ISES China 2023

17-18 October, 2023 – Shanghai

  • The Portman Ritz-Carlton, Shanghai
  • Shanghai Center, 1376 West Nanjing Road, Shanghai, China, 200040

Sponsors

Agenda Day 1 – October 17, 2023

Registration

08:00 – 08:50

Welcome Speech

09:00 – 09:15

Salah Nasri

President

ISES

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Chiplets and Advanced Heterogeneous Integration

09:20 – 09:40

Dr. Terry Wu

Director

Samsung Electronics

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Chiplets and System Integration – Key Concepts and Implementation

09:45 – 10:05

Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

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Networking Break, Business Meeting

10:05 – 10:45

Heterogeneous Integration Enabled by Advanced Chiplet Packaging

10:50 – 11:10

Dr. Yang Cheng

Senior Director Design Service BU

JCET Group Co., Ltd.

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Interconnection Define Computing: Key Technology for Next Generation Computing Paradigm Evolution

11:15 – 11:35

MoChen Tian

Founder and CEO

Kiwimoore

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The Opportunity & Challenge of OSAT for the Coming Chiplet Integration Package

11:40 – 12:00

Yupeng Xu

CTO

Forehope Electronic (Ningbo) Co., Ltd.

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Networking Lunch

12:05 – 13:15

Chiplet Process Integration Based on Glass Substrate and TGV Process

13:20 – 13:40

Dr. Wenbiao Ruan

R&D Director

Xiamen Sky Semiconductor Technology Co., Ltd.

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Memory and Processors for Chiplet Designs

13:45 – 14:05

Simon Zhang

VP

Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.

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Equipment and Material Supplier

Advanced Packaging Materials and Evaluation Platform at Resonac

14:10 – 14:30

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications

14:35 – 14:40

Dr. David Haynes

VP Strategic Marketing

Lam Research

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Tailored Solutions for the Semiconductor Industry Powered by TRUMPF

14:45 – 14:50

Dariusz Czaja

Managing Director of TRUMPF Hüttinger Asia / General Manager of TRUMPF Hüttinger China

TRUMPF Huettinger Electronics (Taicang) Co., Ltd.

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Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

14:55 – 15:00

Laurent Giai-Miniet

CEO

ERS Electronic GmbH

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Networking Break, Business Meeting 

15:05 – 15:45

Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards

15:50 – 16:35

Prof. Qinfen Hao

Professor

Institute of Computing Technology, Chinese Academy of Science

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Market Research

Memory and Processors for Chiplet Designs

16:40 – 17:00

Simone Bertolazzi, PhD.

Principal Technology & Market Analyst

Yole Intelligence

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Closing Remarks

17:05 – 17:10

Networking Reception

17:15 – 18:25

Gala Dinner and Appreciation Award Ceremony

18:30 – 20:30

Agenda Day 2 – October 18, 2023

Registration

08:15 – 08:45

Welcome Address

08:50 – 09:00

Salah Nasri

President

ISES

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Innovation in Power & Energy Management is Key to Support a Sustainable Future

09:05 – 09:25

Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, APeC/China

STMicroelectronics

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Fu Lu Shou – The Three Lucky Stars of Power

09:30 – 09:50

Mark Nils Münzer

Distinguished Engineer Innovation & Emerging Technologies Automotive High Power

Infineon Technologies AG

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How does SiC Accelerate NEVs

09:55 – 10:15

Markus Mosen

CEO

WeEn Semiconductors

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Networking Break, Business Meeting

10:20 – 11:00

Vehicle Electrification Catalyzing Power SiC Mass Commercialization

11:05 – 11:25

Dr. Victor Veliadis

Executive Director and CTO

PowerAmerica

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SiC – A Yin and Yang Perspective

11:30 – 11:50

Ralf Bornefeld

SVP Power Semiconductors & Modules

Bosch Sensortec

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Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective

11:55 – 12:15

Dr. Rainer Kaesmaier

Managing Director, Global Product Group Semiconductors

Hitachi Energy Ltd.

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Networking Lunch

12:20 – 13:25

Semiconductors and Sustainability – Why Going Green is Chip Driven

13:30 – 13:50

Julian Fieres

Vice President Transformation, Strategy, Sustainability & Digitalization

ZF Friedrichshafen AG

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High Accuracy SPICE Model Faciliate Optimized Design of Power Electronics with SiC MOSFETS

13:55 – 14:15

Cheng-Tyng Yen

CEO

Fast SiC Semiconductor Inc.

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How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges

14:20 – 14:40

Dr. Tong Wu

Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications

onsemi

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

14:45 – 14:50

Dr. Stefan Pieper

Global Application Manager

mks Atotech

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Networking Break and Business Meeting

14:55 – 15:35

Power Electronics Integration and Modulization

15:40 – 16:00

Dr. KK Kuo

VP R&D

ATX Semiconductor (Suzhou) Co., Ltd.

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The Challenges in Getting a Reliable SiC Device

16:05 – 16:25

Dr. Hongchao Liu

SVP/Chief Scientist

Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

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GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges

16:30 – 16:50

Jim Jian

VP Sales APAC and NA

VisIC Technologies

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How Chinese local makers get ready to power the EV market?

16:55 – 17:35

Dr. Hongchao Liu

SVP/Chief Scientist

Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

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Closing Remarks and Lucky Draw

17:40 – 17:50

Speakers

Venue

The Portman Ritz-Carlton, Shanghai

Shanghai Center, 1376 West Nanjing Road, Shanghai, China, 200040

Advisory Board