Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
No summit linked
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Akshay Singh Ph.D.
VP, Advanced Packaging Technology Development
No summit linked
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
- Stanford Graduate School of Business Executive Program, Stanford University
- PhD and MS, Mechanical Engineering, Louisiana State University
- BE, Mechanical Engineering, Maharaja Sayajirao University
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Ji Park
SVP Memory Business Unit
No summit linked
Ji joined Amkor Technology in 2016 and presently holds the position of Senior Vice President for the Memory Business Unit. In this role, he oversees business and platform development for Memory Products. Ji brings a wealth of experience, having held leadership positions at Qualcomm, Renesas (IDT), Integrated Circuit Systems, and Texas Instruments. He is an accomplished professional, having authored numerous technical papers and being granted four patents. Ji holds a degree in electrical and electronics engineering from the University of Texas at Austin and earned his MBA from the University of Dallas.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Jackie Sturm
CVP Global Supply Chain Operations
No summit linked
Jackie Sturm leads operations for Intel’s multi-billion-dollar Global Supply Chain, which has been cited as a #8 or better for nine consecutive years in Gartner’s Supply Chain Top 25. Her international team supports Construction and Facilities sourcing, Indirect procurement, business continuity, supply chain systems and analytics, and Supply Chain Environmental and Social Governance program, which includes Intel’s first-mover Conflict Minerals initiative. Jackie is a committed advocate for the criticality of value-added manufacturing, engineering and trade as the economic foundations of thriving societies. Within Global Supply Chain, Jackie sponsors targeted advancement programs to address challenges faced by women and unrepresented minorities in technology.
Jackie is a board director for KM Labs and on the board of advisors for Banff International Research Station, Gartner/SCM Word, Howard University Center for Supply Chain Management, and Women’s Business Enterprise National Council (WBENC). Prior to joining supply chain, Jackie held various finance positions at Intel, including CFO for Technology and Manufacturing, as well as at Hewlett Packard, Ridge Computer, and Apple.
Company Profile
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
Chance Finley
VP Global Supply Chain Operations
No summit linked
Chance Finley has over 13 years of experience in the semiconductor industry. He is currently the Vice President of Supply Chain Management at onsemi, where he is leading an end-to-end supply chain transformation. Previously, he worked as Chief of Staff for Connected Secure Systems division at Infineon Technologies in Munich, Germany. Chance joined Infineion through the acquisition of Cypress Semiconductor, where he spent 10 years building progressive leadership responsibility within the supply chain. Chance graduated from the University of California, Santa Barbara with a degree in Business Management Economics.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Ben Kozy
COO
No summit linked
Ben Kozy is the Chief Operating Officer of Airspace, a tech-enabled, time-critical logistics company headquartered in Carlsbad, CA with offices in the US and Europe. Airspace works with clients requiring the most expedited shipments, including organs for transplant and airlines requiring replacement parts before departure. Prior to Airspace, Mr. Kozy spent nearly five years at McKinsey working with various transportation and logistics companies throughout the United States, where he led teams across a range of operationally-focused projects. He earned an MBA from Columbia Business School and a Bachelor of Science in systems engineering from the U.S. Naval Academy.
Company Profile
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.
With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.
From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.
Your supply chain is complicated — we make it easy for you.
Philippe Absil Ph.D.
VP imec.IC-link / imec silicon solutions
No summit linked
Philippe Absil received his Ph.D. degree from the Department of Electrical Engineering, University of Maryland, College Park, MD, USA, in 2000. His doctoral work contributed to the early demonstrations of optical semiconductor microring resonators. In the early 2000s, he developed the passive photonics platform technology for Little Optics, Inc., Annapolis Junction, MD USA. From 2013 till 2024 he was VP R&D and the head of the 3-D and Optical I/O Technologies Department at imec and has been responsible for the silicon photonics technology platform development since 2010. Before that he spent seven years managing the advanced CMOS scaling program at imec.Now, Philippe is Vice President of imec.IC-link, Silicon Solutions, that offers unique technology services, leveraging imec’s state-of-the-art semiconductor fabrication infrastructure.
Company Profile
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.
Further information on imec can be found at www.imec-int.com.
José J. García, Ph.D.
Managing Director
No summit linked
José J. García, Ph.D. is the Managing Director of Wafer Fab Sustainability and Autonomous Enterprise at Analog Devices. He received a B.S. Chemical Engineeering degree from the California Institute of Technology (Caltech) and a Ph.D. Chemical Engineering degree from Cornell University. Upon completion of his Ph.D., José joined Intel’s Portland Technology Development organization to develop Lithographic processes for 6 technologies down to the 32nm node. In 2009, José joined Maxim Integrated to help transform its Beaverton semiconductor facility (fab) to best-in-class safety, quality, output and cost levels thru various process, equipment and procurement directorship positions. Upon Analog Devices’ acquisition of Maxim Integrated in 2021, José secured critical items such as Silicon and Capital Equipment to enable a doubling of output in ADI’s internal fab network with minimal clean room expansion. José is now leading the Manufacturing 4.0 and Net Zero Manufacturing Enablement of ADI’s internal factory network.
Company Profile
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With reported revenues of more than $12 billion in FY22 and more than 24,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn and Twitter.
Chris Bailey
Professor
No summit linked
Chris Bailey joined Arizona State University in 2022 where is Professor of Advanced Semiconductor Packaging and Director of the Centre for Advanced Semiconductor Packaging. Prior to this he was Professor of Computational Mechanics & Reliability and Associate Dean for Research at the University of Greenwich, UK. Chris has published 400+ archival papers in electronics packaging and received $40M+ from Government and Industry to support his research activities. He is an associate editor for the IEEE Transactions of Components, Packaging, and Manufacturing Technology and co-chair for the Co-Design and Modelling & Simulation chapters for the Heterogeneous Integration Roadmap (HIR).
Company Profile
With 110,000+ undergraduate students, 30,000+ graduate and professional students, and 5,000+ faculty, Arizona State University (ASU) exemplifies a new prototype for the American public research university. At ASU, our culture of innovation and inclusion draws pioneering researchers to our faculty and attracts highly qualified students from all 50 states and more than 130 nations. ASU is expanding academic and entrepreneurial opportunities for every type of learner at all stages of life. Creating a resilient microelectronics innovation ecosystem is critical to America’s security and economic competitiveness. Arizona State University is responding to this need by working with industry and government partners to reestablish America’s capacity for domestic microelectronics and semiconductor manufacturing and innovation. ASU offers traditional degree programs and rapid, low-cost options for upskilling and re-skilling of the existing semiconductor workforce, as well as workers from outside the industry.
ASU is building the semiconductor talent pipeline and mobilizing the expertise and capabilities of the Fulton Schools of Engineering to drive research, development and innovation. The Fulton Schools of Engineering at Arizona State University is the largest and most comprehensive engineering school in the nation, offering 25 undergraduate degree programs, and 48 graduate degree programs. With over 30,000 students within the Fulton Schools of Engineering, 7000+ students studying microelectronics-related fields, and 150+ faculty engaged in microelectronics research and teaching. We offer extensive research facilities including our research in semiconductor manufacturing and advanced semiconductor packaging which is supported by our extensive lads which includes MacroTechnology Works with 250,000 total sq ft capacity, 43,000 sq ft clean rooms, and 23,00 sq ft wet/dry labs. We also offer graduate programs in semiconductor manufacturing, packaging, and assembly as well as certificate programs to support workforce development.
Dr. Anthony Yu
VP, Silicon Photonics Product Management
No summit linked
Dr. Anthony J. Yu is Vice President of the Silicon Photonics Product Management organization at GLOBALFOUNDRIES (GF), where he is responsible for providing differentiated silicon photonic manufacturing services and solutions to clients across multiple industries. Prior to this role, Dr. Yu was Vice President of GF’s Computing and Wired Infrastructure Business Unit.
Before joining GF, he held multiple executive positions at IBM, including Vice President of Semiconductor Technology for Engineering and Technology Services. Yu earned his BS in Physical Chemistry from the University of California-Berkeley and his PhD in Physical Chemistry / Materials Science from Cornell University.
Company Profile
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
Dr. Sanjeev Aggarwal
President & CEO
No summit linked
Dr. Sanjeev Aggarwal serves as a member of our Board of Directors and as President and Chief Executive Officer of Everspin. With over 25 years of expertise in the non-volatile memory and semiconductor industry, Sanjeev has been instrumental in shaping Everspin since its inception in 2008 through various leadership positions. Most recently, he served as the Chief Technology Officer driving product and technology roadmaps and business agreements with partners, vendors, and suppliers. As the Vice President of Technology R&D, he directed cross-functional teams to develop and qualify innovative technology and products. As Vice President of Operations, he managed manufacturing operations, supply chain, and managed joint development agreements for technology transfer and production. Before Everspin, Sanjeev was at Freescale Semiconductor and part of the team that spun out to form Everspin Technologies.
Prior to his work on MRAM, Sanjeev successfully developed and commercialized Ferroelectric memories at Texas Instruments. In 2005, he was awarded the Technical Excellence Award by the International Symposium on Integrated Ferroelectrics for his contributions to commercializing FRAM technology. Sanjeev is Senior Member, IEEE and his technical contributions include over 200 issued patents, more than 100 publications and numerous invited presentations. He graduated from Cornell University with a doctorate in Materials Science and Engineering and received his bachelors from Indian Institute of Technology, Varanasi in Ceramic Engineering.
Company Profile
Everspin Technologies, Inc. is the world’s leading provider of Magnetoresistive RAM (MRAM). Everspin MRAM delivers the industry’s most robust, highest performance non-volatile memory for industrial IoT, data center, automotive, aerospace and other mission-critical applications where data persistence is paramount. Headquartered in Chandler, Arizona, Everspin provides MRAM solutions to a large and diverse customer base. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads in the development of products based on perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. With its foundry partner, Everspin has achieved volume production of 300mm wafers down to the 22nm process node. Continued R&D investment in new, fast-growing applications such as use of STT-MRAM in AI inferencing and instant-on systems is creating new opportunity and establishing MRAM as a critical technology in the memory hierarchy.
Chris Han-Adebekun
Head of Business and Technology
No summit linked
Chris serves as VP of Business Development at Athinia. She joined at its inception in 2022, leading the development of a pioneering data collaboration platform for the semiconductor ecosystem. Chris has more than 20 years of experience in R&D, new product commercialization, and P&L management in the advanced electronics space, spanning across a wide range of materials and applications. For the last 15 years, she has dedicated her focus on semiconductor materials with Merck KGaA Darmstadt Germany, Versum Materials and Air Products. Chris consistently delivers new business growth and demonstrates successful use cases for data collaboration among material suppliers and device makers. She is passionate about innovation through digital transformation and strongly believes in lifelong learning as the engine for personal and organizational growth.
Chris holds a PhD in Chemical Engineering from University of Wisconsin-Madison and an MBA.
Company Profile
Vijay Raghunathan
Professor in the School of Electrical and Computer Engineering, Embedded Systems and IoT Lab
No summit linked
Company Profile
End of content
End of content