ISES Taiwan 2024

14-15 May, 2024 – Taipei

  • Hilton Taipei Sinban
  • No.88 Minquan Rd, Banqiao District NewTaipei City, 22050, Taiwan

Sponsors

Agenda Day 1 – May 14, 2024

Registration

07:50 – 08:30

ISES Welcome Address

08:35 – 08:55

Kamel Ait Mahiout

President

ISES

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Chiplet Ecosystem Acceleration: Strategy, Roadmap, and Standardization

TBC

09:00 – 09:30

Dr. Jun He

VP Quality & Reliability, Advanced Packaging Technology & Service

TSMC

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TBC

09:30 – 10:00

Koushik Banerjee

VP Technology Development Group

Intel

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HBM (High Bandwidth Memory) and Advanced Packaging Technology for AI Era

10:00 – 10:30

Dr. Kangwook Lee

SVP and Head of PKG Development

SK Hynix

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Networking and Coffee Break Business Meeting Slot 1&2

10:35 – 11:35

Micron

11:40 – 12:00

TBC

12:00 – 12:20

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Buffet Lunch

12:25 – 13:40

Panel Session: Standardization for Chiplet / Advanced Packaging

13:45 – 14:35

Dr. Kuan-Neng Chen

Chair Professor

NYCU

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Silicon-Photonics and Co-Packaged Optics Session

TBC

14:40 – 15:00

Radha Nagarajan

SVP & CTO

Marvell

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TBC

15:00 – 15:20

Mark Wade

CTO, SVP Engineering & Co-Founder

Ayar Labs

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Networking and Coffee Break Business Meeting Slot 3&4

15:25 – 16:25

Equipment / Materials Suppliers Update

TBC

16:30 – 16:40

Dr. Monita Pau

Director Strategic Marketing, Advanced Packaging

Onto Innovation

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Wet Process and TBDB for Heterogeneous Integration

16:40 – 16:50

Eric Lee

President of Sales Group

Scientech

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ASMPT

16:50 – 17:00

State-of-the art solutions for W2W and D2W Hybrid Bonding

17:00 – 17:10

Stefan Lutter

SVP Research & Development

SUSS MicroTec

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TBC

17:10 – 17:20

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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TBC

17:20 – 17:30

Matthias Fettke

VP Advanced Packaging Equipment

PacTech

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Closing Address

17:35 – 17:40

Kamel Ait Mahiout

President

ISES

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Cocktail Reception

17:50 – 18:50

Gala Dinner

19:00 – 21:00

Agenda Day 2 – May 15, 2024

Registration

08:00 – 08:35

HPC and AI Session

TBC

08:40 – 09:10

Jason Ma, Ph.D.

Engineering Director, Technical Site Lead Google Taiwan

Google

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Reserved

09:10 – 09:40

TBC

09:40 – 10:10

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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Networking and Coffee Break Business Meeting Slot 5&6

10:15 – 11:15

TBC

11:20 – 11:40

Samuel Chiang

Deputy Technical Director

Andes Technology

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Glass Substrates Manufacturing

Advanced Packaging Technologies for Heterogenous Integration: Glass Core Package Substrate

11:45 – 12:15

Rahul Manepalli, Ph.D.

Intel Fellow; Director Substrate TD Module Engineering

Intel

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Buffet Lunch

12:20 – 13:40

Taiwan Semiconductor Manufacturing Specialities and Technological Highlights

Immersive Experience Application

microLED Session

Unikorn

14:05 – 14:25

TBC

14:25 – 14:45

Dr. Charles Li

CEO & Co-Founder

PlayNitride

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Market Trend Update

Reserved

14:45 – 15:05

ISES Closing Address

15:05 – 15:10

Kamel Ait Mahiout

President

ISES

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Farewell Reception Business Meeting Slot 7&8

15:15 – 16:15

Speakers

Venue

Hilton Taipei Sinban

No.88 Minquan Rd, Banqiao District NewTaipei City, 22050, Taiwan

Advisory Board