ISES Taiwan 2024

14-15 May, 2024 – Taipei

  • Hilton Taipei Sinban
  • No.88 Minquan Rd, Banqiao District NewTaipei City, 22050, Taiwan

Sponsors

Agenda Day 1 – May 14, 2024

Registration

07:50 – 08:30

ISES Welcome Address

08:35 – 08:55

Kamel Ait Mahiout

President

ISES

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Chiplet Ecosystem Acceleration: Strategy, Roadmap & Standardization

Chiplet Ecosystem Acceleration

09:00 – 09:30

K.C. Hsu

VP, Research & Development / Integrated Interconnect & Packaging

TSMC

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HBM (High Bandwidth Memory) and Advanced Packaging Technology for AI Era

09:30 – 10:00

Dr. Kangwook Lee

SVP and Head of PKG Development

SK Hynix

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Networking and Coffee Break Business Meeting Slot 1&2

10:05 – 11:05

TBC

11:10 – 11:30

Bret Street

Senior Director of Advanced Packaging

Micron Technology, Inc.

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Generative AI Driven Advanced Packaging and Materials Innovation

11:30 – 11:50

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Glass Substrates Manufacturing

Advanced Packaging Technologies for Heterogenous Integration: Glass Core Package Substrate

11:50 – 12:20

Rahul Manepalli, Ph.D.

Intel Fellow; Director Substrate TD Module Engineering

Intel

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Buffet Lunch

12:25 – 13:40

Panel Session: Standardization for Chiplet and Advanced Packaging

13:45 – 14:35

Dr. Kuan-Neng Chen

Chair Professor

NYCU

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Silicon-Photonics and Co-Packaged Optics Session

TBC

14:40 – 15:00

Radha Nagarajan

SVP & CTO

Marvell

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TBC

15:00 – 15:20

Mark Wade

CTO, SVP Engineering & Co-Founder

Ayar Labs

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Networking and Coffee Break Business Meeting Slot 3&4

15:25 – 16:25

Equipment / Materials Suppliers Update

TBC

16:30 – 16:40

Dr. Monita Pau

Director Strategic Marketing, Advanced Packaging

Onto Innovation

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Wet Process and TBDB for Heterogeneous Integration

16:40 – 16:50

Eric Lee

President of Sales Group

Scientech

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ASMPT

16:50 – 17:00

State-of-the art solutions for W2W and D2W Hybrid Bonding

17:00 – 17:10

Robert Wanninger

Sen. VP BU Advanced Backend Solutions,Business Unit Advanced Ba

SUSS MicroTec

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TBC

17:10 – 17:20

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Innovative laser assisted bonding processes for next generation advanced packaging

17:20 – 17:30

Matthias Fettke

VP Advanced Packaging Equipment

PacTech

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Closing Address

17:35 – 17:40

Kamel Ait Mahiout

President

ISES

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Cocktail Reception

17:50 – 18:50

Gala Dinner

19:00 – 21:00

Agenda Day 2 – May 15, 2024

Registration

08:00 – 08:35

HPC and AI Session

TBC

08:40 – 09:10

Jason Ma, Ph.D.

Engineering Director, Technical Site Lead Google Taiwan

Google

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TBC

09:10 – 09:40

ST Liew

President, Taiwan & SEA Australia, New Zealand Vice President

Qualcomm

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TBC

09:40 – 10:10

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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Networking and Coffee Break Business Meeting Slot 5&6

10:15 – 11:15

Unlocking Values: The Power of AI/ML in Semiconductor Test

11:20 – 11:40

Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

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TBC

11:40 – 11:50

Chris Scanlan

SVP Technology

Besi

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REALITY Twin vs. Digital Twin: Revolutionizing Industrial Remote Management

11:50 – 12:10

CJ Hsieh

COO

ASPEED

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Buffet Lunch

12:15 – 13:40

TBC

13:45 – 14:05

Samuel Chiang

Deputy Technical Director

Andes Technology

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microLED Session

TBC

14:05 – 14:25

Sam Chen

Senior Director

Unikorn Semiconductor Corporation

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Market Outlook

TBC

14:25 – 14:45

Jérôme Azemar

Custom Project Business Development Director

Yole Group

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Management Consultancy Session

TBC

14:45 – 15:05

Michael Mo

Partner and Managing Director

AlixPartners

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TBC

15:05 – 15:25

Paul Triolo

Associated Partner and SVP for China and Technology Policy Lead

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ISES Closing Address

15:25 – 15:30

Kamel Ait Mahiout

President

ISES

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Farewell Reception Business Meeting Slot 7&8

15:35 – 16:35

Speakers

Venue

Hilton Taipei Sinban

No.88 Minquan Rd, Banqiao District NewTaipei City, 22050, Taiwan

Advisory Board