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Mark Fuselier

  • SVP Technology & Product Engineering
  • AMD

Mark Fuselier is senior vice president of Technology and Product Engineering at AMD.

He is responsible for silicon and packaging technology development and new product introduction engineering.

Fuselier has more than 27 years of semiconductor industry experience and has been involved in the development and production of process technology generations spanning from 35 micron through 3nm across multiple fabs and product families. He played a central role in the development and productization of computing solutions such as multi-core CPU and GPU SoC integration, heterogenous APUs, 2.5D and 3D chip-packaging, and chiplet System in Package (SiP) integration.

Fuselier holds a Master of Science degree in electrical engineering and Master of Business Administration from the University of Texas at Austin. He is a member of IEEE and the Electron Devices Society.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Dr. Ann Kelleher

  • EVP & GM Technology Development
  • Intel

Dr. Ann Kelleher is the executive vice president and general manager of Technology Development at Intel Corporation. Since 2020, she is responsible for the research, development and deployment of the next-generation silicon, advanced packaging, and test technologies that power Intel’s innovation. She joined Intel in 1996 as a process engineer and has worked in areas spanning from litho, thin films, yield, to managing all of Intel’s Global operations including Fab and Assembly Test factories, supply chain and construction. She did her Ph.D. in electrical engineering from University College Cork in Ireland and her post-doc at IMEC.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Rehan Sheikh

  • VP, Packaging and Manufacturing Engineering
  • Microsoft

Rehan is the VP of Microsoft’s Silicon Manufacturing & Packaging Engineering (SMPE) team, leading company-wide silicon development efforts in the areas of Product and Test Engineering, Quality and Reliability, Process Technology and Foundry Interface, OSAT engineering evaluation and selection, and Packaging design and technology development. Before joining Microsoft two years ago, Rehan spent 24 years at Intel where he earned the Intel Fellow technologist title. At Intel, Rehan led manufacturing engineering and quality for 5G data center, Accelerated Computing & Graphics, and all ATOM based SOCs.

He is an advocate for diversity and inclusion, creating an environment of respect and transparency, and the mentorship of future leaders. Rehan is especially passionate about university engagement and is currently working to enhance our partnership with University of Texas at El Paso.

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Microsoft

Microsoft is a technology company whose mission is to empower every person and every organization on the planet to achieve more. Founded in 1975, we develop and support software, services, devices, and solutions that deliver new value for customers and help people and businesses realize their full potential. We offer an array of services, including cloud-based solutions that provide customers with software, services, platforms, and content, and we provide solution support and consulting services. We also deliver relevant online advertising to a global audience.

Our products include operating systems, cross-device productivity and collaboration applications, server applications, business solution applications, desktop and server management tools, software development tools, and video games. We also design and sell devices, including PCs, tablets, gaming and entertainment consoles, other intelligent devices, and related accessories.

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Dan Berger

Dan Berger has had his hand in Packaging Development for the last 36 years. After Dan graduated from Purdue in 1988 he joined IBM in East Fishkill New York where he worked until the Microelectronics division was sold to GlobalFoundries in 2015. He continued there until 2022. During that lengthy tenure Dan held numerous management and executive roles in advanced packaging including major transitions such as ceramic to organic substrates, leaded to lead free bumping, single chip modules to multichip modules, Multi-chip modules to 2.5D and 3D stacking solutions, and must recently silicon photonics co-packaged optics. Dan briefly founded a consulting company in advanced packaging in 2023 before receiving the call to join the Chips for America program in NIST as Associated Director of the NAPMP. Dan took on that roll in December of 2023.

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CHIPS for America R&D Office
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