ISES Taiwan 2023

9-10 May, 2023 – Taipei

  • Le Méridien Taipei
  • No. 38, Songren Rd, Xinyi District, Taipei City, 110, Taiwan

Sponsors

Agenda Day 1 – May 9, 2023

Registration

08:00 – 08:50

ISES Welcome Address

09:00 – 09:20

Salah Nasri

President

ISES

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HPC Session

Innovation to Enable More Compute From Each Transistor

09:20 – 09:50

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Now is the Time to Re-imagine Memory Centric Computing

09:50 – 10:20

Steve Pawlowski

CVP Advanced Memory Systems

Micron Technology, Inc.

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Coffee Break Sponsored by CNW Business Meeting Slot 1 & 2, Networking and Coffee Break

10:20 – 11:20

Advanced Packaging Session

Unleash Product Innovations with 3DFabric

11:20 – 11:50

Kam Lee

Deputy Head of TSMC Advanced Packaging Technology and Service

TSMC

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Heterogeneous Integration Platform for Next Generation Computing

11:50 – 12:20

Dr. Seungwook Yoon

CVP Business Development Team, AVP

Samsung Electronics

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New Energy to Semiconductor – Heterogeneous Integration Packaging

12:20 – 12:40

Dr. C.P. Hung

Corporate VP RD

ASE

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Buffet Lunch

12:40 – 13:40

A 360 View of Semiconductor Test from AI and Security Perspective

13:45 – 14:05

Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

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Hybrid Bonding: Innovation to Adoption

14:05 – 14:15

Abul Nuruzzaman

VP, Technology and IP Licensing

Adeia

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Automotive and Power Semiconductor Panel Session

GaN is Accelerating e-Mobility

14:15 – 14:35

Stephen Coates

GM & VP Global Operations

GaN Systems

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Opportunities and Challenges for Power Semiconductor Industry. How can Taiwan Supply Chain Help?

14:40 – 15:20

Andy Chuang

Consultant

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Coffee Break Sponsored by CNW Business Meeting 3 & 4 Networking and Coffee Break

15:20 – 16:20

Equipment and Service Supplier Session

Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

16:20 – 16:30

Aziza Dada

Sector VP

Airspace

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Process Control Challenges in Packaging for High Performance Computing Applications

16:30 – 16:45

Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

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Challenges and Solution of FLI Technologies in various HI Packaging Architetures

16:45 – 16:55

Nelson Fan

VP, Head of KPU Advanced Packaging

ASMPT Limited

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Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

16:55 – 17:05

Dr. Christian Ohde

Global Product Director SC/FEC

Atotech

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3DIC W2W and D2W Hybrid Bonding

17:05 – 17:10

Thomas Schmidt

Product Manager, Bonder Division

SUSS MicroTec

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Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications

17:10 – 17:15

Elpin Goh

Senior Director, Strategic Marketing, CSBG

Lam Research Corporation

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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

17:15 – 17:20

Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging

Evatec

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Cocktail Reception

17:20 – 18:20

Dinner Check-in

18:20 – 18:30

Gala Dinner Sponsored by Onto Innovation

18:30 – 21:00

Vincent Wang

VP of Greater China

Onto Innovation

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Agenda Day 2 – May 10, 2023

Registration

08:00 – 08:40

Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

08:40 – 09:00

Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

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Metaverse Session

How The Semiconductor Industry Is Poised to Enable The Metaverse

09:00 – 09:30

Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs

Meta

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Inspiring a new reality with XR

09:30 – 09:50

Patrick Chiang

Sr Director Technical Marketing

Qualcomm Technologies Inc.

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Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

09:50 – 10:10

CJ Hsieh

COO

ASPEED

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Coffee Break Sponsored by CNW Business Meeting 5 & 6, Networking and Coffee Break

10:10 – 11:10

Display Technology for Metaverse – A Foundry’s Perspective

11:10 – 11:30

Steven Hsu

VP Technology Development

UMC

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Opportunities and Challenges for MicroLED Display

11:30 – 11:50

Dr. Charles Li

CEO & Co-Founder

PlayNitride Display Co., Ltd.

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Buffet Lunch

11:50 – 13:10

AI Session

AI Computing in Large-Scale Era – The Golden Age of AI and IC

13:10 – 13:30

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC

13:30 – 13:50

Luba Tang

CEO

Skymizer Taiwan, Inc.

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Unleashing the Power of AI: Opportunities and Challenges Ahead

13:50 – 14:10

Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department

Etron Technology Inc.

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Coffee Break Sponsored by CNW Business Meeting 7, Networking and Coffee Break

14:10 – 15:10

Future of Taiwanese Semiconductor Supply Chain: Collaborations with International Partners

15:10 – 15:55

Ray Yang

Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)

Industrial Technology Research Institute (ITRI)

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Market Trend Session

Navigating the Dynamic Memory Market: Trends and Insights

16:00 – 16:20

Marco Mezger

COO & Executive Vice President

Neumonda

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Closing Address

16:20 – 16:30

Salah Nasri

President

ISES

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Speakers

Venue

Le Méridien Taipei

No. 38, Songren Rd, Xinyi District, Taipei City, 110, Taiwan

Advisory Board