27-28 August 2025
Suwon
11:30 – 11:55
Designing for Tomorrow : Evolving Challenges in Semiconductor Design
This talk explores the fundamental components of computing systems, the interconnects, compute engines, and memory, and their rapid evolution in enabling advanced applications and higher performance. Key trends discussed include increased interconnect bandwidth, with PCI Express reaching 256GB/s, and the doubling of transistor density every 1.5 to 3 years. While computational power grows exponentially, memory bandwidth lags, creating a bottleneck that necessitates new memory hierarchies and optimized data access. Addressing these gaps in transistor count, interconnect bandwidth, and memory performance is essential for future semiconductor breakthroughs.
J-Wing Teh
AMD
J-Wing Teh is a Director of Silicon & Systems Design Engineering at AMD, specializing in advanced semiconductor design. His role focuses on driving innovations in silicon design and system integration, with a strong emphasis on optimizing performance and efficiency in AMD’s products. With significant experience in IC design, J-Wing Teh is highly regarded in the semiconductor industry for his contributions to advancing technology in high-performance computing and graphics systems. He plays a key role in shaping AMD’s design strategies for future technologies.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.