27-28 August 2025
Suwon
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
Deloitte provides industry-leading audit, consulting, tax and advisory services to many of the world’s most admired brands, including nearly 90 percent of the Fortune 500® and more than 7,000 private companies. Our people come together for the greater good and work across the industry sectors that drive and shape today’s marketplace delivering measurable and lasting results that help reinforce public trust in our capital markets, inspire clients to see challenges as opportunities to transform and thrive, and help lead the way toward a stronger economy and a healthier society. Deloitte is proud to be part of the largest global professional services network serving our clients in the markets that are most important to them. Building on more than 175 years of service, our network of member firms spans more than 150 countries and territories. Learn how Deloitte’s more than 330,000 people worldwide connect for impact at www.deloitte.com.
Shinhao Materials LLC is located in Suzhou China. Its mission is to invent and produce new materials to meet the ever-changing needs of the semiconductor industry, to service its customers in timely and cost-effective way. Being technology heavy, asset light, it has focused on technology innovation. Through its relatively short life, it has developed several unique classes of copper plating additives that have shown to be effective in addressing electrical, thermal, and stress challenges we are facing today. Its IntraCu® products are patent-protected in US, Korea, Taiwan and mainland China. In 2019, Shinhao Materials formed a strategic partnership with Umicore EP to sell and service its customers better internationally.
Umicore Metal Deposition Solutions is a leading developer and manufacturer of ECD processes (Electroplating business line) and PVD materials (Thin Film Products business line) with headquarters in Europe and branches in the United States, Taiwan, Japan, Thailand and China.
The company has recently expanded its presence in the semiconductor market by acquiring Shinhao Materials LLC and establishing Umicore Suzhou Semiconductor Materials Co., Ltd. (USSM). This long-planned, strategic move expands Umicore’s product offering for advanced packaging and demonstrates its commitment to assume a significant long-term role in the semiconductor industry.
With a strong focus on sustainability and continuous innovation, Umicore meets the highest quality requirements and increases the yield, performance, cost efficiency and reliability of semiconductor substrates.
With Umicore, you have a competent and global service partner at your side that gives your products a clear advantage – a perfect surface.
To meet the high demands of the modern semiconductor industry, Umicore Metal Deposition Solutions offers both high-quality electroplating and PVD solutions for the advanced packaging sector.
In the field of electroplating, the focus is on the development, production and distribution of ECD solutions based on copper, nickel, tin, indium and gold, copper (II) oxide and customised anodes and cathodes for ECD tools. The modular IntraCu® additive system, which is a breakthrough in semiconductor production, deserves special mention here. This patented system ensures high-quality, cost-effective and reliable copper plating for advanced packaging.
In the area of thin film products, Umicore successfully develops, manufactures and supplies high-end evaporation materials and sputtering targets of the highest quality in the advanced packaging, compound, microsystems and silicon front-end segments. To this end, Umicore maintains specialised sites in Liechtenstein and Taiwan.
Take advanced packaging to a completely new level with Umicore.
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