27-28 August 2025
Suwon
2-3 December 2025 - Tokyo
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Established in 1974, Plasma-Therm is a global manufacturer of advanced plasma processing equipment, providing tailored solutions to the specialty semiconductor markets, including wireless, power devices, photonics, sensors, and MEMS, advanced packaging, memory, and R&D. Plasma-Therm’s products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base.
Phone: +1 727-577-4999 or information@plasmatherm.com
Plasma-Therm’s product portfolio includes single wafer, batch, and cluster solutions for Etch (ICP, RIE, DSE, IBE, ALE); Deposition (PECVD, HDPCVD, F.A.S.T); Material Modification (HDRF, RTP); and Die Singulation Applications (PPDOT). Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of our global customer base.
Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.
RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
Inabata & Co., Ltd. is a global specialized trading company with a rich history, leveraging its comprehensive capabilities to offer diverse solutions across various industries. A key focus is the information and electronics sector, where Inabata plays a vital role in the semiconductor industry.
The company provides a wide range of semiconductor-related materials, including specialized encapsulating resins and adhesives for optical semiconductors, as well as materials and equipment for LEDs. Inabata’s commitment to product development and quality assurance in this field is underscored by its wholly-owned subsidiary, Inabata Optec Corporation, which focuses on developing new products for opto-semiconductors.
Inabata’s global network and expertise in advanced materials position it as a valuable partner for innovation and growth within the international semiconductor landscape.
Inabata & Co., Ltd. provides a comprehensive array of products and services crucial to the advanced semiconductor industry. Our offerings span a wide range of electronic materials, specializing in solutions that meet the stringent demands of next-generation devices.
Key product categories include high-performance encapsulating resins and adhesives for various semiconductor applications, with a particular focus on optical semiconductors and LEDs. We supply essential materials for advanced packaging, contributing to enhanced device reliability and performance. Furthermore, Inabata facilitates the provision of specialized equipment and related components vital for semiconductor manufacturing processes.
Beyond materials and equipment, Inabata leverages its extensive global network to offer technical support, market intelligence, and supply chain solutions, helping customers navigate complex challenges and accelerate innovation in the rapidly evolving semiconductor landscape. Our commitment lies in being a strategic partner, delivering value across the entire semiconductor ecosystem.
Kyocera Corporation (TOKYO:6971, https://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of industrial and automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2023, the company’s consolidated sales revenue totaled 2 trillion yen (approx. US$15.1 billion). Kyocera is ranked #672 on Forbes magazine’s 2023 “Global 2000” list of the world’s largest publicly traded companies, and has been named among “The World’s 100 Most Sustainably Managed Companies” by The Wall Street Journal.
Murata Machinery (Muratec) is a worldwide leader and solution provider for automated material handling systems in semiconductor manufacturing and other manufacturing or distribution industries. Muratec also manufactures machinery and equipment such as Textile Machinery, Machine Tools, Sheet Metal Machinery, and Communication Equipment.
This year marks 90 years since its founding in 1935. Under the slogan “Innovation. Mark the turning point”, Muratec aims to create technologies that bring innovation to the market and society.
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
Established in 1947, Sekisui Chemical Co., Ltd. is one of Japan’s leading integrated chemical manufacturers. Sekisui operates a residential business known as the Sekisui Heim brand, an environmental lifeline business that handles piping materials for factories and social infrastructure, a high-performance plastics business that provides chemical products in the mobility, electronics and industrial fields, and a life sciences business that provides testing and drug development support. In the electronics industry, we provides various products such as tapes, films, adhesives, fine particles, and binder resins for a wide range of applications such as displays, electronic components, and semiconductors.
Major products for the semiconductor field include “SELFA” temporary fixed tapes with excellent heat and chemical resistance, FCBGA build-up films with excellent low transmission loss property, heat dissipation sheets that combine proprietary magnetic field alignment technology and resin design technology, and conductive micro-particles with the highest particle size accuracy in the industry.
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
We are Siliconphotonics advanced package and testing solution provider. Suruga Seiki is a Japanese company founded in 1964. Taiwan is the APAC operation center with design and CPO system assembly functions.
We are focusing on Siliconphotonics, Photonics wafer restring, PIC functional test and Active alignment, passive alignment, edge coupling and grating coupling by our key components, module, and tester system.
We can also provide camera module and lens decenter alignment inspection with our laser collimator and high precision stage.
Our website:
[About Siliconphotonics, Advanced Testing&Package functions for PIC]
[About Company Profile]
SURUGA SEIKI provides cutting-edge technology such as high precision positioning motor stage, excellent optical alignment algorithm and laser measurement technique. Experienced domestic services on photonics wafer testing, PIC coupling, assembly by active/passive alignment.
Yamaha Robotics Co., Ltd. is a Yamaha Motor Co., Ltd. group company that handles semiconductor manufacturing equipment (back-end processing) and electronic component assembly equipment businesses.
We can offer to provide a total solution that exceeds our customers’ expectation as the “Turn-Key Provider in Semiconductor Back-end Process Equipment” by integrating the technologies of bonders, molds,surface mounters, Industrial Robots, and various automated equipments.
Development, manufacturing and sales of semiconductor back-end process equipment.”Connecting” technology: die bonding, wire bonding and flip chip bonding; “Solidification” technology: resin encapsulation equipment and molding equipment; “Assembly” technology: electronic component assembly and manufacturing equipment.
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