Advanced packaging has experienced significant growth in recent years, fueled by the rising demand for high-performance computing, artificial intelligence, and autonomous driving. The semiconductor industry is increasingly embracing advanced packaging as a “more-than-Moore” solution to enhance system performance, which ultimately leads to improved device performance, greater bandwidth, reduced latency, and lower power consumption. This discussion will explore the outlook for the advanced packaging market and examine emerging technology trends, with a particular focus on the impact of generative AI and the demand for high-performance packaging solutions. Specifically, it will address the growing adoption of 2.5D and 3D packaging, as well as glass core substrates, as strategies to navigate the associated challenges and seize emerging opportunities.