USA Summits Co-Organised by Plug and Play Tech Center

The International Semiconductor Industry Group (I.S.I.G.) and Plug and Play Tech Center are bringing together the industry’s leading executives, innovators, and experts for three exclusive summits in Silicon Valley. These summits will cover cutting-edge advancements in semiconductor technology, power electronics, MEMS and sensors innovation. Join us to network, collaborate, and gain insights that will shape the future of the industry.

Exclusive Plug and Play Tech Center Offers

50% off I.S.E.S. USA 2025 Associate Pass


$1,373.35

(was $2,746.70)

2-in-1 Associate Pass for I.S.E.S. USA Power 2025 & MSWS USA 2025


$1,373.35

(was $2,746.70 and $1,373.35)

Attendees only pay 50% of I.S.E.S. USA Power price.

I.S.E.S. USA 2025

April 8-9

2025 Speaker Highlights


Near Margalit

VP & GM


Bizhan Delgoshaei

Head of Silicon Manufacturing Engineering, Foundry and OSAT


M. Ashkan Seyedi, Ph.D

Director, LinkX Products


Vincent Kim, Ph.D

Head of DSRA-PKG


Jaesik Lee

VP Package Engineering, SK Hynix, America

AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs

Topics:

  • Fostering High-Tech Innovation & Expansions Regionally
  • Packaging Technologies Improving Power Efficiency and Performance
  • HBM Development and Memory Expansions
  • Equipment Supplier Innovations for Advanced Packaging Challenges
  • Emerging Test Challenges in the Era of AI/HPC
  • Scaling AI Performance & Chiplet Architectures
  • Co-Package Optics Session
  • Materials and Equipment Innovation Session
  • Market Research & Outlook
  • Supply Chain Management
  • VC, Investor Network and Start-Up Shark Tank Session

I.S.E.S. USA Power 2025

April 14-15

2025 Speaker Highlights


Gene Sheridan

CEO


Fabio Necco

VP and GM of Automotive Power Division


Thorsten Scheer, Ph.D.

Regional President of the Bosch Automotive Electronics Division, North America


Rico Tillner

CEO, USA


Shiori Idaka

Head of European Cooperation Reseach Centre


Rainer Kaesmaier, Ph.D.

Managing Director Semiconductors

Empowering a Sustainable Future: Innovation, Collaboration and Navigating Challenges in SiC, GaN, and the Power Electronics Industry

Topics:

  • Data Centres & AI: Challenges and Opportunities in Power Electronics
  • Driving Innovation and Ensuring Domestic Competitiveness
  • Expanding Operations and Energy Future through SiC and GaN
  • US Manufacturing and Capabilities
  • Market Outlook
  • VC & Investment Activities in Power Electronics

M.S.W.S. USA 2025

April 15-16

2025 Speaker Highlights


Peter Hartwell, Ph.D.

VP, Engineering


Michael Pate, Ph.D.

Director of Audio Technology Development


Anton Hofmeister

Group Vice President, General Manager Central R&D


Roberto Condorelli

Director of Marketing


Alissa M. Fitzgerald, Ph.D.

Founder & CEO


Volker Herbig

VP BU Microsystems

Demonstrating the Impact of MEMS and Sensors and Strategic Investments Needed for Further Adoption

Topics:

  • The Future of MEMS and Sensors in a Connecter World
  • MEMS and Sensors Advancing AI
  • MEMS Sensors Manufacturing and Solving Problems for Emerging Applications
  • Research Enabling Advanced MEMS and Sensors
  • Innovations from Start-Ups

Thank you to our sponsors

I.S.E.S USA 2025 Sponsors

PLATINUM

GOLD

GOLD

Resonac Corporation logo

GOLD

SILVER

SILVER

SILVER

SILVER

Teradyne logo

BRONZE

AEM logo

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Airspace logo

BRONZE

AP&S logo

BRONZE

CNW logo - Redefining ASAP

BRONZE

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BRONZE

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Trymax Semiconductor B.V. logo

PARTNER

Ajinomoto logo

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AEHR Test Systems logo

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Camtek logo

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Corning Advanced Optics logo

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EVG logo

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Evatec logo

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Heller Industries logo

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Lam Research logo

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Materion logo

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Meridionale Impianti logo

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Palomar Technologies logo

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RENA logo

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Teikoku Taping System, Inc. logo

I.S.E.S USA POWER 2025 Sponsors

PLATINUM

GOLD

PARTNER

AEHR Test Systems logo

PARTNER

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AP&S logo

PARTNER

Evatec logo

PARTNER

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Hermes Epitek logo

PARTNER

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Lam Research logo

PARTNER

Materion logo

PARTNER

Pentamaster logo

PARTNER

Plasma Therm logo

PARTNER

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Siconnex logo

PARTNER

SK Siltron CSS logo

PARTNER

SPEA logo

PARTNER

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Teikoku Taping System, Inc. logo

M.S.W.S. USA 2025 Sponsors

GOLD

BRONZE

BRONZE

Silicon Austria Labs logo

PARTNER

PARTNER

PARTNER

PARTNER

Hermes Epitek logo

PARTNER

Pentamaster logo

PARTNER

SPEA logo

PARTNER

Teikoku Taping System, Inc. logo