Jiemin Cao 曹杰敏
Biography
Graduated from Shandong University in 2003
2003~2004 engaged in process development of Ningbo SMIC(Riying&IMP)
From 2004 to today , I worked in Silan Microelectronics, respectively engaged in chip testing, FA&RA ,quality director, Power module product &assembly development .
Now is VP of Silan, in charge of: power module product &package development, IGBT/SIC chip platform management, product quality engineering, RA&FA, etc.
Company Profile
Hangzhou Silan Microelectronics Co., Ltd.
Since 1997
As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.
The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. By the end of 2022, the monthly production capacity of the company’s 12-inch chips line has reached 60,000 pieces, and the monthly production capacity of the compound semiconductor device production line has reached 140,000 pieces.