Jerry Tzou
Biography
Jerry Tzou recently retired from TSMC, where he wrapped up as Director of Advanced Packaging Business Development. He spearheaded the strategic growth of TSMC’s 3DFabric® platform— CoWoS®, InFO, TSMC-SoIC®, TSMC-SoW™, and COUPE™ for Co-Packaged Optics (CPO) —tying it to TSMC’s advanced silicon innovations. This work fueled next-generation applications in AI-driven high-performance computing, mobile, automotive, and IoT. Through synergistic collaboration with customers and partners inside and out, he drove significant revenue growth in advanced packaging.
Jerry’s 40-year semiconductor career included diverse roles at TSMC, a stint as VP of Product Operations at Global Unichip Corporation (GUC), a TSMC-affiliated design foundry, and advanced packaging work at Apple, National Semiconductor, Cirrus Logic, and select Silicon Valley startups. With a Master’s in Materials Science and Engineering from UC Berkeley, his expertise spans semiconductor packaging, operations, and business development.
Company Profile
TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.