About Us

Established in 2010, the International
Semiconductor Industry Group (I.S.I.G.) is a
prestigious and trusted association within the
semiconductor industry

renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.

Join us today!

Meet the Team

  • Salah Nasri

    CEO & Co-Founder

  • Kevin Dei

    Kevin Dei

    VP & Founding Partner

  • Jubed Miah photo

    Jubed Miah

    VP Programs & Director

  • Mia Chen

    VP & Taiwan GM

  • Ellen Wendelin-Loh photo

    Ellen Wendelin-Loh

    GM Southeast Asia

  • Michelle Yan photo

    Michelle Yan

    GM China

Honorary Board Members

  • Hamid Azimi, Ph.D.

    Chairman of the Board

  • Marvin Liao, Ph.D.

    Advisory Board Member

  • Markus Keil

    Board Member

Regional Presidents

  • Bernard Lim

    President of South East Asia

  • Eric Lee

    President of Taiwan

  • Joshua Yoo

    President of Korea

  • Markus Keil

    President of EU

  • Tadahiro Suhara

    President of Japan

  • Tong Wu, Ph.D.

    President of China

Meet the Advisory Board

  • Formfactor logo

    Aasutosh Dave

    Chief Commercial Officer

  • Formfactor logo
    Aasutosh Dave
    Chief Commercial Officer
  • Nexperia logo
    Achim Strass, Ph.D.
    Senior Director Technology Scouting and Cooperation
  • Akshay Singh Ph.D.
    VP, Advanced Packaging Technology Development
  • Alan Zhou, Ph.D.
    CEO, Shanghai
  • ROHM Semiconductor logo
    Aly Mashaly
    Technical Director
  • Amr Darwish
    Senior Director of Product Marketing & Market Development
  • AEM logo
    Amy Leong
    CEO
  • Ariel Meyuhas
    Founding Partner & COO
  • Vishay Intertechnology, Inc. logo
    Avinash Kashyap Ph.D.
    SVP & Division Head
  • Appscard Your Trusted Identity logo
    Bernard Lim
    Vice President Operations
  • Chang Fu photo
    Chang Fu
    Advanced Module R&D Dep., Deputy Director
  • Christine Dunbar
    Head of Strategic Business Development
  • Soitec logo
    Christophe Maleville, Ph.D.
    CTO and Senior EVP Innovation
  • CJ Hsieh photo
    ASPEED logo
    CJ Hsieh
    COO
  • SM24 logo
    Coralie Gallis Ph.D.
    Co-Founder & Chief Technology Officer
  • CS Tan
    VP GM
  • Curtis Zwenger photo
    Curtis Zwenger
  • Dariusz Czaja photo
    TRUMPF Huettinger Electronics (Taicang) Co., Ltd. logo
    Dariusz Czaja
    Managing Director of TRUMPF Huettinger Asia
  • Dato’ Bock Kim Lee photo
    Western Digital logo
    Dato’ KL Bock
    SVP Global Flash Backend Operations
  • David Lacey, Ph.D.
    R&D Director
  • AMD together we advance... logo
    Deepak Kulkarni
    Senior Fellow Advanced Packaging
  • Innoscience logo
    Denis Marcon, Ph.D.
    General Manager
  • Yole Intelligence logo
    Dimitrios Damianos Ph.D.
    Project Manager, Consulting Services Division
  • SAL - Silicon Austria Labs logo
    Dr. Christina Hirschl
    Chief Executive Officer
  • Dr. Hongchao Liu photo
    Anhui YOFC Advanced Semiconductor Co. Ltd logo
    Dr. Hongchao Liu 刘红超
    SVP/Chief Scientist
  • Dr. Mark Wang photo
    GMEMS Technologies logo
    Dr. Mark Wang
    CEO
  • Dr. Qingchun Zhang photo
    Fudan University logo
    Dr. Qingchun Zhang
    Professor
  • Dr. Xiaoning Qi photo
    Alibaba Damo Academy logo
    Dr. Xiaoning Qi
    VP
  • Dr. Xiaoxin Qiu photo
    Axera Technology Co., Ltd logo
    Dr. Xiaoxin Qiu
    CEO
  • SITRI logo
    Dr. Yemin Dong
    General Manager
  • Dr. Yongxiang Wen photo
    Hangzhou Silan Microelectronics Co., Ltd. logo
    Dr. Yongxiang Wen
    Process Technology Director
  • Zhijian Zhou photo
    Dr. Zhijian Zhou
    R&D Director
  • Scientech logo
    Eric Lee
    CEO
  • Geoffrey Stoddart photo
    Geoffrey Stoddart
    Senior Vice President Global Business Development
  • Gerhard Lammel, Ph.D.
    Director System Architecture
  • Cambridge GaN Devices logo
    Giorgia Longobardi, Ph.D.
    Founder and CEO
  • Ajinomoto logo
    Habib Hichri, Ph.D.
    EVP, Senior Fellow, Global Applications and Business Development
  • Haiying Duanmu
    Deputy Secretary General of MIA / Director of VAIA special committee
  • Hamid Azimi, Ph.D.
    Chairman of the Board
  • Henri Berthe
    Semiconductors Segment VP • Sales
  • Jason Zee photo
    Teradyne logo
    Jason Zee
    Global Vice President, General Manager of the Storage and System Level Test Group at Teradyne, China Managing Director
  • Jennifer Zhao photo
    Jennifer Zhao
    CEO Global Business, SIngapore
  • Jian Zhang photo
    Qualcomm logo
    Jian Zhang
    VP, Engineering
  • Jörg Amelung photo
    Fraunhofer IPMS logo
    Jörg Amelung
    Deputy Institute Director Division, Director Engineering, Manufacturing & Test
  • Jörg Doblaski photo
    X-FAB logo
    Jörg Doblaski
    CTO
  • Joseph Chou
    General Manager
  • Wolfspeed logo
    Joseph Roybal
    Senior Vice President of Global Backend Operations
  • Joshua Yoo
    President of Core Insight, President of ISES Korea
  • Infineon logo
    Julian Kornprobst
    MEMS Sensor System Competence Team Business Lead
  • June Shen photo
    Lotus Capital logo
    June Shen
    Managing Partner
  • JY Zhang photo
    MooreElite logo
    JY Zhang
    Chairman and CEO
  • TSMC logo
    Kam Lee
    Senior Director, Advanced Packaging Technology and Service
  • SK Hynix logo
    Kangwook Lee, Ph.D.
    SVP and Head of PKG Development
  • Infineon logo
    Kok Tiong Ng
    SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd
  • LW Yong photo
    Wolfspeed logo
    LW Yong
    Head of R&D, Power Modules in Asia
  • Bosch logo
    Markus Ulm
    SVP Business Unit Sensors, Mobility Electronics
  • Marnix Tack, Ph.D.
    CTO & VP Business Development
  • Martin Weigert photo
    Broadcom logo
    Martin Weigert
    VP & GM Industrial Fiber Products Division
  • Marvin Liao, Ph.D.
    Advisory Board Member
  • SoftMEMS logo
    Mary Ann Maher, Ph.D.
    CEO
  • Evatec logo
    Maurus Tschirky
    Senior Strategic Marketing Manager
  • Michael Siebert photo
    Michael Siebert
    Sales Manager
  • Lam Research logo
    Michelle Bourke
    Managing Director Specialty Technologies and Strategic Marketing
  • Onto Innovation logo
    Mike Rosa, Ph.D.
    CMO & SVP Strategy
  • Dr. Mohssen Moridi photo
    SAL - Silicon Austria Labs logo
    Mohssen Moridi, Ph.D.
    Senior Executive Director & Head of the Microsystems Research Division
  • Qualcomm logo
    Mustafa Badaroglu, Ph.D.
    Principal Engineer/Architect (& IRDS More Moore Global Chair)
  • Najwa Khazal
    Chief Operating Officer
  • Noorazidi Che Azib photo
    Inari Amertron Berhad logo
    Noorazidi Che Azib
    Deputy Vice President
  • Oreste Donzella
    Strategic Advisor, Board Member, Former C-Suite Executive
  • Renesas logo
    Primit Parikh, Ph.D.
    VP & GM, GAN Business Division
  • Zewen Liu photo
    Tsinghua University logo
    Prof. Dr. Zewen Liu
    Professor
  • Tsinghua University logo
    Prof. Shaojun Wei
    Professor
  • Prof. Tianchun Ye photo
    Institute of Microelectronics of the Chinese Academy of Sciences photo
    Prof. Tianchun Ye
    Researcher Professor
  • Hitachi Energy Ltd. logo
    Rainer Kaesmaier, Ph.D.
    Managing Director Semiconductors
  • Bosch logo
    Ralf Bornefeld
    SVP Business Unit Power Semiconductors & Modules
  • Evatec logo
    Ralph Zoberbier
    CMO
  • ITRI logo
    Ray Yang
    Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)
  • Riccardo Nicoloso, Ph.D.
    Key Programs for Global Key Accounts , Industrial and Automotive Customers inside the Power and Discrete Subgroup
  • Robert Ferguson photo
    Robert Ferguson
    President and CEO
  • Roland Rettenmeier
    CSO
  • Samuel Liu photo
    Skymizer logo
    Samuel Liu
    VP
  • Sandra Vos, Ph.D.
    Engineering Director, Pressure and Flow Industrial and Medical Sensors – TE Sensors
  • Santosh Kumar
    Vice President
  • Samsung Electronics logo
    Seung Wook Yoon, Ph.D, MBA
    Package Group, Product Technology, CVP / Head of Group System LSI
  • Sharon Ko Mei Wan
    Managing Director
  • Simon See, Ph.D.
    Senior Director, Nvidia AI Technology Centre And AI Nation
  • Simone Ferri
    Analog, Power, MEMS and Sensors Group Vice-President, MEMS sub-group General Manager
  • TSSC logo
    Tadahiro Suhara
    CEO
  • Tamara Baksht photo
    VisIC Technologies logo
    Tamara Baksht, Ph.D.
    CEO
  • Thomas Stenger
    Senior Vice President, Head of Business Line Functional Materials
  • Thy Tran
    Vice President of Global Front End Procurement
  • Dr. Tim Yeh photo
    Sanan Semiconductor logo
    Tim Yeh, Ph.D.
    Technical Director
  • Tomomitsu Maoka photo
    Resonac Corporation logo
    Tomomitsu Maoka
    Chief Strategy Officer
  • Applied Materials logo
    Vincent Dicaprio
    Vice President – Head of Business and Corporate Development and Technology Pathfinding, Advanced Packaging and ICAPS
  • X-FAB logo
    Volker Herbig
    VP BU Microsystems
  • Wee Seng Ang photo
    Singapore Semiconductor Industry Association (SSIA) logo
    Wee Seng Ang
    Executive Director
  • Wei Wang
    Director of BD
  • ITRI logo
    Wei-Chung Lo, Ph.D
    Deputy General Director, Electronic & Optoelectronic System Research Laboratories (EOSL)
  • Wilson Hong
    Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
  • Winfred Chen photo
    Midea logo
    Winfred Chen Ph.D.
    Chief Hardware Architect of AIoT, Home Service Robot, Intelligent Innovation Centre