ISES USA 2023

7-8 March, 2023 – Phoenix, Arizona

  • Sheraton Grand at Wild Horse Pass
  • 5594 W. Wild Horse Pass Blvd. Phoenix, AZ 85226

Sponsors

Agenda Day 1 – March 7, 2023

Welcome Speech

08:00 – 08:10

Salah Nasri

President

ISES

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Greater Phoenix: A Global Destination for Industrial Innovation

08:10 – 08:30

Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

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HETEROGENEOUS INTEGRATION THROUGH ADVANCED PACKAGING

Advanced Packaging Ecosystem

08:30 – 09:00

Dr. Babak Sabi

SVP & GM Assembly and Test Technology Development

Intel Corporation

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Unleash Product Innovations with 3DFabric

09:00 – 09:30

Dr. Jun He

VP Quality & Reliability, Advanced Packaging Technology & Service

TSMC

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Networking Break & Business Meetings 1+2

09:30 – 10:30

Advanced Packaging: Enabling Moore’s Law’s Next Frontier

10:30 – 11:00

Dr. Raja Swaminathan

CVP, Advanced Packaging

AMD

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Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration

11:00 – 11:10

Len Tedeschi

VP & GM Core Packaging Products

Applied Materials

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Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap

11:10 – 11:30

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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Buffet Lunch

11:30 – 12:45

IC Packaging Panel Discussion

12:45 – 13:25

Curtis Zwenger

VP, Advanced SiP Product Development

Amkor Technology, Inc.

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A 360 View of Semiconductor Test from AI and Security Perspective

13:25 – 13:55

Claudionor Coelho

Chief AI Officer, SVP of Engineering

Advantest

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Package Design and Reliability Need in Server Systems

13:55 – 14:25

Viresh Patel

VP Packaging Technology

Renesas

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Networking Break & Business Meetings 3+4

14:25 – 15:25

SEMICONDUCTOR MARKET OUTLOOK

Navigating Through a Correction in the Semiconductor Market

15:25 – 15:55

Mario Morales

Group VP, Enabling Technologies and Semiconductors

IDC

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EQUIPMENT SUPPLIER SESSION

Not All Nanograined Copper Is Created Equal

15:55 – 16:05

Dr. Yun Zhang

Founder & CEO

Shinhao Materials

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Valuation of Artificial Intelligence for Semiconductor Equipment

16:05 – 16:15

Jon Hander

AVP Panel Products

ASMPT Limited

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Advanced Packaging Materials and Evaluation Platform at Resonac

16:15 – 16:25

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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AICS Solutions to High Value Problems

16:25 – 16:30

Keith Best

Director, Product Marketing, Lithography

Onto Innovation

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Advanced Packaging – the Need for Standards

16:35 – 16:45

Dr. Shekhar Chandrashekhar

CEO

iNEMI

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Workforce Diversity Initiatives in the CHIPS Act Panel Session

16:45 – 17:30

Amy Leong

Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions

Formfactor

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Cocktail Reception Sponsored by Green Technology Investments LLC (GTI)

18:00 – 19:00

Tal Levin

Executive Vice President

GTI (Green Technology Investments)

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Gala Dinner Sponsored by TEL

19:00 – 21:00

Mark Dougherty

President TMEA – TEL Manufacturing and Engineering of America

Tokyo Electron

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Agenda Day 2 – March 8, 2023

Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications

08:00 – 08:30

Thomas Sonderman

President & CEO

SkyWater Technology

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Advancing The Memory Solutions Roadmap To Enrich Our Multi-Dimensional World For Generations To Come

08:30 – 09:00

Naga Chandrasekaran

SVP Technology Development

Micron Technology, Inc.

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Technologies To Break The Walls Slowing Compute Systems Scaling

09:00 – 09:30

Sri Samavedam

SVP, CMOS Technologies

imec

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Networking Break & Business Meetings 5+6

09:30 – 10:30

Time to Collaborate. SubFAB Research and Development.

09:30 – 10:30

Ilya Zabelinsky

Founder

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Wall Street Perspectives on the Semiconductor Market

10:30 – 11:00

Tom Stokes

Senior Managing Director

Evercore

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Building the Metaverse: Augmented Reality applications and integrated circuits challenges

11:00 – 11:20

Edith Beigné

Silicon Research Director at Reality Labs

Meta

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The New Packaging Math: 2x + 4y = 1

11:20 – 11:40

Wolfgang Sauter

Customer Solutions Architect, Packaging

Marvell Technology

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OPTICAL INTERCONNECT FUTURE IN ADVANCED PACKAGING

Optical I/O Technology to Meet Future Demands of AI

11:40 – 12:05

Mark Wade

CEO

Ayar Labs

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Mix and Matching Chiplets with the Economics of PCB Design

12:05 – 12:30

Ramin Farjadrad

Co-Founder & CEO

Eliyan

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Buffet Lunch

12:30 – 13:45

Supply Chain Panel – Sponsored by Airspace

13:45 – 14:15

Rebeca Obregon-Jimenez

SVP Strategic Business Engagements and Supplier Management

Avnet

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Are New CS Markets Pushing Reliability Culture Shift?

14:15 – 14:25

Roland Shaw

President of Accel-RF

STAr Technologies

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Advanced Silicon Wafers for Optimized MEMS and RF Device Performance

14:25 – 14:30

Dr. Atte Haapalinna

CTO

Okmetic Oy

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Advancing the Semiconductor Industry, TOGETHER

14:30 – 14:35

Andrew Goh

CVP & GM, Advanced Packaging Customer Operations

Lam Research Corporation

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The future of Advanced Packaging Inspection is X-ray

14:35 – 14:40

Enrico Härtel

Director Global Key Account Management

Comet

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Networking Break and Business Meetings 7

14:40 – 15:40

Fab Optimization Panel – Sponsored & Moderated by Deloitte

15:40 – 16:10

Dr. Bobby Mitra

Managing Director

Deloitte

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Geopolitical Landscape and the Semiconductor Industry Impact Closing Panel Discussion

16:10 – 16:40

Salah Nasri

President

ISES

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Closing Address

16:40 – 16:50

Salah Nasri

President

ISES

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Speakers

Venue

Sheraton Grand at Wild Horse Pass

5594 W. Wild Horse Pass Blvd. Phoenix, AZ 85226

Galleries

Advisory Board