a leading global technology distributor and solutions provider that has served customers’ evolving needs for more than a century. Avnet’s position at the center of the technology value chain enables it to accelerate the design and supply stages of product development so customers can realize revenue faster. Headquartered in Phoenix, Arizona, Avnet serves more than 1 million customers in more than 140 countries and partners with global suppliers from almost every technology segment. At the close of FY22, Avnet generated $24.3 billion in sales and operated 12 major distribution centers, 11 technology campuses, six programming centers, and 250+ facilities in 45+ countries. Learn more about Avnet at www.avnet.com

(480) 643-2000

Corporate.Communications@Avnet.com

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Mark Wade

Mark is Chief Executive Officer and Co-Founder of Ayar Labs. His prior roles at Ayar Labs include Chief Technology Officer and Senior Vice President of Engineering. He is recognized as a pioneer in photonics technologies and, prior to founding the company, led the team that designed the optics in the world’s first processor to communicate using light. He and his co-founders invented breakthrough technology at MIT and UC Berkeley from 2010-2015 which led to the formation of Ayar Labs. He holds a PhD from University of Colorado.

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Ayar Labs

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power. Ayar Labs’ patented approach uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O. The company was founded in 2015 and is funded by a number of domestic and international venture capital firms as well as strategic investors. For more information, visit www.ayarlabs.com.

Address: 695 River Oaks Parkway, San Jose, CA 95134
Phone: 650-963-7200
Email: info@ayarlabs.com

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Enrico Härtel

  • Director Global Key Account Management
  • Comet

Enrico Haertel is the Director of Global Key Account Management at Comet YXLON. Focusing on x-ray inspection tasks, he is working with customers on solutions to reduce time-to-market and increase yield.

He began his career in the FinTech industry, introducing, among others, contactless payment technology into the European market. Then, switching gears in 2011, he joined the field of inspection solutions for the Semiconductor and SMT world, gaining expertise in testing solutions like wafer probe cards and optical and x-ray inspection.

 

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Comet

Building on decades of experience and an unfailing passion for technology, Comet Yxlon is a globally leading company for industrial X-ray and CT system solutions. Manufacturers in the aerospace, automotive, electronics, and semiconductor industries rely on Comet Yxlon to maximize their product quality and the efficiency of their production. From cutting-edge inspection systems to the award-winning user interface Geminy – at Comet Yxlon, we support our customers with innovative products and services that help them shape future markets.

From single die traditional packages to wafers and advanced packaging devices – we supply manufacturers with X-ray inspection systems that meet the high standards of semiconductor quality control. Speed, resolution, 2D or 3D – depending on the application, manufacturers have different priorities for the inspection of semiconductor products. We offer a variety micro- and nano-focus inspection systems providing digital radioscopy, computed laminography, and computed tomography for optimum test results for increased yield.

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Robin Davis

Robin Davis is the Director of Business Development at Deca Technologies, an industry leading semiconductor interconnect solutions company. She focuses on identifying new opportunities for the powerful miniaturization and performance benefits of Deca’s M-Series and Adaptive Patterning Technologies. Additionally, she works closely with both internal and customer R&D teams to drive next generation products and technological advances. She is both a contributor and lead inventor on many of Deca’s patents. Previously, Robin fulfilled the role of Senior Solutions Architect at Deca, where she collaborated with customers, suppliers, and Deca’s engineering team to advance package design and interconnect solutions. Robin started her career as a semiconductor packaging engineer at Lattice Semiconductor before transitioning to Advanced Packaging Tools Technical Marketing Engineer at Mentor Graphics (now Siemens EDA). Robin graduated with her BSEE from Portland State University. She is a member of the Tau Beta Pi and IEEE Eta Kappa Nu Honor Societies. Robin also serves as chair of the Diversity, Equity and Inclusivity committee for the International Microelectronics and Packaging Society (IMAPS).

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Deca Technologies

Deca is the semiconductor industry’s leading independent development, implementation and licensing provider of advanced packaging technology offering M-Series, the #1 volume fan-out technology and Adaptive Patterning, empowering designers with breakthrough ultra-high-density interconnect capability.

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Dr. Bobby Mitra

Dr. Bobby Mitra is currently Managing Director at Deloitte Consulting, and Consulting leader for Global Semiconductor & Hi-Tech Manufacturing, Supply-Chain and Engineering Practice. Prior to his current role, he was at Texas Instruments as the Worldwide Director of Smart Manufacturing across TI’s 300mm & 200mm wafer fabs and assembly/test sites. In this role, he led several activities around manufacturing automation, multi-year factory-of-the-future roadmap, quality/yield improvement, asset utilization, cycle time optimization, manufacturing productivity etc.

Prior to that, he led TI’s worldwide Industrial Systems across 14 sectors, including factory automation, motor control, smart grid, building automation, test & measurement, medical, appliances etc. He had also led all of Texas Instruments’ operations in India as President & Managing Director, leading all R&D, Sales, Marketing, Research etc.

Dr. Mitra was elected IEEE Fellow, and is Chairman of SEMI Global & Americas Smart Manufacturing. He holds a B.Tech degree in Electronics & Electrical Communications Engineering, and Ph.D in Computer Science & Engineering, both from Indian Institute of Technology (IIT), and an Executive MBA from University of Texas at Austin.

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Deloitte

Deloitte provides industry-leading audit, consulting, tax and advisory services to many of the world’s most admired brands, including nearly 90 percent of the Fortune 500® and more than 7,000 private companies. Our people come together for the greater good and work across the industry sectors that drive and shape today’s marketplace delivering measurable and lasting results that help reinforce public trust in our capital markets, inspire clients to see challenges as opportunities to transform and thrive, and help lead the way toward a stronger economy and a healthier society. Deloitte is proud to be part of the largest global professional services network serving our clients in the markets that are most important to them. Building on more than 175 years of service, our network of member firms spans more than 150 countries and territories. Learn how Deloitte’s more than 330,000 people worldwide connect for impact at www.deloitte.com.

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Matthew Fulco

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The Economist Intelligence Unit
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Najwa Khazal

  • General Manager STC Americas
  • Edwards

Najwa Khazal has more than 20 years’ experience in the delivery of business transformation programs across a range of industries, including energy, aerospace and automotive, in America, China, EMEA, India and Mexico. Her successful track record in driving value creation programs spans supply chain management, product lifecycle management, process integration, digital transformation and organizational change.

Najwa joined Edwards as General Manager for the Service Technology Centres (STC) Americas organisation in April 2021, responsible for defining, implementing and facilitating the strategic initiatives needed to support the future growth of Edwards and its customers in the semiconductor industry. Najwa has responsibility for the operational performance and management of remanufacturing facilities located in Glenwillow and Hillsboro in the US, Nogales in Mexico, and Sao Paulo in Brazil.

Prior to joining Edwards, Najwa was General Manager for Collins Aerospace.

Najwa has a broad education, achieving a distinction from the Harvard Business Analytics Program, a Master of Business Administration and a Bachelor of Science in Mechanical Engineering Technology.

Najwa is a passionate advocate for STEM (science, technology, engineering, maths) education, and has spent more than a decade facilitating international business and organizational development classes for undergraduate and master level students.

Najwa is a US citizen and is based in Arizona.

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Edwards

Edwards is a global leader of vacuum and abatement. We are proud to lead the industry, pushing the boundaries of science to deliver innovative products which are intrinsic to everyday life, working in partnership with our customers, and continually setting new standards.

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Ramin Farjadrad

Ramin Farjadrad, president and co-founder of Eliyan Corporation. Ramin, a previous speaker at ISES, is the founding CEO of Eliyan, a start-up focused on addressing interconnect challenges in multi-die architectures. He is the inventor of over 140 granted and pending patents in communications and networking and has a successful track record of creating differentiating connectivity technologies adopted by the industry as international standards (including two Ethernet standards at IEEE, and the BoW chiplet connectivity adopted by OCP.) Prior to Eliyan, Ramin co-founded Velio Communications, which led to a Rambus/LSI Logic acquisition, and Aquantia, which IPO’d and was acquired by Marvell Technologies. Ramin has a Ph.D. EE from Stanford.

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Eliyan

Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient interconnect on multi-die architectures, is leading the chiplet revolution by enabling the creation of ultimate chiplet systems. Its technology addresses the fundamental challenges with semiconductor scaling to meet the needs of high-performance computing applications, from desktop to datacenter. It has developed a breakthrough method to enable the industry’s highest performing interconnect for homogenous and heterogenous multi-die architectures, enabling increased sustainability through reduction in costs, manufacturing waste and power consumption. The company’s Bunch of Wires (BoW) PHY, invented by founder Ramin Farjadrad and proven to increase performance by 2x and reduce power in half, provides a more efficient approach to developing chiplet-based architectures. The company has received initial funding from strategic investors, including Intel Capital and Micron Ventures, and venture capital firms Tracker Capital Management and Celesta Capital. It is based in Santa Clara, California.

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Kunal Chakrabarti

Mr. Chakrabarti is a Managing Director in the firm’s corporate advisory business focusing on the Technology sector.

Mr. Chakrabarti has advised leading technology firms and financial sponsors on M&A and capital markets transactions including Mobileye on its $961M IPO, NxEdge on its $850M sale to Enpro, AvePoint on combination with Apex Technology and subsequent public listing, Conservice on sale of TA Associates’ equity stake to Advent International, Conservice on its sale of majority stake to TA Associates, Enersys on the $750M acquisition of Alpha Technologies Group of Companies, Akamai on its defense and cooperation agreement with Elliott Management, Cobham on its $455M divestiture of AvComm and Wireless businesses to Viavi, Samsung on the $9B acquisition of Harman, Qualcomm on the $49B announced (and subsequently cancelled) acquisition of NXP Semiconductors, Sonus on a merger of equals with Genband, Siris Capital’s $943M acquisition of PGi, Cbeyond on its $323M sale to Birch, and financing of TPG led group’s acquisition of Cirque du Soleil.

Prior to Evercore, Mr. Chakrabarti was an Associate Director at UBS in their Technology, Media and Telecommunications Group in New York. He holds a MBA from Cornell University’s SC Johnson Graduate School of Management and a BA in Economics from University of Delhi, India.

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Evercore

Evercore Inc., formerly known as Evercore Partners, is a global independent investment banking advisory firm founded in 1995 by Roger Altman, David Offensend, and Austin Beutner. Evercore’s Investment Banking business advises its clients on mergers and acquisitions, divestitures, restructurings, financings, public offerings, private placements and other strategic transactions and also provides institutional investors with macro and fundamental equity research, sales and trading execution. Evercore’s Investment Management business comprises wealth management, institutional asset management and private equity investing. Evercore serves clients from 28 offices in North America, Europe, South America and Asia. Since 1995, the firm has advised on more than $3 trillion of merger, acquisition, recapitalization, and restructuring transactions.

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Tom Stokes

Tom Stokes is a Senior Managing Director of Evercore’s corporate advisory business and co-leads the Technology Banking Group in New York.

Tom is focused on advising clients across the technology sector.

Prior to joining Evercore in 2015, Tom was a Managing Director in the Investment Banking Division at Goldman, Sachs & Co., where he served as global head of Electronics and Industrial Technology Investment Banking. With over 25 years of relevant experience and over 13 years at Goldman Sachs, Tom has extensive experience advising companies across the technology industry. In particular, he has advised on a number of the most notable recent transactions across the semiconductor, electronics and industrial tech subsectors. Clients represented by Tom include Advanced Energy, Aeroflex, Anaren, Amphenol, AZ Electronic Materials, Azenta, Belden, Brooks, CDW, Cobham, Corning, Dover, Dupont, Edwards, Entegris, Fortive, Freescale, IBM, Lam Research, Lexmark, Macom, Molex, Keysight, Koch Industries, TE Connectivity, Samsung, Sensata, Solectron, Tokyo Electron, Universal Display and Viasystems, among others.

Tom received his BA, MA and MEng degrees (First Class) in Engineering from Cambridge University and received his MBA degree from Kellogg School of Management.

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Evercore

Evercore Inc., formerly known as Evercore Partners, is a global independent investment banking advisory firm founded in 1995 by Roger Altman, David Offensend, and Austin Beutner. Evercore’s Investment Banking business advises its clients on mergers and acquisitions, divestitures, restructurings, financings, public offerings, private placements and other strategic transactions and also provides institutional investors with macro and fundamental equity research, sales and trading execution. Evercore’s Investment Management business comprises wealth management, institutional asset management and private equity investing. Evercore serves clients from 28 offices in North America, Europe, South America and Asia. Since 1995, the firm has advised on more than $3 trillion of merger, acquisition, recapitalization, and restructuring transactions.

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Amy Leong

  • Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
  • Formfactor

Amy Leong has been with FormFactor since October 2012. Prior to this, Amy was the VP of Marketing at MicroProbe from April 2010 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Before joining MicroProbe, Ms. Leong worked at Gartner, Inc. as a Research Director from 2008 to 2010 and covered the ASSP system-on-chip and microcontroller markets. From 2003 to 2008, Ms. Leong worked at FormFactor where she served as Senior Director of Corporate Strategic Marketing and Director of DRAM Product Marketing. Prior to FormFactor, Ms. Leong worked in a variety of semiconductor process engineering and product marketing roles at KLA-Tencor and IBM.

Ms. Leong holds an M.S. in Material Science and Engineering from Stanford University and a B.S. in Chemical Engineering from the University of California, Berkeley.

 

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Formfactor

FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from metrology and inspection, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge.

FormFactor’s leading-edge probe stations, probes, probe cards, optical metrology and inspection, advanced thermal subsystems, quantum cryogenic systems, and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips.

Visit www.formfactor.com.

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Prof. Rao Tummala

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor and Director Emeritus at Georgia Tech in USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech in 1993, he was an IBM Fellow and Director of Advanced Packaging Lab(APTL), pioneering such major technologies as the industry’s first plasma display in the 1970’s and the first and next two generations of 100-chip MCM package integration, now called chiplet MCMs, in 1980″s for servers, mainframes, and supercomputers. He is the father of System-on-Package(SOP) concept Vs. System-on-chip (SOC.) As an educator, Prof. Tummala was instrumental in setting up the largest and most comprehensive Academic Center funded by NSF as the 1st and only NSF Engineering Research Center in Electronic Systems Packaging at Georgia Tech. Such a Center, under his leadership, pioneered an integrated approach to research, education, and global industry collaborations. It involved about 30 academic and full-time research faculty,200 Ph.D. and MS students and 50-70 industry and academic collaborators from US, Europe, Japan, Korea, India and Taiwan.. It educated thousands of engineers in packaging in classrooms and labs.,and produced more than 1000 engineers with Ph.D., MS and BS degrees,. He has published about 800 technical papers and invented technologies that resulted in over 110 patents and inventions. He has been pioneering glass-based electronics as the most leading-edge packaging technology beyond Silicon interposers that is targeted to go into production In 2023.

He wrote the first modern handbook in packaging, Microelectronics Packaging Handbook( McGraw-Hill,1988); then 1st undergrad textbook, Fundamentals of Microsystem Packaging(2001); the 1st book introducing the concept of SOP, Introduction to System-on-Package( 2006) and the 2nd edition of Fundamentals of Device and Systems Packaging (2020). He received more than 50 Industry, Academic and Professional Society awards, including. 12Invention and 4 Corporate Awards from IBM, IEEE Award David Sarnoff Award for Industry’s First MCM in 1991 ,ASM-International: Engineering Materials Achievement Award for LTCC in 1992,IEEE CPMT: Sustained Technical Achievement Award in 1992,European Electronic Materials Award from DVM in 1995,,International Microelectronic & Packaging Society’s (IMAPS): Dan Hughes Award in 1997,American Ceramic Society’s John Jeppson Award in 1998,IMAPS’: John A. Wagnon’s Award in 1991,IMAPS: John A. Wagnon’s Award , Named by US News and World Report as one of the 50 Stars in US for US competitiveness in 1999,Total excellence in Manufacturing Award from ASE in 2000,Educator of the Year for Excellence in Teaching, Research, and Innovation in Electronics from the India-America Cultural Association in 2002 andTechno-visionary Award from Semiconductor Industry Association of India in 20110. In addition, he is a distinguished Alumni of

Indian Institute of Science, Bangalore in 2000 , India,;University of. Illinois in 1988 and Distinguished Faculty of Georgia Tech in 2002

He is a member of NAE in USA. And NAE in India and IEEE, IMAPS and Am Ceramic Society Fellow, and President of IEEE CPMT and IMAPS Societies. He has been a consultant and advisor to many of Fortune 500 semiconductor and systems companies

IEEE recently named him as the father of modern Packaging and created a technical field award in his name—IEEE Rao Tummala Electrronics Packaging Award’

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Georgia Institute of Technology
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Tal Levin

Tal Levin serves as the Executive Vice President at Green Technology Investments LLC (GTi), headquartered in Scottsdale, Arizona, USA. GTI specializes in AMAT Metrology, encompassing a range of cutting-edge technologies such as SEMVision, Defect Review “DR-SEM,” VeritySEM, Critical Dimension SEM “CD-SEM”, and Compass & ComPLUS, Darkfield Inspection systems.

Having co-founded GTI in 2012, Tal has played a pivotal role in driving global sales initiatives until recently, when he shifted his focus to overseeing the technology roadmap and strategic procurement activities for both domestic and international clients.

In line with GTI’s growth strategy in 2023, the company underwent a transformation, establishing two distinct divisions: Metrex and RT-Ex. Additionally, GTI secured exclusive representation rights for the etrology™ software measurement solutions.

With over 32 years of experience in the semiconductor industry, Tal Levin is a seasoned executive with a profound understanding of semiconductor processes. His expertise extends to establishing and managing global service and sales networks, particularly in key regions such as China, Taiwan, and Southeast Asia.

Throughout his extensive career, Tal has held significant positions at notable companies including H.T.M., Norcimbus Inc., OEM Group, and GTI, where he and the team have developed several patent applications aimed at process enhancement and measurement refinement.

Tal Levin exemplifies excellence in management, strategic planning, and international business development within the semiconductor industry, serving as a benchmark for leadership and innovation.

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GTI (Green Technology Investments)

Green Technology Investments LLC (GTI), headquartered in Scottsdale, Arizona has announced the creation of two new subsidiaries which will operate under the GTI Umbrella: METREX and RT Experts (RT-EX). GTI also became the exclusive representative for the etrology™software product line.

These new companies aim to revitalize and support (for the next 20 years) the legacy product line for metrology tools through innovative remanufacturing and software solutions.

etrology™ aims to revolutionize semiconductor metrology measurement capabilities with a stand-alone 3rd party solution – capable of being integrated into any existing tool in the field.

METREX is a company that provides metrology solutions for Applied Materials platforms. They offer fully remanufactured systems, an extensive inventory of spare parts, expert service support, and foundry capabilities. Their systems include SEMVision Defect Review Tools, VeritySEM Critical Dimension Tools, and Compass/Complus Darkfield Inspection Tools.

RT Experts (RT-EX) specializes in the remanufacturing of semiconductor MASK systems, enabling customers to access advanced technology.

They also offer a wide range of spare parts – including consumables and non-consumables – as well as upgrades for legacy and obsolete parts. Additionally, they provide hardware and application support, flexible service support contracts, tool relocation, and startup services. GTI provides training in hardware maintenance, equipment tasks, and troubleshooting, as well as advanced applications and process development. They also have a foundry and a demonstration lab that can handle wafers of various sizes, exotic materials, special wafer thicknesses, and post-CMP process development for SIC and GaN.

With offices in North America, Europe, and Asia, The GTI companies are well-positioned to serve customers around the globe.

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Mario Morales

  • Group VP, Enabling Technologies and Semiconductors
  • IDC

Mario Morales is the group vice president of IDC’s enabling technologies, semiconductor, storage, and DataSphere research.

He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and AI semiconductors.

BACKGROUND

Mr. Morales is an accomplished program vice president, manager, and industry expert with over 25 years of experience in building a multinational top-tier consulting, sales, and research team and driving a set of established businesses. Solid experience in managing strategic partnerships and advisory services with IDC’s largest multinational clients. Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. Proven leadership skills and instrumental at establishing research and business KPIs.

Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, HW, and SW technology, and brand health and sustainability. Established relationships with technology suppliers including Intel, Samsung, TSMC, Qualcomm, Huawei, HP, AMD, NVIDIA, Microsoft, Facebook, TI, Micron, UMC, SoftBank, ARM, NXP, and others.

Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.

Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage, memory, sensors and connectivity. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, AI ML architectures, cellular baseband modems, WiFi, cellular broadband, digital consumer, foundry, EMS, and intelligent systems.

His career includes past positions with NEC Electronics and Dataquest.

EDUCATIONAL ACCOMPLISHMENTS

  • B.S. in Finance and Accounting from San Jose State University
  • Fluent in English and Spanish
  • Frequent presenter and advisor to CEOs and executive teams across his portfolio of clients
  • Strong reputation as an advisor and industry expert on Wall Street
  • IDC executive analyst for Intel and Qualcomm
  • Frequent speaker, presenter, and moderator at IDC Directions events in Asia and semiconductor industy conferences including ISS, GSA, CASPA, CISES, and SEMI
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IDC

IDC is the premier global provider of market intelligence, advisory services, and events for the information technology, telecommunications, and consumer technology markets. IDC helps IT professionals, business executives, and the investment community make fact-based decisions on technology purchases and business strategy. More than 1,100 IDC analysts provide global, regional, and local expertise on technology and industry opportunities and trends in over 110 countries worldwide. For more than 50 years IDC has provided strategic insights to help our clients achieve their key business objectives. IDC’s Insights businesses provide industry-focused advice for IT buyers in the Financial, Government, Health, Retail, Manufacturing and Energy verticals. IDC is a subsidiary of IDG, the world’s leading technology media, research, and events company. You can learn more about IDC by visiting www.idc.com.

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