FormFactor
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
Soitec
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
Teikoku Taping System, Inc.
With over twenty-five years of semiconductor equipment experience, Teikoku Taping System (TTS) applies its core technologies of Haru (taping, bonding), Hagasu (de-taping, de-bonding), and Hakobu (handling, transportation) to the latest process challenges.
In addition to legacy processes like back-grind tape lamination and mounting wafers to dicing tape and frame, TTS enables some of the latest Dry Film Resist applications, and specialty tapes for Temporary Bonding, Sheet Molding, and others.
TTS is now working with PulseForge to integrate their photonics de-bonding with surface cleaning, tape removal, and wafer mounting to improve overall yield and process costs for backside processing of power devices.
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