Boschman
- Boschman is a high-tech, engineering driven Dutch company focusing on advanced back-end semiconductor packaging solutions;
- We provide a unique one-stop-shop concept, from idea to industrialization, for semiconductor packaging activities:
- Package Development Services
- Assembly & Test Services
- Industrial Equipment
- The Global Energy Transformation is a fact, and the Electric Revolution requires next gen products, technologies, processes and materials.
- We focus on these opportunities with technology leadership in Pressure Sintering and Advanced Molding, supported by our Patented Technology (DIT, FAM, TPV,…) and unique, unparalleled packaging expertise.
Siconnex
Siconnex is one of the leading suppliers of wet chemistry equipment for etch, clean, and resist strip applications. The company’s main headquarters and production facilities are located in Austria, with additional sites in America, Japan, Malaysia, Singapore, and France. Overall, Siconnex operates in eight locations worldwide.
With over 20 years of experience, Siconnex has fully dedicated its efforts to perfecting batch spray technology—the core technology known as BATCHSPRAY®. This technology exemplifies our commitment to reducing environmental impact while maintaining high performance and efficiency.
We believe that sustainability and technological progress go hand in hand, and we combine them in our systems. As a hidden champion, we perform essential work for technology-leading companies and have a significant impact on microchip production worldwide.
Products & Services
Our systems feature a reduced footprint and are therefore chosen by our customers as a space-saving alternative. To ensure the highest possible safety for the operator, our systems are completely closed to avoid direct contact with chemicals. The combination of several processes and the optimized wafer flows is another major benefit.
Environmental protection through sustainable processes
Due to high savings in water and chemicals, our products are cost-efficient and environment friendly. Two of our greatest process advantages are shown by the following comparative examples.
METAL ETCH PROCESS
Three conventional dry etch systems can be replaced by our Acid Autoload system.
- Throughput: 58% increase
- Footprint: 81% reduced floor space
- Costs per wafer: savings of up to 25%
CLEAN PROCESS
A conventional cleaning system can be replaced by our Clean Autoload system.
- Media costs: 93% saving
- Throughput: 56% increase
- Footprint: 35% reduced floor space
- Costs per wafer: savings of up to 85%
End of content
End of content