10:45 – 11:35
Moderator
Salah Nasri
International Semiconductor Industry Group (ISIG)
Salah Nasri is the CEO and Co-Founder of the International Semiconductor Industry Group (ISIG), a global organization founded in 2010 that connects and empowers semiconductor decision-makers through strategic leadership platforms, executive summits, and collaborative initiatives. ISIG has become a trusted global hub for industry leaders driving innovation and progress across the semiconductor value chain.
With extensive experience across the semiconductor sector, Salah has played a pivotal role in fostering global collaboration among industry leaders. Under his leadership, ISIG has evolved into one of the most influential communities in the semiconductor ecosystem—bringing together executives, innovators, and policymakers across regions including the United States, Europe, Asia, and the Middle East.
Salah has been instrumental in expanding ISIG’s reach and impact, curating high-level summits and initiatives that drive dialogue and progress across critical areas such as semiconductor manufacturing, AI, MEMS, automotive electronics, and advanced packaging. His vision continues to position ISIG as a key platform for thought leadership, networking, and strategic industry alignment.
Earlier in his career, Salah held positions at Credit Suisse, Goldman Sachs, Worldwide Business Research, and the International Business Development Group. He studied International Relations and Economics at Oxford University and Loughborough University, and in 2024 became a Stanford University alumnus after completing the Stanford Executive Program. In addition to his role at ISIG, Salah also serves on the Advisory Board of Atlant3D, a pioneer in atomic-layer advanced manufacturing solutions.
International Semiconductor Industry Group (ISIG)
Company Profile
Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.
Panelist
Babak Sabi, Ph.D.
AWS Annapurna Labs
Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.
AWS Annapurna Labs
Company Profile
Launched in 2006, Amazon Web Services (AWS) began exposing key infrastructure services to businesses in the form of web services — now widely known as cloud computing. The ultimate benefit of cloud computing, and AWS, is the ability to leverage a new business model and turn capital infrastructure expenses into variable costs. Businesses no longer need to plan and procure servers and other IT resources weeks or months in advance. Using AWS, businesses can take advantage of Amazon’s expertise and economies of scale to access resources when their business needs them, delivering results faster and at a lower cost.
Today, Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. With data center locations in the U.S., Europe, Singapore, and Japan, customers across all industries are taking advantage of our low cost, elastic, open and flexible, secure platform.
Panelist
Hamid Azimi, Ph.D.
Marvell Technology
Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.
Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.
A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.
Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.
Marvell Technology
Company Profile
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.
Panelist
Jerry Tzou
TSMC
Jerry Tzou recently retired from TSMC, where he wrapped up as Director of Advanced Packaging Business Development. He spearheaded the strategic growth of TSMC’s 3DFabric® platform— CoWoS®, InFO, TSMC-SoIC®, TSMC-SoW™, and COUPE™ for Co-Packaged Optics (CPO) —tying it to TSMC’s advanced silicon innovations. This work fueled next-generation applications in AI-driven high-performance computing, mobile, automotive, and IoT. Through synergistic collaboration with customers and partners inside and out, he drove significant revenue growth in advanced packaging.
Jerry’s 40-year semiconductor career included diverse roles at TSMC, a stint as VP of Product Operations at Global Unichip Corporation (GUC), a TSMC-affiliated design foundry, and advanced packaging work at Apple, National Semiconductor, Cirrus Logic, and select Silicon Valley startups. With a Master’s in Materials Science and Engineering from UC Berkeley, his expertise spans semiconductor packaging, operations, and business development.
TSMC
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
Panelist
Marvin Liao, Ph.D.
International Semiconductor Industry Group (ISIG)
Education :
- Ph.D., Materials Science, University of Texas, USA, 1989
- Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979
Experience :
- TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
- TSMC, Special Project, 2009 ~ 2010
- TSMC, Fab 6 Director, 2003 ~ 2009
- Chartered Semiconductor, 1997 ~ 2002 (Singapore)
- Applied Materials, 1994 ~ 1997 (USA)
- SGS Thomson Microelectronics, 1990 ~1994 (USA)
International Semiconductor Industry Group (ISIG)
Company Profile
Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.
Panelist
Mostafa Aghazadeh
Chiplink Consulting LLC
Mostafa Aghazadeh is a seasoned industry leader and the President of Chiplink Consulting LLC, where he advises companies on advanced packaging technology and manufacturing.Previously, he spent 40 years at Intel, holding various leadership roles in Assembly & Test Technology Development. As a Corporate Vice President, he led Intel’s assembly process, materials, and equipment technology development.He currently serves on the technical advisory boards of BESI, Brewer Science, and IMEC and previously chaired the INEMI Board of Directors. He was also a member of Arizona State University’s New Economy Initiative and the School of Manufacturing Systems and Networks Industry Advisory Board.
Chiplink Consulting LLC
Company Profile
Provide consulting services in the areas of microelectronics advanced packaging technology, manufacturing, and supply chain including process, equipment, and materials.
Company Products & Services
Consulting Services
