About Us

Established in 2010, the International
Semiconductor Industry Group (I.S.I.G.) is a
prestigious and trusted association within the
semiconductor industry

renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.

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Meet the Team

Salah Nasri
CEO & Co-Founder
Salah Nasri
CEO & Co-Founder
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Kevin Dei
VP & Founding Partner
Kevin Dei
VP & Founding Partner
Mr. Dei is a founding partner of I.S.I.G., and is currently serving as Vice President overseeing strategy and business development. Mr. Dei has over 15 years of corporate sales and consulting experience in the High-Tech services sector spanning markets such as Solar PV, OLED, MEMS and Semiconductors.
Throughout his tenure at I.S.I.G., he has served multinational clients helping them to expand and deepen their commercial channels and customer relationships at the executive level through strategic partnerships.
Jubed Miah
VP Programs & Director
Mia Chen
VP & Taiwan GM
Ellen Wendelin-Loh
GM Southeast Asia
Ellen Wendelin-Loh
GM Southeast Asia
Ellen Wendelin is the General Manager of the International Semiconductor Executive Summit Southeast Asia (I.S.E.S. SEA), a role in which she excels at bringing together industry leaders to foster collaboration within the semiconductor sector. With a passion for orchestrating high-profile summits that merge innovation, strategy, and growth, Ellen is known for her expertise in event management, business development, and networking. She has successfully led initiatives that connect semiconductor executives globally, creating strategic partnerships and opportunities that drive the future of the industry. Her work is centered on delivering exceptional event experiences and fostering meaningful dialogue among stakeholders.
Michelle Yan
GM China
Michelle Yan
GM China
Michelle Yan is a seasoned executive with over 16 years of proven leadership in the meetings and events industry. As the General Manager of I.S.I.G. China, she brings a track record of delivering high-impact, large-scale events while driving sustained growth and fostering strong collaborations in diverse cultural and professional environments.
Throughout her career, Michelle has spearheaded cross-functional teams to execute complex, high-profile events for international conferences, corporate summits, and association-driven gatherings. Her meticulous planning and seamless execution consistently exceed client expectations, while her strategic insight ensures that each event achieves its objectives—be it brand elevation, stakeholder engagement, or global market expansion.
A visionary marketer, Michelle possesses a deep understanding of market trends and leverages targeted campaigns to amplify event visibility, engagement, and return on investment. Her initiatives have significantly increased brand awareness, attracted industry-leading participants, and solidified key partnerships on a global scale.
Committed to forging robust industry networks, Michelle has played a pivotal role in expanding the international presence of associations in China. She cultivates lasting collaborations and strategic alliances that drive long-term success, ensuring that every partnership delivers mutual value and measurable impact.
Renowned for her innovative spirit, Michelle integrates cutting-edge technology and creative solutions to enhance the attendee experience. Under her leadership, events not only captivate audiences but also generate tangible business outcomes. Her passion for pushing boundaries, coupled with her unwavering attention to detail, continues to set new standards of excellence in the meetings and events industry.

Honorary Board Members

Hamid Azimi, Ph.D.
Chairman of the Board
Hamid Azimi, Ph.D.
Chairman of the Board
Dr Hamid Azimi, formerly Corporate VP, Director of Substrate Packaging TD of Intel. He was responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Marvin Liao, Ph.D.
Advisory Board Member
Marvin Liao, Ph.D.
Advisory Board Member
Education :
Ph.D., Materials Science, University of Texas, USA, 1989
Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979
Experience :
TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
TSMC, Special Project, 2009 ~ 2010
TSMC, Fab 6 Director, 2003 ~ 2009
Chartered Semiconductor, 1997 ~ 2002 (Singapore)
Applied Materials, 1994 ~ 1997 (USA)
SGS Thomson Microelectronics, 1990 ~1994 (USA)
Markus Keil
Board Member
Markus Keil
Board Member
Markus holds an advanced degree as Dipl. Ing. in Applied Physics from the FH Wiesbaden. He is serving for the last 30 years in different Operations and technology functions at various multinational Semiconductor Companies.
After 16 years at AMD / Globalfoundries and after that as the President and CEO of HSEB, he was responsible for the global operations footprint of a US-based Semiconductor iDM.
2021 he joined Optotune AG, a swiss SME specialist in optical Microsystems as the VP Global Operations / GM.
Markus has extended experience in high-volume Semiconductor Operations and technology development. He has served as Deputy Chairman of the International Semiconductor Executive Summits part of the ISIG Group for over a decade and as of 2025, EU Advisory Board President.

Regional Presidents

Bernard Lim
President of South East Asia
Bernard Lim
Vice President Operations
Ir Bernard Limis currently the Vice Presidentand co-founder of Appscard Group AS and Appscard Global Research & Innovation Center, a technology startup company working on biometric smartcard with R&D and Operation facility based out Penang, Malaysia. He has over 27 years’ experience and have held various senior management rolesin manufacturing in different industry. He was also co-founder in multiple technology startup companies in Penang. He obtained his bachelor’s degree (B. Eng (Hons) In Electrical & Electronics) at Nottingham Trent University, United Kingdom and is currently pursuing his Doctorate in Business Administration at Wawasan Open University. He is a Professional Engineer and Fellow of Institution of Engineers, Malaysia, a senior member of the IEEE and an Associate Fellow of ASEAN Academy of Engineering and Technology (AAET). Ir Bernard is currently the Management Council of Penang Skill Development Center, the Chair-elect IEEE Malaysia Section, the Chairman of The Institution of Engineers Malaysia (Penang Branch), Executive Committee of IEM, IEM Council Member, Committee Member of IEM Material Engineering Technical Division. At IEM, he is also the Deputy Chair of Standing Committee of activity. Ir Bernard is also an ASEAN Engineer Register (AER) Executive Committee and the permanent member for the technical committee on Innovation Management (NSC Y/TC11).
For more information please visit: https://www.linkedin.com/in/bernard-lim-18893510/
Eric Lee
President of Taiwan
Eric Lee
CEO
Eric Lee is the CEO of Scientech Corp. and Chairman of Yayatech. He joined Scientech in 2004, following nearly a decade at UMC, where he held positions in both Taiwan and Singapore from 1995 to 2004.
In addition to his leadership roles at Scientech and Yayatech, Eric serves as President of the International Semiconductor Executive Summit (ISES) Taiwan. He is also a part-time professor in the Advanced Packaging Master’s Program at National Taiwan University of Science and Technology.
Eric contributes actively to the industry through his roles as a member of the SEMI Taiwan Advanced Packaging Committee and as a director of the Taiwan Electronic Equipment Industry Association.
Joshua Yoo
President of Korea
Joshua Yoo
President of Core Insight, President of ISES Korea
Yong Hoon (Joshua) Yoo has been involved in the static control industry since 1994 for ionization, ESD measurement and high voltage power business operation in semiconductor, flat panel displays and automotive industry. He has been a member of EOS/ESD Association since 2000 and served as an Elected Board of Director in 2016 – 2018. He is the founder and president of Korea EOS/ESD Association since 2011. He is a member of Institute of Electronics and Information Engineers (Korean IEEE) since 2021. He is serving industry as Korea President of International Semiconductor Executive Summits (ISES) since 2024.
He started his volunteering activities on EOS/ESD Association since 2013 as an active working group members and technical program committee members of annual symposium for multiple events of ESD Association. With his leadership, Korea EOS/ESD Association very strongly presents and annual events over 10 years. He is pioneer for flat panel display (FPD) static issue analysis and resolved problems. In recently, he found a root cause of ESD yield losses in AI chip manufacturing environment and improved yield over double digits.
He is an iNARTE certified ESD Engineer in 2007 and the EOS/ESD Association certified Professional ESD Program Manager in 2011. He has 14 patents for ionization system and ESD testing technologies.
Markus Keil
President of EU
Markus Keil
Board Member
Markus holds an advanced degree as Dipl. Ing. in Applied Physics from the FH Wiesbaden. He is serving for the last 30 years in different Operations and technology functions at various multinational Semiconductor Companies.
After 16 years at AMD / Globalfoundries and after that as the President and CEO of HSEB, he was responsible for the global operations footprint of a US-based Semiconductor iDM.
2021 he joined Optotune AG, a swiss SME specialist in optical Microsystems as the VP Global Operations / GM.
Markus has extended experience in high-volume Semiconductor Operations and technology development. He has served as Deputy Chairman of the International Semiconductor Executive Summits part of the ISIG Group for over a decade and as of 2025, EU Advisory Board President.
Tadahiro Suhara
President of Japan
Tong Wu, Ph.D.
President of China
Tong Wu, Ph.D.
Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications
吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.

Meet the Advisory Board

Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave has served as Chief Commercial Officer since 2024 at FormFactor. Aasutosh has more than 20 years of experience in semiconductors with a focus on developing global field teams, as well as business revenue growth and customer management. Prior to joining FormFactor, Aasutosh held various leadership and management positions at ASML. Most recently, he served as the Head of Global Sales and Applications leading their eBeam business. Aasutosh has held positions from R&D process engineer, Product Marketing, Product Development, and Sales at Hybond, AMD and Mentor Graphics (now Siemens).
Aasutosh received his M.S. in Electrical Engineering from The University of Texas at Arlington and his B.E. from Gujarat University in India.
LinkedIn Profile: https://www.linkedin.com/in/aasutosh-dave-646a11/
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.

Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave has served as Chief Commercial Officer since 2024 at FormFactor. Aasutosh has more than 20 years of experience in semiconductors with a focus on developing global field teams, as well as business revenue growth and customer management. Prior to joining FormFactor, Aasutosh held various leadership and management positions at ASML. Most recently, he served as the Head of Global Sales and Applications leading their eBeam business. Aasutosh has held positions from R&D process engineer, Product Marketing, Product Development, and Sales at Hybond, AMD and Mentor Graphics (now Siemens).
Aasutosh received his M.S. in Electrical Engineering from The University of Texas at Arlington and his B.E. from Gujarat University in India.
LinkedIn Profile: https://www.linkedin.com/in/aasutosh-dave-646a11/
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
Achim Strass, Ph.D.
Head of Worldwide Technology Scouting
Achim Strass, Ph.D.
Head of Worldwide Technology Scouting
Dr. Achim Strass is a visionary leader in semiconductor technology, with a career spanning global giants like Siemens, Qimonda, Infineon, Huawei, and Nexperia. From pioneering copper wire integration in automotive semiconductors to founding competence centers across the globe, his expertise has shaped the industry. With a PhD in Silicon Process Technology and a passion for innovation, he has led groundbreaking projects in yield management, electrification, and advanced power electronics. Now, as Head of Worldwide Technology Scouting at Nexperia and an active member of multiple boards, he connects global semiconductor ecosystems, driving collaboration and progress. His leadership continues to influence cutting-edge developments in semiconductor technology.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Akshay Singh Ph.D.
VP, Advanced Packaging Technology Development
Akshay Singh Ph.D.
VP, Advanced Packaging Technology Development
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
Stanford Graduate School of Business Executive Program, Stanford University
PhD and MS, Mechanical Engineering, Louisiana State University
BE, Mechanical Engineering, Maharaja Sayajirao University
Alan Zhou, Ph.D.
CEO, Shanghai
Alan Zhou, Ph.D.
CEO, Shanghai
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Aly Mashaly
Technical Director
Aly Mashaly
Technical Director
Aly Mashaly is a renowned expert in power electronic systems and power semiconductors, with over 20 years of experience in the electronics industry. He holds several patents in the field and is a keynote speaker at numerous international conferences. Aly studied Electrical Engineering with a focus on Power Electronics at Ain Shams University in Cairo. In late 2002, he moved to Germany to pursue his master’s degree at the University of Hanover. He began his career as a pioneer in the early development of power electronic systems for avionic applications and later shifted his focus to advancing power electronics in the electric vehicle market. In his current role as Technical Director at ROHM Semiconductor Europe, Aly has played a key role in driving the company’s vision to establish itself as a global player in the field of power devices.
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
Amr Darwish
Senior Director of Product Marketing & Market Development
Amr Darwish
Senior Director of Product Marketing & Market Development
Mr. Amr Darwish has over 18+ years of experience in the technology and semiconductor fields. Previously during his time at Integrated Device Technology (IDT), Amr served in various Product Marketing and Technical roles, which spanned over North America, Europe, and Asia. Amr was a Cofounder of MaxPower Semiconductor, where he served as the COO. MaxPower was acquired by Vishay Siliconix in October 2022, where Amr was formerly the Senior Director of Product Marketing & Market Development for the Silicon Carbide division of Vishay.
With a Bachelor of Science in Electrical Engineering (BSEE) and a Master in Business Administration (MBA), Amr has been able to use his blend of disciplines to create effective corporate & sales strategies and key strategic relationships, which have proliferated MaxPower’s (now Vishay’s) products into consumer, industrial, and automotive marketplaces.
In addition, Amr currently serves as the Chair of the Santa Clara University (SCU) Graduate Business Program Alumni Board, is a lead-investor and board member of several technology companies, serves as a start-up advisor in the Bronco Venture Accelerator and is a Partner in the Bronco Venture Capital Fund.
Amy Leong
CEO
Amy Leong
CEO
Amy has 26+ years of semiconductor experience in P&L management, product development, global sales and marketing, mergers and acquisitions. Prior to joining AEM, she held various senior leadership positions in California US with FormFactor, including Chief Commercial Officer, General Manager, and Chief Marketing Officer.   Amy has been serving as an advisory board member of International Semiconductor Executive Summits (ISES) since 2016, and Singapore Semiconductor Industry Association (SSIA) since 2024.
Amy received a Master of Science degree in materials science and engineering from Stanford University and a Bachelor of Science degree in chemical engineering from the University of California at Berkeley.
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets. Our mission is to provide the most comprehensive semiconductor and electronics test solutions based on the best-in-class technologies, processes, and customer support.
AEM is the pioneer of massively parallel, fully automated test solutions. Our expertise has been developed over the past two decades where AEM now has the largest fleet of such high parallel systems in the world serving the advanced performance compute market.
AEM has a global presence across Asia, Europe, and the Americas, with R&D centers located in Singapore, Malaysia, France, Finland and the US. AEM has manufacturing plants in Singapore, Malaysia (Penang), Indonesia (Batam), Vietnam (Ho Chi Minh City), and Finland (Lieto), and a global network of field engineering support and sales offices.
Ariel Meyuhas
Founding Partner & COO
Ariel Meyuhas
Founding Partner & COO
At the helm of The MAX Group, a global consulting firm serving the semiconductor industry, with over 25 years of experience in the semiconductor industry, Ariel possesses a proven track record of collaborating with leading Front-End and Back-End factories. His expertise encompasses operational turnarounds and business transformations of semiconductor companies such as Atmel, Plessey Semiconductor and more, resulting in substantial financial returns. Ariel excels at motivating teams with a positive attitude and a strong passion for semiconductor manufacturing. Ariel serves as a member of the Board of Directors at Lynceus.ai, SEMI Fab Owners Alliance, and GaAs Power Systems for many years. He holds a Bachelor of Science in Industrial Engineering and a Master in Engineering Management from the Ohio State University. Outside of his professional career, he is an avid motorsport enthusiast, actively supporting his son’s racing career in pinnacle GT categories in Europe.
We are MAX, for over two decades we have been creating faster and smarter global operations!
Our business philosophy and our key to success are founded on never taking your business for granted and always following you every step of the journey where everything happens, sharing responsibility for any outcomes. Our expert teams will work in perfect synergy with you, zealously improving your bottom line. Clients credit us for accelerating their factories’ path for demonstrating world-class performance results – higher productivity and output, shortened Cycle Times, and reduced Operational Costs. As tough as the challenge may be, we will bring skills and cutting-edge tools to help you succeed.
The MAX Group is a leading global consulting firm with special expertise in Benchmarking and Operational Improvements in the Semiconductor industry. While primarily focusing on the Semiconductors and Electronics industries, we are proudly serving our Clients operating in wide variety of industrial spaces including Automotive, Aerospace, Bio-Medical and more.
Avinash Kashyap Ph.D.
SVP & Division Head
Avinash Kashyap Ph.D.
SVP & Division Head
Dr. Avinash Kashyap is the Senior Vice President & Division Head of the MOSFETs Division at Vishay Intertechnology. He leads a global organization overseeing P&L, engineering, marketing, applications, and revenue generation for power products, including Si MOSFETs, Power ICs, and SiC, with a strong focus on automotive, industrial, and data center applications.
Previously, Dr. Kashyap served as Vice President & General Manager of the Discrete & Wide Bandgap Power Business Unit at Renesas Electronics, where he led multiple product lines, including IGBTs, SiC, Si MOSFETs, and GaN, catering to high-volume markets.
Throughout his career, Dr. Kashyap has held leadership roles at Microchip Technology and GE Global Research, where he played a pivotal role in advancing wide bandgap technologies and successfully bringing them to market.
An accomplished innovator, he has authored over 35 peer-reviewed publications and holds more than 20 patents (granted or pending). Dr. Kashyap earned his M.S. and Ph.D. in Electrical Engineering from the University of Arkansas, Fayetteville. He is a Senior Member of IEEE and a distinguished member of the Arkansas Academy of Electrical Engineers.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world’s largest manufacturers of discrete semiconductors (diodes, rectifiers, MOSFETs, optoelectronics, and selected ICs) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and “one-stop shop” service have made it a global industry leader.
Bernard Lim
Vice President Operations
Bernard Lim
Vice President Operations
Ir Bernard Limis currently the Vice Presidentand co-founder of Appscard Group AS and Appscard Global Research & Innovation Center, a technology startup company working on biometric smartcard with R&D and Operation facility based out Penang, Malaysia. He has over 27 years’ experience and have held various senior management rolesin manufacturing in different industry. He was also co-founder in multiple technology startup companies in Penang. He obtained his bachelor’s degree (B. Eng (Hons) In Electrical & Electronics) at Nottingham Trent University, United Kingdom and is currently pursuing his Doctorate in Business Administration at Wawasan Open University. He is a Professional Engineer and Fellow of Institution of Engineers, Malaysia, a senior member of the IEEE and an Associate Fellow of ASEAN Academy of Engineering and Technology (AAET). Ir Bernard is currently the Management Council of Penang Skill Development Center, the Chair-elect IEEE Malaysia Section, the Chairman of The Institution of Engineers Malaysia (Penang Branch), Executive Committee of IEM, IEM Council Member, Committee Member of IEM Material Engineering Technical Division. At IEM, he is also the Deputy Chair of Standing Committee of activity. Ir Bernard is also an ASEAN Engineer Register (AER) Executive Committee and the permanent member for the technical committee on Innovation Management (NSC Y/TC11).
For more information please visit: https://www.linkedin.com/in/bernard-lim-18893510/
APPSCARD is a Norwegian company with its global operation based out of Malaysia. Appscard provides the World’s first “Government Grade Biometric Computer on Card”. The solution integrated in an ISO-standard smart card format with a large and physically flexible fingerprint sensor designed for use throughout entire populations. A complete local ID-system that does not compromise security or user privacy and works conveniently and securely for very close to 100% of any given population. APPSCARD replaces all of today’s identity keys, including pin codes, passwords, code tokens, simple non-biometric access cards, signatures, physical keys etc, all of which are easily compromised. And, the system is not dependent on databases or communication lines, only the user’s biometrics. Thus, all dominant sources of the massive challenges facing us today are effectively removed.
For more information please visit: www.appscard.com
Chang Fu
Advanced Module R&D Dep., Deputy Director
Chang Fu
Advanced Module R&D Dep., Deputy Director
Chang Fu, current Deputy Division Director in Shanghai Huali Microelectronics / Integrated Circuit Corporation , member of Huahong Group, plays a role in Advanced Module Technology Development.
Prior to Huali, Mr. Fu has over 30 years of experiences regarding module process development, R&D, fab operations in multiple fabs. He had made critical contribution to the fab establishment in ASMC Shanghai, Chartered Semiconductor Manufacturing Singapore (now Global Foundry), UMCi (Singapore), convert new technologies into mass production and continuous developing. He also engaged in the Technology Development in GSMC (HHGrace now), another member of Huahong Group.
Mr. Chang Fu obtains a Bachelor’s degree in Electrical Engineering from FuDan University, and a Master of Science degree in Electrical Engineering from National University of Singapore.
HLMC, a subsidiary of Huahong Group, was established in 2010. As a main IC wafer foundry company in the industry, HLMC offers a portfolio of technologies and comprehensive solutions. It is devoted to providing one-stop wafer foundry technical services for technology nodes from 65/55nm to 28/22nm for design companies, IDM companies and other system companies.
HLMC has two 300mm fully-automated wafer fabs in Shanghai, Huahong Fab5 and Huahong Fab6. Headquartered in Zhangjiang Science Park, Shanghai, HLMC also has offices in the US, Japan, and Taiwan, providing sales and technical support for global customers.
Christine Dunbar
Head of Strategic Business Development
Christine Dunbar
Head of Strategic Business Development
Christine Dunbar is the Head of Strategic Business Development at Natcast, the non-profit entity designated by the U.S. Department of Commerce to operate the National Semiconductor Technology Center (NSTC). In this role, she leads strategic initiatives to advance the U.S. semiconductor ecosystem, fostering collaboration between industry, government, and academia.
Before joining Natcast in March 2025, Christine served as Senior Vice President of Global Sales at IQE, a leading provider of compound semiconductor wafer products and advanced materials solutions. Prior to joining IQE in 2022, she held key executive roles at GlobalFoundries and IBM’s Microelectronics Division.
A Cornell University graduate with a bachelor’s degree in Materials Science and Engineering, Christine has dedicated her entire career to advancing the global semiconductor industry. In recognition of her leadership, she was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award in 2018.
Beyond her executive roles, Christine is a recognized thought leader and sought-after speaker on the critical issues shaping the future of the semiconductor industry. She is frequently called upon to present at global industry forums, where she has provided insights on technology innovation, supply chain resilience, workforce development, and global policy. A longtime advocate for diversity in tech, she is also deeply committed to mentoring and inspiring the next generation of leaders, helping to shape a more inclusive and dynamic semiconductor ecosystem.
Natcast is a purpose-built, non-profit entity designated to operate the National Semiconductor Technology Center (NSTC) by the Department of Commerce. Established by the bipartisan CHIPS and Science Act of the U.S. government, the NSTC is a public-private consortium with a mission to advance U.S.-led semiconductor research and innovation, foster a skilled workforce, and strengthen America’s economic and national security.
Christophe Maleville
CTO and Senior EVP Innovation
Christophe Maleville
CTO and Senior EVP Innovation
Christophe Maleville has been appointed Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation.
He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer from R&D to production, and managed customer certifications. He also served as vice president, SOI Products Platform at Soitec, working closely with key customers worldwide.
Maleville has authored or co-authored more than 30 papers and also holds some 30 patents. He has a PhD in microelectronics from Grenoble Institute of Technology and obtained an executive MBA from INSEAD.
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
CJ Hsieh
COO
CJ Hsieh
COO
Experiences:
Advisory board, ISES Taiwan
Co-chair of Test Committee, SEMI Taiwan
General Manager, INTEL Innovation Tech. Ltd.
Spokesperson, INTEL Taiwan
Consulting Committee, National QUEMOY University
VP of Global Operations, LANTIQ Deutschland GmbH
GM & VP of Professional Services Lab, SPIROX Corp.
AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
Technical Manager of CPU / Memory Design, UMC
Project Leader of EDA DFT, SYNTEST Tech. Ltd.
Education:
MSEE, University of Southern California, Los Angeles, USA
Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.
ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.
Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.
Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.
Coralie Gallis Ph.D.
Co-Founder & Chief Technology Officer
Coralie Gallis Ph.D.
Co-Founder & Chief Technology Officer
Coralie, a PhD in Materials Sciences from Paris University with an engineering degree in Physic- Chemistry, has over 25 years of experience in wearable sensing, medical and sports technology, semiconductors, and automotive industries. Previously in Silicon Valley and now in Las Vegas, Coralie has led business development and strategic partnerships in AI, biomedical tech, and wearable electronics. She is a co-founder and CTO of SM24, a wearable start-up, a non-invasive continuous biomarker monitoring system for metabolic health for the femtech, wellness and sport sector. Previous to the creation of the start-up, Coralie has been working in consumer technology industry within 2 different European semiconductors research centers dedicated to developing prototypes for industry partners. She has been a judge for the CES innovation awards the last 2 years. Since 2024, Coralie has also supported Vibra-Nova’s ultrasonic haptic technology expansion in the U.S.
CS Tan
VP GM
CS Tan
VP GM
Over 33 years in Semiconductor, Hard Disk Drive and EMS industry. Group VP/GM of ST Micro Malaysia GM/Country Manager of ON Semi Malaysia VP of FlexMobile Asia (Flextronics) responsible for Mobile Phone operations in Asia. Business Unit/Program Management Director in Solectron (EMS) responsible for the PnL of 8 accounts. General Manager of Priority Plus (a local Malaysian EMS). Production Manager in Seagate Recording Heads Operations in Penang. Started career in National Semiconductor Penang as Process Development Engineer after graduating from USM with a First Class Honours Degree in Applied Physics (Faculty gold medal) and MBA from USM. Awarded Honorary Doctor of Engineering from UTEM. VP of MSIA and Regional Advisory Board member of SEMI SEA.
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Curtis Zwenger
Curtis Zwenger
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He was formerly responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
Dariusz Czaja先生于2007年加入通快霍廷格电子，目前担任通快霍廷格电子亚洲董事总经理，主要负责中国，日本，韩国以及东南亚市场的业务营运以及拓展。在光伏、半导体、显示面板、玻璃镀膜等多个领域，Dariusz Czaja先生拥有十余年的业务营运和管理经验，其中包括光伏应用项目的重点推广。在通快霍廷格电子任职期间，Dariusz Czaja先生曾先后在波兰和德国工作，并于2017年开始担任通快霍廷格电子中国总经理一职。2023年，因应业务成长需要，荣任亚洲董事总经理

Dariusz Czaja先生拥有波兰卡齐米耶日-普瓦斯基拉多姆技术与人文大学的电子工程学位，他也是世界太阳能大会（World Solar Congress）咨询委员会的成员，同时也是中国国际半导体高层峰会（I.S.E.S.）的执行委员会成员。
Dariusz Czaja joined TRUMPF HUETTINGER Electronics in 2007 and is currently the Managing Director of TRUMPF HUETTINGER Electronics Asia, where he is responsible for business operations and expansion in China, Japan, Korea and Southeast Asia. Mr. Dariusz Czaja has more than 10 years of business operation and management experience in photovoltaics, semiconductors, display panels, glass coatings and other fields, including the key promotion of photovoltaic application projects. During his tenure at TRUMPF Huettinger Electronics, Mr. Czaja worked in Poland and Germany, and in 2017 he became General Manager of TRUMPF Huettinger Electronics China. In 2023, he was appointed Managing Director of Asia in response to business growth needs.

Mr. Czaja holds a degree in Electronic Engineering from the University of Technology and Humanities in Kazimierz-Pułaskiradom, Poland, and is a member of the Advisory Board of the World Solar Congress and a member of the China International Semiconductor Executive Summit (I. S.E.S.).
通快霍廷格电子有限公司成立于1922年，总部设于德国弗莱堡，是世界领先的等离子体电源制造商，产品主要用于：半导体，显示器和太阳能领域，以及光学镀膜，装饰镀膜，工业镀膜，大面积玻璃镀膜等行业的等离子体应用，于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源，在电源领域拥有一百多年的经验积累，在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年，通快霍廷格电子中国成立，至今已经深耕中国市场19年。如今，通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心，为客户提供所有生产过程中的优质服务。2023年，通快霍廷格中国新工厂在太仓建成开业，这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Dato’ KL Bock
SVP Global Flash Backend Operations
Dato’ KL Bock
SVP Global Flash Backend Operations
KL Bock joined Western Digital or known as SanDisk in June 2010 after 21 years in Motorola and STATSChipPAC. He brings with him more than 30 years of vast experience in various functions inclusive of QRA, Operations, Supply Chain, factory GM, greenfield construction and start-up in China & Malaysia. He is currently the SVP of Western Digital Global Flash Backend Operations, managing the end-to-end Supply Chain, Operations, Fulfillment and Packaging Technology Development of both the captive factories and contract manufacturing with footprint across six countries.
KL has a proven track record in transforming conventional factory to “Lean 6 Sigma Automation – achieved industry pioneer in fully integrated Lights-Out manufacturing and industry pioneer in vertically integrated Wafer-In-Drive-Out manufacturing.” With this transformation, all the captive factories, SanDisk Semiconductor Shanghai (SDSS) and SanDisk Storage Malaysia (SDSM) has been designated the Lighthouse status, with SDSS being recognized as the first factory to achieve in one cohort, both the Advanced 4IR Manufacturing Lighthouse and China 1st Sustainability Lighthouse and SDSM being recognized as the Asia 1st Sustainability Lighthouse and Malaysia 1st Advanced 4IR Manufacturing Lighthouse by the World Economic Forum.
KL has received numerous awards such as Executive of The Year for Malaysia Management Excellence Award, featured in CEO Magazine and also was appointed as a 4IR Technical Advisor for MIDA, a beacon to share the 4IR journey to various industry captains. He is also a Certified Chief Master Coach by ITD World and SEMI SEA board member and Regional Advisory Board member of SEMI SEA.
KL holds a Bachelor’s degree in Electronic Engineering from Tunku Abdul Rahman University and a Master’s degree in Business Administration from University of Keele, United Kingdom.
Deepak Kulkarni
Senior Fellow Advanced Packaging
Deepak Kulkarni
Senior Fellow Advanced Packaging
Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Denis Marcon
General Manager
Denis Marcon
General Manager
Denis Marcon received a M.S. degree from the University of Padova in 2006. Subsequently, he received the degree of Doctor in Engineering (Ph. D.) from the Catholic University of Leuven and imec with the thesis entitled “Reliability study of power gallium nitride based transistors” in 2011. He is leading author or co-author of more than 50 journal papers or international conference contributions.
After his Ph.D. graduation, he has been leading projects aiming to develop GaN HEMTs for several applications (RF and power switching). Thereafter, he has joined the business development team of Imec where he was directly responsible for the partnerships with imec in the field of GaN power electronics as well as on dedicated development and manufacturing of Si-based devices, MEMS, sensors and micro-systems,
Today he is the General Manager of Innoscience Europe (subsidiary of Innoscience) and he is directly responsible for Innoscience’s GaN business in Europe.
Innoscience is an Integrated Device Manufacturer (IDM) founded in December 2015 with investment from CMBI, ARM, SK and other prestigious investors. With the development of new technologies, the electric power grid and power electronic systems across the world are undergoing a massive transformation. Our vision is to create an energy ecosystem with effective and low-cost Gallium-Nitride-on-Silicon (GaN-on-Si) power solutions. In November 2017, Innoscience first established a mass production 8-inch wafer line for GaN-on-Si devices in Zhuhai. In order to fulfill the rapidly growing power demands, Innoscience has inaugurated a new facility in the Suzhou in September 2020. As a cutting-edge GaN technology provider, Innoscience’s 1,400+ employees and over 300 R&D experts are dedicated to delivering high performance and high reliability GaN power devices that can be widely used in diverse applications including cloud computing, electric vehicles (EV) and automotive, portable devices, mobile phones, chargers and adapters. For more information, please visit www.innoscience.com.
Dimitrios Damianos Ph.D.
Project Manager, Consulting Services Division
Dimitrios Damianos Ph.D.
Project Manager, Consulting Services Division
Dimitrios Damianos, Ph.D., is a Project Manager in the Consulting Services Division at Yole Intelligence, part of Yole Group.
He manages transverse consulting projects, ensuring their quality and maintaining long term relationships with key accounts within the semiconductor industry.
Dimitrios has been with Yole since 2018, evolving through various analyst/consultant roles and is the author of numerous technical, business and market analyses covering imaging, sensing and photonics while actively played a key role in the expansion of Yole’s market & technical knowledge and the development of strategic projects.
Dimitrios holds a BSc in Physics and MSc in Photonics, as well as a PhD. in optics & microelectronics.
Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.
With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.
Yole Group benefits from an international sales network. The company now employs more than 180+ people.
More information on www.yolegroup.com.
Dr. Christina Hirschl
Chief Executive Officer
Dr. Christina Hirschl
Chief Executive Officer
CEO of Silicon Austria Labs GmbH (SAL), an Austrian industry-oriented research and development center for electronic based systems. Acting as link between science and industry SAL uses latest research results achieved in sensors, RF and power electronics to make products, technologies and processes simpler, safer and more effective.
Christina studied physics at the University of Vienna and worked during her PhD at the investigation of chaotic properties of fluids. After the PhD she moved to industry and worked for Beyond gravity at as thermal engineer for several years.
Since 2010 she became a project manager for renewable energy projects at CTR Carinthian Tech Research AG, 2014 area manager for Smart Systems, 2019 head of research division Sensor Systems and from June 2023 CEO of SAL.
Dr. Gerhard Lammel
Director System Architecture
Dr. Gerhard Lammel
Director System Architecture
Gerhard Lammel is Director System Architecture at Bosch Sensortec GmbH, Germany, responsible for shaping the next generations of consumer electronics sensor systems.
As part of the founding team of Bosch Sensortec he joined in 2005 as project manager. Later he became section head of advanced development and product engineering coach. Since 2024 he is also vice-chairman of the supervisory board at Bosch Sensortec.
Gerhard holds diplomas in physics and economics from the University of Munich, Germany. He obtained his PhD in microengineering from the Swiss Federal Institute of Technology in Lausanne. Then he joined Robert Bosch GmbH in Reutlingen, Germany, in 2001, where he was responsible for process development for automotive sensors.
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Dr. Hongchao Liu 刘红超
SVP/Chief Scientist
Dr. Hongchao Liu 刘红超
SVP/Chief Scientist
Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Dr. Koukou Suu
President, Entegris Japan
Dr. Koukou Suu
President, Entegris Japan
Dr. Koukou Suu graduated and received Ph.D degree in Engineering from Tohoku University, Japan in 1988 and 1993 respectively. He joined ULVAC, Inc. in 1993 and since then has been leading and engaging with developments of numerous semiconductor and electronics technologies including emerging non-volatile memories, high-K capacitors, LED, power devices, thin-film Li-battery as well as 3D packaging manufacturing technologies. He was General Manager of Institute of Semiconductor and Electronics Technologies of the company from 2008 to 2014. Currently he is Executive Officer and Senior Fellow of ULVAC, Inc. as well as President and CEO of ULVAC Technologies, Inc, a company representing ULVAC in North America. He is also an Adjunct Professor of Shanghai Institute of Microsystem and Information Technology of Chinese Academy of Science as well as an Adjunct Industrial Professor of University of South Australia.
Entegris, Inc. is a leading supplier of advanced materials and process solutions for the semiconductor, life sciences, and other high-tech industries. With over 50 years of expertise, we solve our customers’ most demanding challenges through innovative product development and a comprehensive portfolio, grounded in:
– Materials science and analytics
– Microcontamination control
– Advanced materials
– Manufacturing excellence
With a global team of 8,000 employees and ISO 9001-certified facilities, we operate worldwide to support innovation and reliability. Our German and French offices play a key role in Europe’s semiconductor ecosystem, offering proximity and local expertise.
Sustainability is embedded in everything we do. From enabling the desalination industry to regenerating gas purifiers for semiconductor manufacturing at our German facility, we are committed to creating solutions that drive innovation while supporting a more sustainable future for our planet.
Facing material issues, yield challenges, or reliability concerns? Entegris is your trusted partner.
Dr. Mark Wang
CEO
Dr. Mark Wang
CEO
Dr. Mark Wang is the co-founder and CEO of GMEMS Technologies. Inc.
Prior to that, Dr. Wang co-founded NeoMEMS Technologies, Inc. and General MEMS Corporation, both companies were pioneers in MEMS microphone industry and successfully led to high volume productions.
Prior to his venture endeavor, Dr. Wang had worked as senior engineering manager at KLA Tencor. And Dr. Wang was also Vice President of Engineering at Fortemedia Inc. As a veteran in the MEMS industry, Dr. Wang has more than 40 patents on MEMS sensors, covering a wide range of industries such as consumer electronics, biomedicine, Immuno detection, etc.
Headquartered in Shenzhen China, GMEMS is a leading developper and provider of MEMS microphones and voice interface softwares. With its core technical team having accumulated more than twenty years of working experience in MEMS acoustic sensor and noise suppression algorithms, GMEMS intends to provide one-stop solutions for its end customers. Over the years, GMEMS has established itself as a leader in providing high performance MEMS microphones and voice processing algorithms for voice interface applications.
Dr. Marnix Tack
CTO & VP Business Development
Dr. Marnix Tack
CTO & VP Business Development
Dr. Tack got a MSc degree in Electronic Engineering in 1984 from the Univ of Gent (Belgium) and a PhD degree in Microelectronics in 1990 from the Univ of Leuven & imec (Belgium). He got additional degrees in international business management and innovation leadership from the Vlerick Business School (Belgium), INSEAD (France), MIT (US) and IMD (Swiss). He joined MIETEC, a semiconductor company in Belgium in 1990, that became Alcatel Microelectronics, and was acquired by AMI Semiconductor in 2002 and ON Semiconductor in 2008.
In Feb 2022 he joined BelGaN that acquired part of onsemi in Belgium, as formerly CTO and VP Business Development.
Throughout the past 30+ years he was leading global professional teams in various fields of semiconductor R&D and Innovation, including Si CMOS & BCD, power MOSFETs and GaN. He also took the lead in setting up and driving a corporate innovation business process and global Open Innovation partnerships in the field of novel semiconductor technologies and products
Dr. Mary Ann Maher
CEO
Dr. Mary Ann Maher
CEO
Dr. Mary Ann Maher received her Ph.D. from Caltech in 1989 in the area of semiconductor device modeling. At Tanner Research she began the simulation and modeling group and launched Tanner’s T-Spice analog circuit simulator product. As Director of Advanced Products, she brought to market Tanner’s MEMS Pro microsystem and MCM Pro multi-chip module and packaging design tool. Moving to MEMSCAP, she became the company’s CTO and the General Manager and Executive Vice President of the Design Automation Business Unit. In 2004, she started SoftMEMS, LLC, the maker of the popular microsystems design tools – MEMS Pro and MEMS Xplorer, where she serves as CEO.
Dr. Mustafa Badaroglu
Principal Engineer/Architect (& IRDS More Moore Global Chair)
Dr. Mustafa Badaroglu
Principal Engineer/Architect (& IRDS More Moore Global Chair)
Dr. Mustafa Badaroglu is Principal Engineer and Architect at Qualcomm responsible from technology and architecture development for products employing Compute-In-Memory Technology. Before rejoining Qualcomm, he previously worked at Huawei, Qualcomm, IMEC, ON Semiconductor, and Tubitak Space. During his career he had various assignments for the execution and management of mobile, server, and automotive chipset designs from concept to volume production, process technology pathfinding, electronic design automation, and design-technology co-optimization. Dr. Badaroglu received his Ph.D. in Electrical Engineering and holds a Master of Industrial Management, both from the Catholic University of Leuven. He holds more than 60 published patents and (co)-authored over 100 publications in scientific journals/proceedings. He is the global chair of IRDS More Moore Team focusing on HVM roadmap of logic devices and memory. He is a senior member of IEEE.
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Dr. Qingchun Zhang
Professor
Dr. Qingchun Zhang
Professor
Dr. Q. Jon Zhang is currently the distinguished professor in Fudan University. He was the Principal Engineer for WBG technologies in Alpha and Omega Semiconductors (AOS), USA, leading R&D and production activities on SiC devices, working with a world-leading CMOS foundry to commercialize MOSFETs and Diodes on SiC. Prior to AOS, he was the director of power device technology at the PowerAmerica Institute reviewing the technical proposals and managing wide bandgap power devices, modules and power electronics projects in order to accelerate the adoption of next generation SiC and GaN power electronics. He also served as the adjunct professor of the Department of Electrical and Computer Engineering at NC State University. Before joining NCSU, he has been the Senior Scientist at Wolfspeed, a Cree company for 13 years, leading various projects in both R&D and production in SiC power devices, playing a critical role in the commercialization of all generations of SiC Schottky diodes and MOSFETs. Among his many milestones are demonstrating the industry’s first reported SiC trench MOSFET, 12 kV IGBTs, trench Schottky diode, drift-free BJT, 12 kV GTOs, SiC CIMOSFETs with the record device performance, latest generation of 650V and 1700V SiC MOSFETs for power modules, etc. He received his B.S. and M.S. degrees from Tsinghua University, China, respectively, and a Ph.D. degree from the University of South Carolina. He is the co-author of over 100 technical papers and conference presentations, and is the first or co-inventor on more than 80 US patents. He serves as a technical committee member of ISPSD, reviewer of various journals, and IEEE member.
Fudan University was established in 1905 as Fudan Public School. It was the first institution of higher education to be founded by a Chinese person. The two characters, fù (“return”) and dàn (“dawn”) were borrowed from A Commentary on The Classic of History （《尚书大传·虞夏传》）, of which the part on the Yu and the Xia dynasties mentions: “Brilliant are the sunshine and moonlight, again the morning radiance returns at dawn.” In 1917, the institution was renamed Fudan University, which has been kept ever since.
Dr. Riccardo Nicoloso
Dr. Riccardo Nicoloso
Dr. Riccardo Nicoloso is currently leading the Key Programs for Global Key Accounts , Industrial and Automotive Customers inside the Power and Discrete Subgroup in ST .
As general manager from Feb 2019 to Dec 2024, Riccardo Nicoloso leaded ST’s New Materials and Power Solutions Division, driving innovation in silicon carbide, gallium nitride and power modules, to address rising demand for more efficient solutions in automotive and industrial sectors. With over 28 years’ experience in semiconductors, Riccardo has extensive leadership spanning automotive, consumer and industrial. Starting in design, he subsequently held marketing and business roles at ST. Appointed General Manager in 2019, he brings demonstrated success growing global businesses. Passionate about STEM education, Riccardo regularly shares expertise with academic institutions and students. Born in Catania, Italy in 1967, Riccardo holds an Electronic Engineering degree from the University of Catania obtained in 1995, with further specialization in industrial electrical systems design.
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Dr. Simon See
Senior Director, Nvidia AI Technology Centre And AI Nation
Dr. Simon See
Senior Director, Nvidia AI Technology Centre And AI Nation
Prof Simon See is currently the Solution Architecture and Engineering Director, Chief Solution Architect and Global Head for NVIDIA AI Technology Center, NVIDIA Corporation. He is also an Adjunct Professor at Shanghai Jiao Tong University, Conventry University, and Universitas Indonesia (UI). In addition, he serves as a distinguished fellow in Fudan University and Adjunct Scientist at A*STAR’s Institute of High Performance Computing (IHPC). Previously, Prof See was the Chief Scientific Computing Advisor for BGI (China) and held appointments at Nanyang Technological University, Singapore (NTU Singapore) and King-Mong Kung University of Technology (Thailand). Prof See is currently involved in several international computational, mathematical science projects and national AI initiatives. Since March 2018, he servd as a Steering Committee member of NSCC’s flagship High Performance Computing Conference – Supercomputing Asia (SCA). He has recently been appointed as the Executive Director of the ASEAN Applied Research Centre (AARC).
Prof See’s research interests are in the area of High Performance Computing, Big Data, Artificial Intelligence, Machine Learning, Computational Science, Applied Mathematics and Simulation Methodology. He has published over 200 papers in these fields and won various awards. Prof See is also a Fellow member of IEEE, member of SIAM, IET, AAAI and on the Advisory Team of AIP (AI Professional Association) and have served as a committee member for more than 50 conferences.
Prof See graduated from the University of Salford (UK) with a Ph.D. in Electrical Engineering and Numerical Analysis in 1993. Prior to joining NVIDIA, Prof See worked for SGI, DSO National Laboratories, IBM, International Simulation Ltd (UK), Sun Microsystems and Oracle. He is also providing consultancy to several national research and supercomputing centers.
Dr. Xiaoning Qi
VP
Dr. Xiaoning Qi
VP
Xiaoning Qi is the Vice President of Alibaba Group. Previously, he held senior management and technical positions in companies such as Intel, designing integrated circuits and systems. He sits on the board of directors at several international organizations including RISC-V International Association, CHIPS Alliance, OpenHW, EEMBC, etc. He is a member of Global Semiconductor Alliance (GSA) Advisory Board, a member of GSA Asia-Pacific Leadership Council and GSA CEO Council. He has published more than fifty technical papers, a book, and has delivered over three dozen invited talks. He holds two US patents. Xiaoning received his Ph.D. degree in Electrical Engineering from Stanford University.
Alibaba Group’s mission is to make it easy to do business anywhere. The company aims to build the future infrastructure of commerce. It envisions its customers will meet, work and live at Alibaba and that it will be a good company lasting for 102 years. We pledged to reach carbon neutrality by 2030. By working with merchants and consumers, the company expects to slash carbon emissions by 1.5 gigatons across its digital ecosystem by 2035.
Dr. Xiaoxin Qiu
CEO
Dr. Xiaoxin Qiu
CEO
Xiaoxin Qiu received her BE and ME degrees from Tsinghua University, P. R. China, in 1990 and 1991, respectively; and her Ph.D. from University of Southern California, Los Angeles, in 1996, all in Electrical Engineering.
From 1996 to 2001, she was with the Broadband Wireless Systems Research Department of AT&T Laboratories in Middletown, NJ, USA. In January 2001, she joined Mobilink Telecom Inc, which became a part of Broadcom Corporation in 2002. During her tenure in Broadcom, she served as the Vice President of Systems Design Engineering, and was responsible for cellular modem development and productization as well as developing next generation cellular IoT/M2M/NB-IoT devices and platforms.
In 2016, she joined WNC, a Taiwanese ODM company, serving as the CTO of Software and Vice President of Technical Marketing. In this capacity, Xiaoxin was in charge of creating the 5G product line from scratch and was responsible for the successful product design-ins in Verizon and a handful of European operators.
In 2018, Xiaoxin joined UniSoC Corp in China as Chief Technology Officer, responsible for defining the company technology and product roadmaps, and leading the R&D effort.
In 2019, she started and served as CEO of Axera Technology Co. Ltd., a start-up company focusing on creating AI enabled, high performance vision processing chips for a variety of public safety, smart city, smart home, smart industrial applications.
Xiaoxin is a senior member of the IEEE, and was elected Broadcom Distinguished Engineer in 2008 due to her outstanding contributions in cellular technology development in Broadcom.
Axera is a high-tech semiconductor company focused on developing world class Artificial Intelligence (AI) SoCs, for high-performance low-power computer vision applications. These chips are particularly suitable for today’s AIoT products, extending the AI intelligence from the cloud to the edge as well as end devices. They can be used in a vast array of applications such as smart cities, smart transportation, smart manufacturing and smart homes, with the goal to convenience people’s life and make our society a better and safer place.
AX630A：A high-performance low-power Computer Vision AI SoC
axerapr@axera-tech.com
https://www.axera-tech.com/
Add: 4th Floor, Raycom Info Tech Tower A, No. 2 Kexueyuan South Road, Haidian District, Beijing, 100190 PRC
General phone number and fax 010-82622584
Dr. Yemin Dong
General Manager
Dr. Yemin Dong
General Manager
Dong Yemin graduated from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences in 2004, obtaining a doctoral degree in engineering. He has worked in research and development at Huali Semiconductor (Hua Hong Semiconductor) and GlobalFoundries in Singapore, with rich experience in integrated circuit research and product manufacturing. In March 2016, he joined the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, successively serving as the director of the High-Reliability Device Collaborative Innovation Design Center, director of the Silicon-Based Materials and Integrated Devices Laboratory, and deputy director of the State Key Laboratory of Functional Materials for Information. From January 2021 to June 2023, he served as the chief engineer of the Department of Industry and Information Technology of Guangdong Province. He has undertaken several national and provincial major scientific research projects, engaging in the development and industrialization of chips such as extreme microelectronics and high-performance analog. He has published over 60 academic papers, applied for more than 80 invention patents, and supervised nearly 20 master’s and doctoral students.
Shanghai Micro-Technology Industrial Research Institute (SITRI) was established in 2013 by Shanghai Science and Technology Commission, Jiading District Government and Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. It is a R&D and transformation functional platform integrating R&D, engineering, industrialization and cultivation, providing in-depth process technology support and services for innovative enterprises and partners. SITRI was established under the guidance of Shanghai Lianhe Investment Co., Ltd.’s strategic mission of serving the national strategy and being a pioneer in scientific and technological development. It relies on the “three-in-one” innovation architecture model of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. With the support of the technical strength of Shanghai Institute of Microsystem and the investment and operation model of Shanghai Xinwei Technology Group, it has established close cooperative relations with many domestic and foreign production, learning and research organizations, realized the efficient industrialization of innovative achievements, and accelerated the establishment of the “More than Moore” industrial ecosystem.
· SITRI has the first 8-inch “More than Moore” R&D pilot line in China, providing “More than Moore” core process technologies such as MEMS, silicon photonics, and biochips, and providing efficient R&D, pilot and verification services for semiconductor companies such as design, equipment and materials, realizing seamless connection from R&D to small batch production.
· Up to now, SITRI has applied for 877 patents, 697 invention patents, including 56 PCT (international patent) patents. · SITRI is based in Shanghai, facing the Yangtze River Delta, and radiating across the country, and has initially formed an industrial ecosystem in the field of “More Than Moore”.
Dr. Yongxiang Wen
Process Technology Director
Dr. Yongxiang Wen
Process Technology Director
Process Technology Director of Hangzhou Silan Microelectronics Co., LTD., responsible for the manufacturing and development of IC products, With 35 years of experience in integrated circuit manufacturing, responsible for the development of SL’s BICMOS\BCD products and processes, VDMOS, IGBT 、SIC products and processes. There are 6 patents （No.1 writer）authorized in the United States and 70 patents authorized in China.
Since 1997
As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.
The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. By the end of 2022, the monthly production capacity of the company’s 12-inch chips line has reached 60,000 pieces, and the monthly production capacity of the compound semiconductor device production line has reached 140,000 pieces.
Dr. Zhijian Zhou
R&D Director
Dr. Zhijian Zhou
R&D Director
Dr. Zhijian ZHOU received his Ph.D degree from The Hong Kong University of Science and Technology (Hong Kong SAR, China) and Université Grenoble Alpes (France) in 2013, by a joint dual Ph.D degree program. His research and R&D experiences include MEMS microphone, pressure sensor, accelerometer, resonator, etc. Currently, he is R&D Director at GOERTEK MICROELECTRONICS INC.
Eric Lee
CEO
Eric Lee
CEO
Eric Lee is the CEO of Scientech Corp. and Chairman of Yayatech. He joined Scientech in 2004, following nearly a decade at UMC, where he held positions in both Taiwan and Singapore from 1995 to 2004.
In addition to his leadership roles at Scientech and Yayatech, Eric serves as President of the International Semiconductor Executive Summit (ISES) Taiwan. He is also a part-time professor in the Advanced Packaging Master’s Program at National Taiwan University of Science and Technology.
Eric contributes actively to the industry through his roles as a member of the SEMI Taiwan Advanced Packaging Committee and as a director of the Taiwan Electronic Equipment Industry Association.
Scientech Corporation was established in Taipei, Taiwan in 1979.
What we do: Industries we serve: Semiconductor (front-end, back-end and GaAs), Flat Panel Display, LED, Data Storage, Scientific Instruments and high-tech related industries.
Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech Corporation has launched the development of wet process equipment in 2003. Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process such as Bumping, Fan-out, Chip-On-Wafer and so on. Our wet process equipment has been successfully verified in the latest Chiplet’s 2.5D/3D packaging process technology and smoothly introduced into mass production.
Geoffrey Stoddart
Senior Vice President Global Business Development
WGNSTAR, formerly Westerwood Global and NSTAR Global Services, and as of June ’24 WGNSTAR acquired Principle Service Solutions (PSS), provide innovative and cost-efficient managed workforce services and asset lifecycle management solutions. We partner with our clients to:
Build a custom approach that is tailored to specific operations and ultimate business goals
Provide managed workforce and flexible staffing solutions to solve workforce challenges
Assist with asset lifecycle management to maximize the value of your equipment
With regional offices throughout the United States and Ireland, we are strategically located where our clients need us most. Visit us at: www.wgnstar.com
Giorgia Longobardi, Ph.D.
Founder and CEO
Giorgia Longobardi, Ph.D.
Founder and CEO
Dr. Giorgia Longobardi, CEO of CGD, is an experienced engineer with international practice working on GaN power devices design and characterisation. As the inventor of high impact patents in the field of GaN power devices, Giorgia made the unique blend of academic and business know-how one of her biggest strengths.
During her PhD in power devices at Cambridge University, Giorgia worked on international projects with top semiconductor companies, through which, she learned about different cultures operating in this field and gained experience managing and budgeting multi-partner projects. Curious and knowledgeable, Giorgia leads an experienced diverse team of passionate people working with enthusiasm and continuous drive to do things better. She never forgets why she founded CGD: to change how energy is used and protect the environment with efficient power electronics.
She is a member of the energy management committee at PSMA (power Sources manufacturers association) and Strategic Advisory Board at the Henry Royce Institute for materials.

A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
Habib Hichri, Ph.D.
EVP, Senior Fellow, Global Applications and Business Development
Habib Hichri, Ph.D.
EVP, Senior Fellow, Global Applications and Business Development
Education:
PhD in Chemical Engineering
MBA
Experience:
Executive Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation.
Habib Hichri is an Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine-Techno Corporation USA. Prior to joining AFT USA, Habib was Director of Applications Engineering at SUSS MicroTec Photonics Systems USA where he provided patterning solutions for advanced semiconductors packaging customers. Before joining SUSS MicroTec, Habib spent about 12 years with IBM Semiconductors Research and Development Center (IBM SRDC) in East Fishkill, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management positions within IBM on process development in the front end of line area for microprocessor fabrication. Habib holds over 36 U.S. patents and authored over 75 publications and presentations and a book chapter in “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies” (Wiley – IEEE) first Edition. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France, and an MBA degree from the State University of New York at Buffalo. Habib is the chair of the Orange County California IEEE/Electronic Packaging Society (EPS) Chapter. He is also a member of the technical committees of Electronic Components and Technology Conference (ECTC), International Microelectronics Assembly and Packaging Society (IMAPS). He was the general chair of IMPAS 2020. Habib is a fellow of IMAPS Society. He is currently member of the IMAPS executive council. Habib is member of iNEMI board since April 2024.
Ajinomoto Fine-Techno Co., Inc. (AFT) is a subsidiary of the Ajinomoto Group responsible for the fine chemicals division. AFT (est. 1942) continues to deliver materials that can suit a wide range of customer needs in our four main strengths: molecular design, formulation, process development, and solutions. Our customers have commended us for our electronic materials. We have grown to play a major part in their value chains for electronics, automotive, and a variety of other products. We continue to refine our ability in materials science through research and development to continue creating value with our customers. We strive to provide the highest quality products, services, and information for our customers. Beyond our Ajinomoto Build-up film®, we’ve expanded our material portfolio to include molding, photo dielectric, magnetic, and optoelectronics. To maintain our leadership in our specified industry, we are devoted to providing state-of-the-art material, technology know-how, and customer service.
Haiying Duanmu
Deputy Secretary General of MIA / Director of VAIA special committee
Haiying Duanmu
Deputy Secretary General of MIA / Director of VAIA special committee
Haiying Duanmu, Deputy Secretary General of Shanghai Multi-media Industry Association / Director of XR Special Committee (VAIA), review expert in XR direction of Shanghai and Jiangxi government. MSE from Fudan University, expert of XR industrial chain and XR solution industrialization. Familiar with the trend of Metaverse and XR industry, with keen insight and original opinions, efficient execution, team organization, industry integration, and landing innovation. She has put in all effort to promote the industrialization of Metaverse and XR technology for a long time.
端木海婴，上海市多媒体行业协会副秘书长/扩展现实专委会主任（VAIA），上海市经济和信息化委员会、江西省工信厅虚拟现实方向评审专家。复旦大学软件工程硕士，XR产业链专家、XR解决方案产业化专家。熟悉对元宇宙及XR行业趋势有敏锐洞察力及独到见解，具高效执行力、团队组织力、行业整合力、落地创新力，长期以来不遗余力推动元宇宙及XR技术产业化落地。
Shanghai Multimedia Industry Association (MIA), established in May 2003, is one of the first twelve new Industry associations established in Shanghai after China’s accession to WTO. Shanghai’s DIGITAL media industry mainly includes digital animation, online games, digital audio, digital publishing, digital learning and digital display. In 2018, the output value reached more than 150 billion yuan, with a compound annual growth rate of nearly 25% in the past four years. The number of enterprises in the city increased to more than 15,000, with an increase of nearly 2,000, becoming a highlight industry in Shanghai’s economic transformation.
As a professional organization in the industry, MIA is a non-profit-making social organization voluntarily participated and organized by enterprises, institutions and individuals of various forms of ownership engaged in multimedia production, manufacturing, research and related business fields in Shanghai. MIA currently has hundreds of group members, covering animation, game, exhibition, digital learning and related digital media backbone enterprises in Shanghai and even the whole country; MIA is also a member of International Federation of Multimedia Associations (FIAM), and has attracted more than a dozen foreign corporate members. At present, MIA has established contact with multimedia industry associations in more than a dozen countries, including the United States, Britain, Switzerland, France, Australia, South Korea, Japan and so on, and has a wide range of international communication channels.
MIA adheres to the concept of “serving members, serving industry and serving government”, and has done a lot of fruitful work in promoting and promoting industry, serving and supporting members, personnel training and recommendation, international cooperation and exchange, etc. From 2016 to 2020, nearly 133 industry publicity and promotion activities have been held, and the number of participating enterprises has reached more than 3,000; Received 21 foreign delegations, organize and participate 25 international activities, mainly with the Canadian consulate, Israel consulate and the British consulate, Australian consulate, the international union of multimedia, the south Korean trade development at the consulate of revitalization of the club, Japan association of digital content, maintain long-term friendly exchanges association organization, set up the influence in the field of international multimedia; At the same time, we assisted the government in industrial statistics, public service platform construction, industrial alliance construction, white paper writing and other industrial promotion work. Four years, under the guidance of the government, under the leadership of the council, with the support of our members, through association staff efforts, to further build up a enterprise and enterprise, enterprise and government, domestic and foreign communication platform, better play to the association as a service organization should assume.
Mia has more than 480 corporate members, mainly providing services such as market intermediary, professional skills training, intellectual property application, government project application, professional qualification application, corporate image packaging, and international cooperation. Mia’s main businesses include: policy declaration, education and training, intellectual property, international cooperation, etc. Our clients mainly come from well-known technology companies in the field of metaverse and extended reality.
MIA has a team of high-quality enterprise talents, mostly young and vigorous. Under the guidance of scientific NGO philosophy, MIA has formed an elite team with excellent team spirit, vitality and strong execution ability. MIA is taking Shanghai and Yangtze River Delta as the center, gradually developing and consolidating the domestic market, and constantly connecting with the international market, shaping the association brand image of “personal science and technology consulting”, striving to create a leading social group brand of science and technology consulting in China.
Hamid Azimi, Ph.D.
Chairman of the Board
Hamid Azimi, Ph.D.
Chairman of the Board
Dr Hamid Azimi, formerly Corporate VP, Director of Substrate Packaging TD of Intel. He was responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Henri Berthe
Semiconductors Segment VP • Sales
Henri Berthe
Semiconductors Segment VP • Sales
Henri Berthe, a seasoned professional with 20 years of experience at Schneider Electric, leads the global Semiconductor Segment, driving sustainability and digitization. Previously, he was VP of Universal Enclosures, overseeing a global business focused on high-quality, standard, and connected enclosures. Before that, he served as VP of Digital Energy in MENA and Africa, deploying digital technologies and electrification solutions. Henri’s expertise spans energy management, digital power, and building management systems. He holds a master’s degree in Sales and Marketing from ESTA Belfort, France. In May 2024, he joined the Regional Advisory Board of SEMI South-East Asia and the Global Counsel of the Semiconductor Climate Consortium.
Schneider Electric is the global industrial technology leader, driving sustainable impact.
We are a powerhouse of electrification, automation, and digitization. The unique combination of our electrical and automation technologies intersect with our leadership in software, services and sustainability to rapidly accelerate sustainable impact.
Schneider’s purpose is to create Impact by empowering all to make the most of our energy and resources, bridging progress and sustainability for all. At Schneider we call this Life Is On.
Our mission is to be the trusted partner in Sustainability and Efficiency.
Jason Zee
Global Vice President, General Manager of the Storage and System Level Test Group at Teradyne, China Managing Director
Jason Zee
Global Vice President, General Manager of the Storage and System Level Test Group at Teradyne, China Managing Director
Jason Zee is an experienced Group General Manager with a demonstrated history of working in the semiconductors and robotic automation industry. He has over 30+ years of experience in the Semiconductor Test industry. In his 30+ years in the business, he has served in a variety of roles in product management, marketing, engineering, senior management in multiple countries and managing multi-million P&L businesses. His current role is the Vice President and General Manager of the Storage and System Level Test Group at Teradyne. Mr. Zee is also fluent in multiple languages including English, Mandarin and Cantonese that serves him well in this global business.
Mr. Zee earned a Bachelor’s degree in Electrical Engineering from Worcester Polytechnic Institute in Worcester, Massachusetts and his Master’s Degree in Engineering from Cornell University in Ithaca, New York.
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Jennifer Zhao
CEO Global Business, SIngapore
Jennifer Zhao
CEO Global Business, SIngapore
Jennifer Zhao formerly EVP and GM for Advanced Optical Sensors Division of ams OSRAM. She served as SVP, Global Sales and Marketing at Nexperia and held multiple management positions at NXP Semiconductors and Tyco International before that. Jennifer has managed various businesses including System Management, Logic and Microcontrollers and worked with leading OEM’s worldwide in Mobile and Consumer, Automotive and Industrial segments. Formerly Jennifer manages a global team with R&D, Operations, Marketing and Application resources in US, Europe, Greater China and South East Asia.
GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 with branch offices in many countries and regions worldwide, providing local support at customers’ fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and power as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice management system has achieved ISO 9001 and ISO 14001 certification. Constantly looking to expand the technology offering to customers, GigaDevice has also formed multiple strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com
Jian Zhang
VP, Engineering
Jian Zhang
VP, Engineering
Jian is a semiconductor industry veteran with more than 25 years of experience in process technology development, foundry operations, product engineering. Jian has extensive experience in leading and integrating global teams from various regions and businesses, having spent more than a decade in the U.S. and Asia.
Jian is the Vice President in Qualcomm, leading the Product Test Engineering (PTE) in APAC, responsible for new product test development, characterization, and test deployment, yield management, integrating and optimizing performance for all products across the BUs. She also oversees technical and management coordination with the PTE teams in the U.S.
Prior to Qualcomm, Jian served as VP of technology at NXP, responsible for technology roadmap planning and execution, both for in-house fabs and foundries. She also partnered with foundry and internal teams to ensure all new products and foundry processes would meet the automotive quality requirements and work
Jian held various management positions, including Global Foundries and Hewlett Packard. She holds master’s and bachelor’s degree in Electrical Engineering from Purdue University
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Jörg Amelung
Deputy Institute Director Division, Director Engineering, Manufacturing & Test
Jörg Amelung
Deputy Institute Director Division, Director Engineering, Manufacturing & Test
Jörg Amelung is Deputy Director of the Fraunhofer Institute for Photonic Microsystems (IPMS) and heads the MEMS Engineering, Manufacturing & Test division. Fraunhofer IPMS is a leading research institute in the MEMS field, equipped with high quality microsystem cleanrooms (200 – 300 mm wafer). As an expert and manager in MEMS technology, Jörg Amelung has been driving the development of smart microsystem technologies since 1993. He also played a key role in OLED development and founded two companies specializing in this field.
Fraunhofer IPMS is a leading international research and development service provider for electronic and photonic microsystems in the application fields of Smart Industrial Solutions, Bio and Health, Mobility as well as Green and Sustainable Microelectronics. Research focuses on customer-specific miniaturized sensors and actuators, MEMS systems, microdisplays and integrated circuits as well as wireless and wired data communication, neuromorphic and quantum computing. Services range from consulting and design to process development and pilot series production.
The Fraunhofer IPMS is one of 75 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Europe. With nearly 32,000 employees Fraunhofer operates with an annual budget of €3.6 billion, €3.1 billion of which is generated by contract research — Fraunhofer’s core business model.
Jörg Doblaski
CTO
Jörg Doblaski
CTO
As the Chief Technology Officer of the X-FAB foundry group, Jörg Doblaski is responsible for the development of X-FABs modular CMOS, SOI and WBG processes, targeting automotive, industrial and medical applications. Beside the development of the process technologies, this also includes design kit development, design enablement and customer support as well as prototyping. Jörg joined X-FAB in 2004 and served in different engineering- and engineering management positions before he became the group CTO in 2020. He holds a diploma degree in Electrical Engineering and Information Technology from Technical University of Ilmenau, Germany.
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
Joseph Chou
General Manager
POMME was established in 2015 and is located in Hsinchu, Taiwan. It is engaged in high-end wafer test integration and design services for the semiconductor industry, focusing on providing you with the most efficient wafer parameter test solutions. Such as IC Design house, foundry, IDM, testing company, assembly and packaging company, etc., to simplify work for engineers in different departments (such as: technology research and development, quality and reliability assurance, failure analysis, manufacturing, etc.). POMME can help turn all the measurement and analysis under numerous test results into a simple job, speeding up product throughput throughout semiconductor production.
POMME is the solution partner of Keysight Technologies, a world-renowned instrument manufacturer. With more than 16 years of long-term cooperation experience, POMME has developed into the only and most reliable partner of customers among semiconductor industry test integration system providers, with the most professional The technical team, adhering to the spirit of quality first and customer satisfaction, grows together with customers and employees.
Since its establishment, it has served the semiconductor industry chain in the Asia-Pacific region, with more than 300 customers. We use experienced teamwork to run your test work quickly and efficiently. We can provide test solutions that meet your unique needs every time.
Joseph Roybal
Senior Vice President of Global Backend Operations
Joseph Roybal
Senior Vice President of Global Backend Operations
Joseph Roybal is the Senior Vice President of Global Backend Operations at Wolfspeed aligning backend manufacturing roadmaps, production strategies, and capital allocation to scale efficiently with Wolfspeed’s exponential growth. He leads an expanding worldwide team focused on systemic manufacturing solutions, SiC package innovation, strategic partnerships with OSATs, and effective product manufacturing solutions for all Wolfspeed businesses and major SiC backend operations.
Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of Silicon Carbide and GaN technologies. We provide industry-leading solutions for efficient energy consumption and a sustainable future. Wolfspeed’s product families include Silicon Carbide materials, power-switching devices and RF devices targeted for various applications such as electric vehicles, fast charging, 5G, renewable energy and storage, and aerospace and defense. We unleash the power of possibilities through hard work, collaboration and a passion for innovation. Learn more at www.wolfspeed.com.
Wolfspeed® is a registered trademark of Wolfspeed, Inc.
Joshua Yoo
President of Core Insight, President of ISES Korea
Joshua Yoo
President of Core Insight, President of ISES Korea
Yong Hoon (Joshua) Yoo has been involved in the static control industry since 1994 for ionization, ESD measurement and high voltage power business operation in semiconductor, flat panel displays and automotive industry. He has been a member of EOS/ESD Association since 2000 and served as an Elected Board of Director in 2016 – 2018. He is the founder and president of Korea EOS/ESD Association since 2011. He is a member of Institute of Electronics and Information Engineers (Korean IEEE) since 2021. He is serving industry as Korea President of International Semiconductor Executive Summits (ISES) since 2024.
He started his volunteering activities on EOS/ESD Association since 2013 as an active working group members and technical program committee members of annual symposium for multiple events of ESD Association. With his leadership, Korea EOS/ESD Association very strongly presents and annual events over 10 years. He is pioneer for flat panel display (FPD) static issue analysis and resolved problems. In recently, he found a root cause of ESD yield losses in AI chip manufacturing environment and improved yield over double digits.
He is an iNARTE certified ESD Engineer in 2007 and the EOS/ESD Association certified Professional ESD Program Manager in 2011. He has 14 patents for ionization system and ESD testing technologies.
Core Insight is a leading company for EOS/ESD control with technical expertise and key insights for Advanced Package Device application. Heterogeneous Integration technology revolutionary achieved new device era. This new technology also brought new challenges that much less ESD sensitivity before it finished package device. Core Insight has prepared to meet new level of ESD control with world best ionization solution which no one else have. Core Insight has understanding device technology, manufacturing process and ESD control know-how for Advanced Package Device handling.
Julian Kornprobst
MEMS Sensor System Competence Team Business Lead
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
June Shen
Managing Partner
June Shen
Managing Partner
June Shen is the managing partner of Lotus Capital, meanwhile she is a venture partner of Oriza Seed. For the past 20 years, June has been focused on the VC/PE investment in China, especially on the integrated circuits and information technology sectors. June played partner roles in DFJ ePlanet, Rothschild China Fund and Oriza Chong Yuan in her career life. June holds a degree of BEE and MBA, by taking advantage of a mix of technology background and investment expertise, she is seasoned in technology investment, post-management and exit in the capital market not only of China including mainland, Hong Kong and Taiwan, but of US and Singapore as well.
JY Zhang
Chairman and CEO
JY Zhang
Chairman and CEO
JingYang Zhang is Founder, Chairman and CEO of MooreElite since 2015. MooreElite is a leading IC Ecosystem company providing “IC design service, supply chain management, talent service”, with mission of “Make IC Design Easy & Efficient”. Mr. Zhang is a Member of Pudong Youth Federation, Pudong Top Ten Outstanding Young Entrepreneurs and Vice President of Southeast University IC Alumni Association.
Mr. Zhang started his career as RFIC Designer of Institute of RF-&OE-ICs; he then joined IBM Microelectronics as Foundry Technical Solution AP Team Lead and moved into IBM Foundry BD Manager. Mr. Zhang was Senior Manager of SEMI (Semiconductor Equipment and Materials International) from 2013 to 2014; Director of Business Development at Shanghai Industrial Technology Research Institute from 2014 to June 2015.
Mr. Zhang holds an M.S. EE from Southeast University, and EMBA of Economics and Management from Tsinghua University.
“MooreElite” under the brand of MooreElite Integrated Circuit Industry Development (Hefei) Co., Ltd. is a leading IC design accelerator, providing IC design service, supply chain management, talent services and enterprise services for over 1500 fabless and 500,000 semiconductor professionals. Our mission is “Make IC Design Easy & Efficient”. We are committed to providing ASIC design and Turnkey solutions, from Spec/FPGA/Algorithm to chip delivery, including chip architecture planning, IP selection, front-end design, DFT, digital verification, physical design, layout, tape out, packaging and testing services to help our customer succeed in the market. Since 2012, our team has been serving customers with knowledge of how to get the most out of silicon, offering flexible service models such as Turnkey, NRE, consulting and onsite support. Head-quartered in Shanghai, China, MooreElite has over 300 employees worldwide, with offices in Beijing, Shenzhen, Hefei, Chongqing, Suzhou, Guangzhou, Chengdu, Xi’an, Nanjing, Xiamen, Hsinchu and San Jose.
Kam Lee
Senior Director, Advanced Packaging Technology and Service
Kam Lee
Senior Director, Advanced Packaging Technology and Service
Kam currently serves as Senior Director at TSMC Advanced Packaging Technology and Service, which he joined in 2022. He specifically manages the TSMC Testing RD, Testing operations and backend turnkey operations. He has extensive experience in semiconductor industry, having worked 27 years at Intel, in various roles in technology development, product development and high volume manufacturing. He previously held the role of Vice President of Intel product development and engineering.
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
Kangwook Lee, Ph.D.
SVP and Head of PKG Development
Kangwook Lee, Ph.D.
SVP and Head of PKG Development
Dr. Lee has been one of critical leaders who are leading the era of 3D TSV stack memory such as HBM (High Bandwidth Memory) in semiconductor industry.
He has contributed broadly to, and led teams in, 3D integration/packaging R&D including core technology/product development/reliability study and mass production for HBM over 27 years.
Dr. Lee received the Ph.D. degree in machine intelligence and systems engineering from Tohoku University, Japan, in 2000. During his doctoral research at Tohoku University,Dr. Lee proposed a new 3D-IC integration technology to achieve 3D devices with high performance and multi-functionality, leading this field in the world.
From 2001 to 2002, he was a Postdoctoral Researcher with the Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.
He worked with Memory Division, Samsung Electronics Ltd., Korea, as a Principal Engineer from 2002 to 2008.
From 2008 to 2016, he worked with the New Industry Creation Hatchery Center (NICHe), Tohoku University, Japan, as a Professor.
From 2017 to 2018, he worked with R&D center, Amkor Technology Korea, as a VP.
He joined SK hynix 2018 and currently Senior VP, Head of PKG Development at SK Hynix, Korea.
Dr. Lee has led many interdisciplinary R&D programs on 3D integration, including integration of various materials and devices to achieve 3D devices/systems with high performance and new functionality, 3D-IC reliability research to investigate the impacts of 3D integration on the device performance and reliability, unique hybrid integration of nano-materials with Si, and product development of 3D stack DRAM such as high-bandwidth memory (HBM). For over 27 years at universities and industries in Japan, US, and Korea, Dr. Lee has made exceptional technical contributions to and lasting impacts on 3D integration technology and 3D product development in broad fields, such as material science, materials characterization/analysis, semiconductor device/process, electrical packaging, and Si micro-machining.
Dr. Lee has authored more than 230 scientific publications (peered journals, international conferences), co-edited 4 books, and given 43 tutorial/invited/keynote talks in international conferences including IEEE IEDM, IEEE IRPS, VLSI Symposium, plus 23 US patent publications.
He has served as a frequent reviewer for a number of journals, including IEEE EDL, IEEE T- ED, IEEE CPMT, and technical program committees of international conferences, including IEEE ECTC, IEEE IRPS, IEEE EDTM, IEEE 3D SIC.
He is a Senior Member of IEEE.
An AI First Mover Leading the Global AI Memory Era
With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees.
Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in pursuit of more social value and a healthier governance structure.
SK hynix will grow into a Full Stack AI Memory Provider, offering customized solutions tailored to the diverse needs of global customers, covering both DRAM and NAND flash, in the era of full-scale AI.
Kok Tiong Ng
SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd
Kok Tiong Ng
SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd
Mr. Ng Kok Tiong: A Visionary Leader in the Semiconductor industry as the Senior Vice President and Managing Director of Infineon Technologies (Kulim) Sdn. Bhd, Mr. Ng Kok Tiong has been instrumental in spearheading Infineon’s first and only wafer fabrication plant in Asia, as well as the world’s largest 200mm Silicon Carbide Power Fab. Under his leadership, the Kulim site has transformed into a world-class wafer fab facility, employing over 4,000 people and driving growth, efficiency and excellence in the region.With an illustrious career spanning over 35 years in the semiconductor industry, Mr. Ng has accumulated extensive expertise in both front-end and back-end operations. He is an active contributor to the industry, serving in various associations such as the Semiconductor Fabrication Association Malaysia (SFAM) and the Malaysia Semiconductor Industry Association (MSIA). His thought leadership has earned him a platform to share his insights at numerous industry forums in Malaysia and the region.Beyond his industry accomplishments, Mr. Ng is committed to nation-building. Infineon Kulim has been appointed as the Mission Based Project (MBP 1.2) Champion for NIMP 2030, an initiative by Malaysian government aimed at attracting more wafer fab investments to Malaysia.A graduate of the National University of Singapore, Mr. Ng holds a bachelor’s degree in electrical and Electronic Engineering (1989). He is married with three daughters. Born in Malaysia, he is fluent in English and Malay, and conversational in Mandarin and German.
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
LW Yong
Head of R&D, Power Modules in Asia
LW Yong
Head of R&D, Power Modules in Asia
LW has 40 yrs of work experience with more than 35 years in semiconductor industry and 4 years in the Fibre Optics industry. He is currently the Head of Wolfspeed R&D for Power modules in Asia. He has worked in different countries in numerous positions from President, CTO, GM, VP of QA, Engineering & Facilities from Wafer Fab to Test including companies like Amkor, Carsem, Motorola, ST Micro, Hitachi and Finisar. He has also played Strategic Roles representing multiple sites, working with global teams as well as in having in depth & hands-on Operations/Engineering, Quality management background. In addition, he has also collaborated and participated actively with suppliers, government agencies and local institutions in various projects including Grants & Pioneer incentives, technical competencies development Programs with local Universities and Polytechnics. LW is also a member in the Semi SEA Regional Advisory Board since 2016.
Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of Silicon Carbide and GaN technologies. We provide industry-leading solutions for efficient energy consumption and a sustainable future. Wolfspeed’s product families include Silicon Carbide materials, power-switching devices and RF devices targeted for various applications such as electric vehicles, fast charging, 5G, renewable energy and storage, and aerospace and defense. We unleash the power of possibilities through hard work, collaboration and a passion for innovation. Learn more at www.wolfspeed.com.
Wolfspeed® is a registered trademark of Wolfspeed, Inc.
Markus Ulm
SVP Business Unit Sensors, Mobility Electronics
Markus Ulm
SVP Business Unit Sensors, Mobility Electronics
SVP, head of BU MEMS Sensors within Mobility Electronics, within Bosch Group since 1998, since then various positions in field of MEMS, semiconductors, and sensor R&D.
Section Manager in the Bosch Research and Technology Center North America (03-06).
Section Manager for MEMS Automotive Gyroscopes and IMUs modules (until 09).
Director of MEMS Sensor Predevelopment (until 13) as well as VP for Consumer Sensor Product Development @ Bosch Sensortec (until 18), CTO since then until 07/22.
He holds various patents and co-authors several papers on MEMS sensors devices and process technology.
Markus received his Diploma Degree in Physics from Karisruhe Institute of Technology, MSc from University of Oregon, and PhD in semiconductor Technology of University Stuttgart, Germany in 2003.
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Martin Weigert
VP & GM Industrial Fiber Products Division
Martin Weigert
VP & GM Industrial Fiber Products Division
Martin Weigert is the Vice President & General Manager of the Industrial Fiber Products Division which manufactures fiber optic and sensor products targeting the industrial, automotive and medical market. Martin Weigert worked for Siemens/Osram/Infineon/Avago for over 20 years and has held various development & marketing positions in the company’s fiber optic and LED product divisions. Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. He is currently in charge of the P&L for the Industrial Fiber Product Division at Broadcom. Martin studied Micro System Technology and has a technical background in MEMS, Optoelectronics and Semiconductors. He is the managing director of the Avago Technologies GmbH in Munich, Avago Technologies Fiber Austria GmbH in Vienna and a member of the supervisory board at CISES (Chinese International Semiconductor Executive Summit).
20 years experience in Fiber Optics
1994 -1997 – Process development MEMS
1997 -1998 – Task force leader production ramp-up
1998 –1999 – Project leader optical SMD devices
1999 –2000 – Marketing Manager Automotive LED
2001 –2004 – Director Development Fiber Optics
2004 –2006 – Director Marketing POF
2006 –2007 – Director Product Line Manager (R&D+Marketing) at Infineon
Since 2008 – General Manager Industrial Fiber Optics at Avago Technologies
Since 2009 – Managing Director “Avago Technologies Fiber GmbH”
2011-2017 – Member of the supervisory board at MIC AG
Since 2012 – Managing Director “Avago Technologies Fiber Austria GmbH”
2014-2016 – Vice President & General Manager at Avago Technologies
Since 2016 – Vice President & General Manager at Broadcom
Marvin Liao, Ph.D.
Advisory Board Member
Marvin Liao, Ph.D.
Advisory Board Member
Education :
Ph.D., Materials Science, University of Texas, USA, 1989
Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979
Experience :
TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
TSMC, Special Project, 2009 ~ 2010
TSMC, Fab 6 Director, 2003 ~ 2009
Chartered Semiconductor, 1997 ~ 2002 (Singapore)
Applied Materials, 1994 ~ 1997 (USA)
SGS Thomson Microelectronics, 1990 ~1994 (USA)
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Maurus Tschirky
Senior Strategic Marketing Manager
Maurus Tschirky
Senior Strategic Marketing Manager
Maurus Tschirky is Senior Strategic Marketing Manager at Evatec. He is globally responsible for the market segment MEMS in terms of strategy and strategic project and customer acquisition. His genuine interest in advanced functional materials with piezoelectric and magnetic properties emphasize his dedication to the MEMS and Sensors market in particular. Maurus had a number of positions in the PVD-equipment industry (Balzers, Unaxis, Oerlikon and now Evatec) ranging from Application Engineer, System Engineer, Project Manager to Product Manager over the years and also spent 3 years leading a research section at CSEM in Neuchatel, Switzerland. He has a first Degree in Control Electronics from the University of Applied Sciences in Buchs, followed by a Masters in Business Engineering / International Marketing from the Hochschule für Wirtschaft und Technik in Zurich, Switzerland.
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
Michael Siebert
Sales Manager
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
Michelle Bourke
Managing Director Specialty Technologies and Strategic Marketing
Michelle Bourke
Managing Director Specialty Technologies and Strategic Marketing
Michelle Bourke received her B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University in Scotland, UK. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 she entered the semiconductor capital equipment industry as a technologist and has since accrued more than 25 years of experience in semiconductor technology, strategy, and new product development. She is a specialist in fabrication technologies for MEMS, Power Devices, RF Electronics and Optoelectronics. Michelle is a frequent presenter at leading industry forums and also serves on many committees and industry councils. In November of 2018, she was inducted into the Semi MEMS and Sensors Industry Group Hall of Fame and in 2020 she was a Silicon Valley YWCA Tribute to Women Honoree. Michelle is currently Chair of the Semi MEMS Manufacturing Working Group, Co-chair of the Semi MEMs Standards Committee and a Director on the Transducers Research Foundation Board where she is the Chair of Fund Raising and Development Committee. Michelle joined Lam Research in 2015 and is currently Managing Director of Specialty Technologies and Strategic Marketing in Lam’s Customer Support Business Group.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
Mike Rosa, Ph.D.
CMO & SVP Strategy
Mike Rosa, Ph.D.
CMO & SVP Strategy
Mike Rosa is chief marketing officer (CMO) and senior vice president responsible for strategy at Onto Innovation. Prior to his current role, Mike served as CMO for Applied Materials ICAPS and Advanced Packaging Groups, where he was responsible for leadership of strategic and technical marketing, marketing communications, charting device segment inflection roadmaps and providing strategic business development support toward M&A activities. He has over 25 years’ experience in semiconductor engineering and technology, with roles that span device design and fabrication, equipment development, marketing and sales. His technical qualifications include B.Eng. (Hons) and Ph.D. degrees in Microelectronic Engineering and an MBA with dual majors in Marketing and Business Strategy. Mike has authored over 40 journal and conference publications and holds over 29 U.S. patents
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Dr. Mohssen Moridi is an expert in microtechnology with over 20 years of experience in the development of MEMS devices. He holds a Master’s and Ph.D. in Microtechnology from École Polytechnique Fédérale de Lausanne (EPFL), Switzerland. After completing his doctoral studies, he held various research positions in Switzerland, contributing to advancements in microsystems technology. In 2016, he moved to Austria to lead the Microsystem Division at CTR AG, where he established a MEMS department and managed the development of a new cleanroom dedicated to industrial R&D. Since 2019, he has been part of Silicon Austria Labs (SAL) and currently serves as Senior Executive Director and Head of the Microsystems Research Division. In this role, he leads a team of over 60 researchers, driving innovation in thin-film technologies, integrated photonics, and magnetic and piezoelectric microsystems. With extensive experience at the intersection of research and industry, Dr. Moridi plays a key role in shaping cutting-edge microsystem technologies, bridging fundamental research with industrial applications.
Najwa Khazal
Chief Operating Officer
Najwa Khazal
Chief Operating Officer
Najwa Khazal is the Chief Operating Officer for Busch Group USA and a global business leader with 20+ years of experience across America, China, EMEA, India, and Mexico. She specializes in supply chain management, program management, and digital transformation for $3B organizations in industries such as aerospace, automotive, energy, medical, and more. Najwa excels in leading complex, multimillion-dollar projects from concept to commercialization, while driving cost optimization and sustainable performance. A passionate educator with 12+ years of teaching international business, she is trilingual and recognized for her exceptional leadership, strategic execution, and commitment to operational excellence across global markets.
Pfeiffer Vacuum+Fab Solutions delivers best-in-class vacuum and semiconductor fabrication solutions for a wide range of industries, including semiconductor manufacturing, analytics, research, and other high-tech applications. We combine advanced vacuum technologies, such as pumps, leak detection systems, and measurement instruments, with specialized fab solutions to support critical processes with maximum precision and reliability.
As part of the Busch Group, one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors, and gas abatement systems, we have access to a global network of expertise and innovation. The Busch Group brings together three industry-leading brands: Busch Vacuum Solutions, Pfeiffer Vacuum+Fab Solutions, and centrotherm clean solutions.
With over 8,000 employees in 44 countries, the Busch Group is committed to delivering superior service and cutting-edge technologies worldwide. The group operates 23 production plants across key regions, including China, Germany, the USA, Vietnam, and others, ensuring global reach with local support.
Noorazidi Che Azib
Deputy Vice President
Noorazidi Che Azib
Deputy Vice President
Noorazidi is currently attached to Inari Technology Sdn. Bhd. (a wholly owned subsidiary of Inari Amertron Berhad) as Deputy Vice President for OTSP (Operation Technology and Strategic Programs) and EHS (Environment, Health and Safety). Possessing a Mechanical Engineering degree from University Of Nevada, Reno, USA, Azidi started his career in the semiconductor related high-volume manufacturing, process engineering, automation system design, Industry 4.0 and environment sectors for the past 30 years with experience working with multinational companies like AMD, Hewlett Packard, Agilent and Avago. Beside transforming Inari into digitalization and cyber-physical-system adoption, Azidi has strong relationship with local academia (secondary and tertiary levels) for the work on developing new industrial-ready talents in the preparedness, exposure and pre-experience prior to joining the industry. Established strong collaborations with government agencies such as MPC, MIMOS, MIDA and MITI for the internal adoptions of advanced technology development and supporting local SME productivity and business developments.
Inari Amertron Berhad is an investment holding company with wholly-owned subsidiaries involved in the Outsourced Semiconductor Assembly and Test (OSAT) & electronics manufacturing (EMS) industries. Products manufactured involved the RF filters module in mobile communications, optoelectronic products segment, sensors and indicators in automotive segment and others. Manufacturing capability includes prost wafer processing operations, surface mount technology, package assembly and full RF and electrical test capabilities.
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Oreste Donzella serves as Executive Vice President and Chief Strategy Officer at KLA Corporation, leading key corporate growth initiatives and working closely with external stakeholders, such as financial investors and end customers in the broad electronics ecosystem.
Prior to his current role, Oreste was Executive Vice President, managing the Electronics, Packaging and Component (EPC) business group at KLA Corporation, which included multiple product divisions, targeting growth opportunities in specialty semiconductors, packaging, printed circuit board and display markets.
Previously, Oreste was the Chief Marketing Officer (CMO) of KLA. In this role, he oversaw corporate marketing activities, market analytics and forecast, and companywide collaborations with the broad electronics industry.
In the years before his CMO role, Oreste led the world-wide field applications engineering team, and was responsible for Customer Engagement projects and product portfolio optimization for wafer inspection platforms at KLA.
Previously, Oreste was Vice President and General Manager of the Surfscan and SWIFT divisions at KLA-Tencor. In these positions, he was responsible for the unpatterned wafer inspection, wafer geometry, and macro inspection business, overseeing new products development, sales, and marketing activities, customer support, and ultimately, division financial performance (P&L).
Oreste brings 30+ years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent almost seven years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.
Oreste holds various patents and is featured in several technical publications.
In 2020, Oreste was awarded with VLSI Semiconductor All Star for “charting KLA’s path into new markets related to More than Moore semiconductor technologies”
Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy .
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
Primit Parikh, Ph.D.
VP GAN
Primit Parikh, Ph.D.
VP GAN
Primit leads GaN business at Renesas, following its recent acquisition of Transphorm Inc., where he was the Co-founder, President and CEO. Prior to this, he led Transphorm, a pioneer and leader in GaN Power Semiconductors, having grown it from inception to leading its public company listing (Nasdaq/TGAN) and transformation partnering with it’s phenomenal team. He is passionate about creating value from the intersection of business and technology. With over 25 years of semiconductor & entrepreneurial experience, his background includes capital raises, international markets & strategic partnerships, key customer relationships, products & manufacturing, IP, GaN/Semi technology and Government contracting. Prior to Transphorm, Primit led GaN electronics at Nitres Inc. through its acquisition by Cree, where he led GaN development and government business P&L. Primit received his B.Tech. in EE from IIT, Mumbai and his MS & Ph.D. in Electrical and Computer Engineering from UCSB. He has more than 40 patents awarded and co-authored more than 75 publications and presentations. He is blessed to reside in the amazing Santa Barbara area with his wonderful family.
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Prof. Dr. Zewen Liu
Professor
Prof. Dr. Zewen Liu
Professor
Prof. Dr. Zewen Liu received his BS degree in Physics from the University of Science and Technology (USTC), Hefei, China in 1983 and received his Ph.D degree in Microfabrication from the University of Paris-sud (Paris Saclay University), Paris, France in 1997. Then he joined Institute of Microelectronics at Tsinghua University (IMETU) and was the vice director of the IMETU. His research interests are MEMS, Nano Technologies and Integrated Sensors. He is one of the pioneers on RF MEMS and had engaged on RF MEMS devices and applications for more than 20 years. He published about 200 academic papers and is an inventor of more than 50 patents. He is also the author of two English Book Chapters in MEMS and Nanotechnology.
The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.
Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.
The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.
Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.
After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.
Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.
With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.
Prof. Shaojun Wei
Professor
Prof. Shaojun Wei
Professor
Dr. Shaojun Wei is the professor of Tsinghua University; Member of the National Integrated Circuit Industry Development Advisory Committee; Vice President of China Semiconductor Industry Association (CSIA) and President of Fabless Chapter CSIA. Dr. Wei was the President & CEO of Datang Telecom Technology Co., Ltd. and the CTO of Datang Telecom Industry Group between 2001-2006.
Dr. Wei has been working on VLSI design methodologies research and reconfigurable computing technology research. He has published more than 200 peer-reviewed papers and 6 monographs. He owns more than 130 patents, including 18 US patents. Dr. Wei is the IEEE Fellow, the Fellow of Chinese Institute of Electronics (CIE), the Fellow of Asia-Pacific AI Association, and the academician of the International Eurasian Academy of Science (IEAS).
Dr. Wei had won many awards including China National Second Award for Technology Invention (2015), China National Second Award for Technology Progress (2001), SIPO & WIPO Patent Golden Award (2003, 2015), First Award for Science and Technology of Ministry of Education (2014, 2019), China, First Award for Technology Invention of CIE (2012, 2017, 2020), EETimes China IC Design Achievement Award (2018), Aspencore Outstanding Contribution Award of the Year/Global Electronic Achievement Awards (2018), SEMI Special Contribution Award (2019) and IEEE CAS Industrial Pioneer Award (2020).
The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.
Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.
The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.
Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.
After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.
Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.
With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.
Prof. Tianchun Ye
Researcher Professor
The Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS) was established in 1958 as the CAS No. 109 Semiconductor Factory under the former CAS Institute of Applied Physics. Its original goal was to meet the nation’s strategic need to develop a high-frequency transistor computer. After numerous changes and mergers, it assumed its current name in 2003.
The IME is the only comprehensive scientific research institution in China, capable of carrying out full-chain research and development from microelectronic principal devices, integration processes, high-end chips, advanced packaging, and manufacturing equipment to applications.
IME comprises a national key laboratory, two CAS key laboratories, 11 research departments, and three technology research centers, covering all the main research areas of microelectronics. IME has a Ph.D. program in electronics and information; two master’s degree programs in IC engineering, and electronic and communication engineering, respectively; and a postdoctoral program in microelectronics.
IME has established long-term cooperative relationships with many national research institutions, universities, and companies in such countries as the United States, the United Kingdom, Germany, Japan, and Singapore, etc. A large number of delegations visit the institute every year, giving lectures, conducting academic exchange, and undertaking cooperative research projects.
Company website: www.ime.ac.cn
Rainer Kaesmaier, Ph.D.
Managing Director Semiconductors
Rainer Kaesmaier, Ph.D.
Managing Director Semiconductors
Dr. Rainer Kaesmaier is a Managing Director for the Global Product Group Semiconductors of Hitachi Energy, leading the semiconductor business with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes for market segments such as energy transmission & distribution, transportation & rail, renewable, industrial, and emobility. Rainer is a semiconductor industry veteran having held various management and executive positions in the sector for more than 25 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he resumed in 2018 the responsibility for ABB’s semiconductor business which is now Hitachi Energy. He is also a member of the board for Hitachi Energy Switzerland. Rainer was a member in various industries strategy committees in Europe and the US. Rainer holds a masters degree in physics from the Technical University Munich and a PhD in physics from the University Kassel in Germany. He is based in Lenzburg near Zürich, Switzerland.
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Hitachi Energy Switzerland Ltd.
Semiconductors
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland
Phone: +41 58 586 14 19
Fax: +41 58 586 13 06
Email: salesdesksem@hitachienergy.com
www.hitachienergy.com/semiconductors
Ralf Bornefeld
SVP Power Semiconductors & Modules
Ralf Bornefeld
SVP Power Semiconductors & Modules
Ralf Bornefeld is Senior Vice President with responsibility for the business unit Power Semiconductors & Modules at Bosch.
Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.
Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.
Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Ralph Zoberbier
CMO
Ralph Zoberbier
CMO
After completing his first degree in applied sciences, Ralph completed his MBA in 2006 and gained over 20 years experience in the semiconductor equipment business across roles in engineering, product management and global business & sales management. He joining Evatec in 2019 as Head of BU Advanced Packaging leveraging his expertise across thin film technology, lithography and plating. At the end of 2023 he became Evatec CMO responsible for the team at Evatec headquarters driving business across all Evatec markets including packaging , semiconductor, optoelectronics and photonics. Today he also leads its global sales and service teams.
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
Ray Yang
Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)
Ray Yang
Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)
Ray Yang is consulting director at Industry, Science and Technology International Strategy Center of ITRI (Industrial Technology Research Institute), which is one of influential think tanks in Taiwan. Ray is currently also appointed by ITRI HQ as BD director at Office of Business Development. Ray is responsible for emerging technology and market dynamics research especially about semiconductors as well as industry-related geo-political issues.
Ray has more than 30 years’ experience with semiconductor industry, and had been advisor to Horizon 2020 “NanoElectronics Roadmap for Europe: Identification and Dissemination” 3-years’ project, and continues to serve as international advisor to Horizon Europe project “International Cooperation on Semiconductors” since 2024. Ray is serving as committee member at SEMI Taiwan Packaging & Testing, Smart Manufacturing, and MEMS & Sensors committees. He is also appointed as vice-chair of semiconductor supply-chain committee in CIECA (Chinese International Economic Cooperation Association) of Taiwan.
Ray’s analysis and commentary have been featured in the New York Times, the Wall Street Journal, Al Jazeera, Deutsche Welle, Reuters, among others. He also appeared on Taiwan’s media such as Central News Agency, Radio Taiwan International, United Daily News, and has provided commentary for ERA TV, a Taiwanese broadcast media outlet.
Ray holds a MBA from Tel-Aviv International School of Management in Israel, and receives bachelor degree of electrical engineering with honor from National Tsing Hua University of Taiwan in 1986.
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.
Robert Ferguson
President and CEO
Robert Ferguson
President and CEO
Bob Ferguson is President and CEO of Schmid Systems Inc., part of the Schmid Group based Freudenstadt, Germany. He oversees US operations and drives growth for the company’s manufacturing solutions in the Electronics, Photovoltaics, Energy Systems and Customer Service markets.
A seasoned executive with a distinguished 30-year track record in the specialty chemicals and electronic materials sectors, Bob’s combined corporate and consulting expertise includes strategic planning, sales and marketing excellence, M&A due diligence and integration, Asia sourcing strategies and human capital.
Bob previously served as Executive Vice President Electronic Materials & Asia, Avantor Performance Materials where led the turn-around of the semiconductor business. Prior to this appointment and China-based, he was Corporate Vice President, Asia Development at Veeco Instruments and Corporate Vice President, Electronic Materials, and Global Business Unit Director at Dow Chemicals.
Bob is a prior Board Member and former Chair for IPC International (www.ipc.org), an electronics standards and trade association, as well as the founder of boutique consultancy, BreakFree Strategies. Additionally, he served as a Board Member and Chair of Nichigo Morton, a Japanese based joint venture between Rohm and Haas (now Dow Chemicals) and Nippon Gosai.
The SCHMID Group is a world-leading global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, with its parent company Gebr. SCHMID GmbH is based in Freudenstadt, Germany. Founded in 1864, today it employs more than 800 staff members worldwide, and has technology centers and manufacturing sites in multiple locations including Germany and China, in addition to several sales and service locations globally. The Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables, and energy storage. Our system and process solutions for the manufacture of substrates, printed circuit boards and other electrical components ensure highest level of technology, high yields with low production costs, high efficiency, quality, and sustainability in green production processes. www.schmid-group.com
Roland Rettenmeier
CSO
Roland Rettenmeier
CSO
Roland Rettenmeier is a seasoned Sales and Business Development expert in Advanced Packaging with 25+ years of experience across PCB, IC substrates, Wafer-Level, and Panel-Level packaging.
After qualifying as a Mechanical Engineer in 1997, he started his career at AT&S AG, where he worked in various departments. In 2005, he completed his MBA in Vienna and continued expanding his expertise through programs like Six Sigma (AT&S, Nokia) and executive education at Stanford University.
Over his 25-year career, Roland built a solid track record in leading high-performance teams and delivering consistent revenue growth in the Advanced Packaging Industry.
In March 2025, Roland joined SCHMID Group as CSO and works with the global sales organization on current and future opportunities.
Roland also plays a key role in the industry as Committee Member and Session Chair of the SEMI Advanced Packaging Conference in Europe and Advisory Board Member of the International Semiconductor Industry Group.
With his deep industry knowledge and global network, Roland remains at the forefront of semiconductor packaging innovation.
The SCHMID Group is a world-leading global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, with its parent company Gebr. SCHMID GmbH is based in Freudenstadt, Germany. Founded in 1864, today it employs more than 800 staff members worldwide, and has technology centers and manufacturing sites in multiple locations including Germany and China, in addition to several sales and service locations globally. The Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables, and energy storage. Our system and process solutions for the manufacture of substrates, printed circuit boards and other electrical components ensure highest level of technology, high yields with low production costs, high efficiency, quality, and sustainability in green production processes. www.schmid-group.com
Samuel Liu
VP
Sandra Vos, Ph.D.
Engineering Director, Pressure and Flow Industrial and Medical Sensors – TE Sensors
Sandra Vos, Ph.D.
Engineering Director, Pressure and Flow Industrial and Medical Sensors – TE Sensors
Sandy Vos received her PhD from University of Minnesota in Materials Science and Engineering, B.S. in Chemistry from University of Illinois, Chicago and has 25 years of industry experience in MEMS, microsystem, materials, component, composite and semiconductor technology. She recently joined TE Connectivity as Director of Engineering, Pressure and Flow, focused on industrial and medical sensor product and technology development. Previously, as Director of R&D at NXP, she focused on inertial and pressure sensing, including automotive safety-critical devices. Dr. Vos was Director of MEMS Engineering and Sr Manager of Product Development at Knowles Corporation in their Consumer Electronics division, developing acoustic MEMS sensors for consumer and hearing health applications. She has also worked in the fields of surface mount fuse and suppressor design and manufacturability at Littelfuse, Inc and plastic composite design and manufacturability at Azdel, Hanwha.
TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS.
Santosh Kumar
Vice President
Santosh Kumar
Vice President
Santosh Kumar currently serves as the Vice President and involved in the semiconductor strategy (head of division), AI and data centres at Reliance Industries Ltd. Prior to that, he was based in South Korea and worked as a Senior Director at Yole Intelligence, a semiconductor technology and strategy consulting company. With a strong background as both technologist and strategist, he has led and contributed to strategic technology and market analyses, collaborating with global companies across the semiconductor value chain- including fabless firms, OEMs, IDMs, OSATs and equipment and materials suppliers. He received the bachelor’s and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul, respectively. He has published more than 50 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
Our motto “Growth is Life” aptly captures the ever-evolving spirit of Reliance. Our activities span hydrocarbon exploration and production, petroleum refining and marketing, petrochemicals, retail, and telecommunications. In each of these areas, we are committed to innovation-led, exponential growth. Our vision has pushed us to achieve global leadership in many of our businesses – including our position as the largest polyester yarn and fiber producer in the world. Reliance Industries Limited is a Fortune 500 company and the largest private sector corporation in India. As Reliance sets sights on even more ambitious goals, we remain inspired and guided by the story and philosophy of our founder chairman Dhirubhai Ambani. Hailing from modest means, he followed his dream to create India’s largest company. Reliance as an organization has adopted this ethos of converting adversity into opportunity and making the impossible possible by challenging conventional wisdom. Our ultimate aim has always been – and will always be – to touch the lives of people in a positive way
Seung Wook Yoon, Ph.D, MBA
CVP Business Development Team, AVP
Seung Wook Yoon, Ph.D, MBA
CVP Business Development Team, AVP
Dr. YOON is currently working as Corporate VP/Head of Group, PKG group, Product Technology, S.LSI, Samsung Electronics. Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC, JCET Group. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. ”YOON” received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Served as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
Sharon Ko Mei Wan
Managing Director
Sharon Ko Mei Wan
Managing Director
Sharon Ko is the Managing Director of Analog Devices Malaysia, where she leads the company’s operations in the region. With over 30 years of experience in the semiconductor and electronics industry, Sharon’s career has spanned several prestigious companies. She began her professional journey in semiconductor manufacturing with Siemens Components, before taking on various senior management roles at National Semiconductor, where she contributed to development, technical research, engineering, and manufacturing operations. Sharon’s expertise in semiconductor technology is underscored by her impressive portfolio of 11 international patents, reflecting her innovative contributions to the field. Her leadership and accomplishments have earned her numerous accolades, including being named ‘Malaysia’s Best Employee’ in 2004 awarded by the Prime Minister of Malaysia. Following this, Sharon led the global Engineering Team and was later appointed as the General Manager in Carsem, showcasing her leadership and strategic vision in the semiconductor industry as one of the pioneers in the industry to implement automation in assembly manufacturing. Sharon also currently sits on the Board of Governors for the American Malaysian Chamber of Commerce.
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With reported revenues of more than $12 billion in FY22 and more than 24,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn and Twitter.
Simone Ferri
Analog, Power, MEMS and Sensors Group Vice-President, MEMS sub-group General Manager
Simone Ferri
Analog, Power, MEMS and Sensors Group Vice-President, MEMS sub-group General Manager
Simone Ferri is General Manager for STMicroelectronics MEMS sub-group since February 2016. Simone began his career in STMicroelectronics in 1999 as an R&D engineer, before moving on to digital designer for the Audio Division, leading into product management after 5 years. In 2014, Simone was entrusted with ST MEMS consumer sensors then with global MEMS-sensor related Marketing and Application activities across all markets and segments, and, more recently with APMS Group Vice-President and General Manager of the MEMS sub-group.
Simone Ferri was born in Milan in 1972 and graduated with a degree in Microelectronics from the Polytechnic of Milan, where he also completed his MBA.
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Tadahiro Suhara
CEO
Tamara Baksht
CEO
Tamara Baksht
CEO
Born and raised in Tomsk, Siberia, former USRR, Tamara is founding CEO of VisIC technologies a and one of the pioneers in GaN transistors technology. Tamara’s GaN expertise started from PhD study in Tel Aviv, Israel in 2001 for high power high frequency GaN transistors and continued through development and qualification of GaN technologies for power and RF applications.
Prior Tel Aviv’s PhD, Tamara earned degrees in Philosophy and Physics from Tomsk State University, and last 10 years she is leading the VisIC company to be the major player in power electronics for EV market.
VisIC Technologies has a decade of experience in creating, developing, and advancing concepts based on cutting-edge Gallium Nitride-on-silicon technology. We develop solutions that help reduce energy waste in power conversion systems, with a focus on battery electric vehicles (BEV). Our patented D3GaN technology – Direct Drive D-mode GaN – addresses the automotive industry’s cost, supply, sustainability, reliability, quality, and performance needs.
With our D3GaN technology, BEV can save up to 50% on power losses over the driving cycle of the electric car, thus reducing battery cost and increasing driving range and performance. This solution also reduces the cooling system requirements and the size of the BEV inverter.
VisIC Technologies has produced the first GaN-based transistors used in automotive inverters. By utilizing the GaN on Silicon technology, we address the supply chain concern as we are using existing semiconductor high-volume production lines.
Thomas Stenger
Senior Vice President, Head of Business Line Functional Materials
Thomas Stenger
Senior Vice President, Head of Business Line Functional Materials
Thomas Stenger is Senior Vice President, heading the Functional Materials Business Line at Heraeus Precious Metals. He holds a Master’s degree in Industrial Engineering and has 20 years of experience in the precious metals industry. He served in various roles, always dedicated to enhancing Heraeus’ materials business across diverse sectors such as Automotive, Medical, PV, or Semiconductor. Thomas is dedicated to driving innovation and developing material solutions that empower industries to achieve the next technological advancements.
Heraeus Precious Metals is globally leading in the precious metals industry. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to refining and recycling. It has extensive expertise in all platinum group metals as well as gold and silver. With more than 3,000 employees at 17 sites worldwide, Heraeus Precious Metals offers a broad portfolio of products that are essential for many industries such as the automotive, chemicals, semiconductor, pharmaceutical, hydrogen and jewelry industry.
Thy Tran
Vice President of Global Front End Procurement
Thy Tran
Vice President of Global Front End Procurement
Thy Tran, VP of Global Front End Procurement, joined Micron Technology in 2008, and has over 30 years of semiconductor experience in the US, Asia, and Europe. She held leadership roles in R&D, technology transfer and manufacturing for DRAM, SRAM and logic technologies, including two fab startups. In her previous role as VP of DRAM Process Integration, Ms. Tran led Micron’s global team in the US and Asia to drive DRAM technology development and transfer to manufacturing fabs. Prior to joining Micron, she worked in the at Motorola, Siemens, Infineon, Qimonda, and WaferTech. Ms. Tran is an alumnus of the University of Washington Electrical Engineering and Stanford Graduate School of Business Executive Program, and McKinsey Executive Leadership program. She is a recipient of the 2023 Global Semiconductor Alliance Women of Influence Award, a senior member of IEEE, and serves on several strategic advisory boards.
Tim Yeh, Ph.D.
Technical Director
Tim Yeh, Ph.D.
Technical Director
Yeh, Nientze, Ph.D. in Electrical Engineering from National Central University, Taiwan. He has long been engaged in the research and industry of compound semiconductor materials and devices, especially having 25 years of industrial R&D experience in the field of wide band-gap semiconductor materials and devices. Proficient in the design and industrial manufacturing of compound semiconductor devices. Has served as a researcher at the Telecommunication Laboratories of Chunghwa Telecom Co, Ltd. and the technical head of a listed company in Taiwan. The research results have obtained more than 30 patent authorizations in the United States, Japan, the Chinese and Taiwan, and published more than 70 international journal papers. He has also participated as the project or subject leader in several major projects and national key R&D programs.
Currently serves as the technical director of Hunan Sanan Semiconductor Co, Ltd., responsible for the R&D and mass production of compound semiconductor power electronic devices, and successfully built a production line of wide band-gap semiconductor power electronic devices from epitaxy to devices.
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Tomomitsu Maoka
Chief Strategy Officer
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Vincent Dicaprio
Vice President – Head of Business and Corporate Development and Technology Pathfinding, Advanced Packaging and ICAPS
Vincent Dicaprio
Vice President – Head of Business and Corporate Development and Technology Pathfinding, Advanced Packaging and ICAPS
Vincent has accumulated over 35 years of experience in Technology Development, Operations, Business, Sales, and Marketing, demonstrating success at renowned companies such as IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES. He joined Applied Materials in 2016.
Currently leading Technology Pathfinding, Corporate, and Business Development within the Advanced Packaging and ICAPS division at Applied Materials, Vincent is responsible for establishing strategic alliances and partnerships essential to advancing technology for future product solutions. He oversees all aspects of critical technology transitions pertaining to Heterogeneous Integration, next-generation silicon integration, and volumetric scaling associated with advanced packaging technologies, including 3DIC Heterogeneous Integration.
In addition, Vincent serves on the Advisory Board of BESI, a company that specializes in advanced packaging equipment, International Semiconductor Industry Group and holds the position of Vice-Chairman at iNEMI, a consortium dedicated to the global electronics manufacturing supply chain.
Vincent holds a degree in Pure and Applied Sciences from Champlain Regional College and a Bachelor of Engineering degree from Concordia University. He is the author and co-author of over 40 patents in the field of advanced semiconductor packaging and heterogeneous integration.
Volker Herbig
VP BU Microsystems
Volker Herbig
VP BU Microsystems
Volker Herbig, VP BU Microsystems at X-FAB, oversees all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
Wee Seng Ang
Executive Director
Wee Seng Ang
Executive Director
With over two decades of experience in the semiconductor industry—ranging from fab start-ups and technology development to manufacturing and executive leadership—Wee Seng now helms the Singapore Semiconductor Industry Association (SSIA), where he drives talent development, business growth, and sustainable practices. He also serves on multiple advisory committees, including Singapore Polytechnic’s School of Electrical and Electronic Engineering, NTU’s School of Materials Science and Engineering, Industrial Transformation Asia-Pacific (ITAP), and Enterprise Singapore’s Smart Manufacturing and Environment & Resources Standards Technical Committees. Beyond the industry, Wee Seng is deeply committed to community outreach as a District Councillor with North East CDC. He holds a Bachelor’s degree in Electrical and Electronics Engineering from Nanyang Technological University and a Master of Science in Management of Technology from the National University of Singapore.
Singapore Semiconductor Industry Association (SSIA) is the voice of Singapore’s semiconductor industry and is committed to support this important sector in Singapore in order to facilitate substantial growth of the whole semiconductor economy of the country. SSIA brings together industry players, academia, and government agencies. Major activities focus on industry and talent outreach and continuing education, as well as to collectively address industry needs. SSIA is a platform for members to reach out to new business opportunities, industry alliances, and partners. It provides networking and relationship opportunities beyond the boundaries of Singapore. SSIA members today include companies and organizations throughout all parts of the complex and comprehensive value chain – IC design companies, Manufacturers, Fabless companies, Equipment suppliers, Photovoltaic and LED companies, EDA and material suppliers. Training and service providers, IP companies, Research institutes and Academia, as well as individual members.
Wei Wang
Director of BD
Wei Wang
Director of BD
Career
2016 – now Assistant president 、 Director of R&D and Operation in TSARI
2011 – 2016 General manager in MicRiver Information Systems
2001- 2010 AP Manager, BP, PM in Delphi Packard Electric Systems
Study
Graduated from Automotive Engineering Department of Tsinghua University in 1999, and Olin Business School of Washington University in St. Louis in 2008.
Other information
Senior engineer in management domain; Member of JS-SAE automobile intelligent manufacturing committee & Industry Standard Committee of Automotive Intelligent Manufacturing
Tsinghua University Suzhou Automotive Research Institute was established in 2011. It is the first specialized research institute of Tsinghua University for a specific industry. It is also a comprehensive automotive industry research institute jointly built by Tsinghua University and Suzhou Municipal Government. It is committed to the research and development of automotive application technology, transformation of scientific and technological achievements and incubation of high-tech enterprises.
Relying on the technical and talent advantages of Tsinghua University, guided by the major needs of the country and the industry, and with the mission of “leading technological innovation and promoting industrial progress”, we focus on new industries such as intelligent connected vehicles and new energy vehicles, and have established six business platforms: technology research and development, analysis and testing, science and technology finance, talent training, technology transfer, and enterprise incubation. We lead the innovative development of the industry with the research and development of new technologies and new products and industrial transformation, and promote industrial transformation and upgrading with technology, finance and talent services.
We have gradually built a comprehensive industrial innovation platform integrating scientific and technological innovation, industrial services and entrepreneurial incubation functions, forming an innovative industrial ecology where high-end talents gather, science and technology finance is active, and high-tech enterprises gather.
Wei-Chung Lo, Ph.D
Deputy General Director, Electronic & Optoelectronic System Research Laboratories (EOSL)
Wei-Chung Lo, Ph.D
Deputy General Director, Electronic & Optoelectronic System Research Laboratories (EOSL)
Dr. Lo received his Ph.D. from National Taiwan University and joined Industrial Technology Research Institute to work in advanced electronic packaging, such as WLP, 3D IC/3D stacking, fan-out, heterogeneous integration technology for more than 20 years, 85 papers and 40 patent granted. Currently, he also serves as TWG chair of IoT Chapter of IEEE Heterogenous Integration Roadmap(HIR) and chairman of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan chapter.
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
Winfred Chen Ph.D.
Chief Hardware Architect of AIoT, Home Service Robot, Intelligent Innovation Centre
Winfred Chen Ph.D.
Chief Hardware Architect of AIoT, Home Service Robot, Intelligent Innovation Centre
Chen Yuanfeng graduated from Fudan University in 2006 with a Ph.D. in Microelectronics.
From 2006 to 2013, he worked for Samsung Semiconductor in South Korea and was involved in the design of several mobile CPU chips, including the world’s first large and small nuclear concept of mobile phone CPU. Before leaving office, he was the head of Samsung’s Greater China mobile phone chip FAE and provided technical services to four mobile phone companies in China Cool Union.
In May 2013, he returned to China to join Huawei Terminal Architecture Design Department, participated in the planning and research and development of Heath’s domestic chip Kirin930/950/970/980, and landed as a mobile phone product. During the terminal period, participated in the development of Heath’s first generation of independent ISPs, successful commercial. Later led Huawei’s mobile phone sensor subsysystor research and development team to overcome various sensors under the small size of commercial technology difficulties and innovations.
In August 2017, he joined OPPO as chief chip planner, leading OPPO’s chip planning, and also served as chip platform manager for OPPO R15 mobile phones, leading the R15 product team to a successful launch.
After joining Alibaba in April 2018 and participating in the acquisition of Zhongtian micro, IoT Hardware Lab was established as the chief hardware architect, groping out the hardware innovation model in the software company, launching Alibaba Cloud’s first innovative gateway and forming Ali Eco-Play.
In September 2020, he joined the Intelligent Innovation Center of the United States, responsible for the direction of home service robots.
Personal areas of expertise include: mobile phones, tablets, wearable devices and robot direction of professional system design, integrated circuit design optimization and selection has rich experience and solid foundation, with sensors, indoor and outdoor positioning navigation and computer vision processing basic theory and system optimization program experience, in the Internet of Things smart home, smart buildings, smart park, smart agriculture, smart industry, smart city has accumulated a lot of experience.
At present, in addition to his own work, he is also a special expert lecturer of Shanghai Pudong Smart Lighting Federation, an industrial planning consultant of Zhejiang Huzhou Municipal Government Integrated Circuit Industrial Park, and a special consultant of Pangu Venture Fund.