10:05 – 10:25
From AI to Edge: Advanced Packaging Innovations and Challenges
As AI applications gradually expand from cloud-based data centers to edge computing, TSMC’s 3DFabric™ plays a pivotal role in driving continuous advancements in AI and edge technologies.
TSMC develops comprehensive technology solutions to support customer innovation, speed up product development cycles, and provide advanced 3DIC manufacturing capabilities.
As chip designs increase in density, size, and functionality, the challenges such as HBM integration, reliability, and thermal management arise. TSMC continuously improves technologies like CoWoS®, delivering greater flexibility, enhanced routability, and effective thermal solutions to address the needs of future high-power, high-integration systems.
Kathy Yan, Ph.D.
TSMC
Kathy Yan, currently Director of New Technology & System Integration, Advance Packaging and Test at TSMC. She is now in charge of new CoWoS-R organic interposer technology RD development for high speed HPC application, advanced packaging mechanical and thermal simulation & validation. She has been also managing new product co-development projects for system customers, across multiple packaging architecture including InFO POP, InFO-SOW, CoWoS-S and CoWoS-R. In addition She is the key player in TSMC 3D Fabric Alliance as the Memory Eco-system program owner. Prior to joining TSMC, she spend most of her career at Intel Advanced packaging RD and Medtronic technology Center in Arizona, US. She has a PhD in Electrical Engineering and Master in Material Science from Auburn University.
TSMC
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
