Nokibul Islam, Ph.D.
Biography
Dr. Nokibul Islam is the Sr. Director of STATS ChipPAC Business Unit, where he leads product business development and advanced technology promotion. With over 21 years of experience in semiconductor product management, business development, and advanced packaging, he previously played a key role in Amkor Technology’s R&D team, focusing on product development, simulation, characterization, and process improvement. He is actively involved in leading industry conferences such as IMAPS, ECTC, InterPack, and Chiplet Summit and has contributed extensively to international publications.
Company Profile
STATS ChipPAC
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.