09:15 – 09:40
Keynote: Powering the Age of AI – A Specialty Foundries Perspective on Artificial Intelligence
Artificial Intelligence is reshaping the semiconductor landscape—not only as a transformative force within fabs but also as a driver of global computing innovation.
Internally, AI is revolutionizing fab operations: enabling intelligent automation, driving yield enhancement, reducing waste and accelerating R&D.
Externally, the impact of semiconductor technologies on AI is even more profound. While leading-edge nodes play the key role in scaling AI performance, More-than-Moore technologies are essential for enabling low-power, high-efficiency computing at the edge, for connecting embodied AI with the real world, and ultimately for creating a path towards sustainable datacenter growth. This keynote will spotlight the critical contribution of More-than-Moore process technologies in powering the Age of AI, from lowest-power in-memory computing at the very edge to sustainable large-scale computing at the cloud.
Jörg Doblaski
X-FAB
As the Chief Technology Officer of the X-FAB foundry group, Jörg Doblaski is responsible for the development of X-FABs modular CMOS, SOI and WBG processes, targeting automotive, industrial and medical applications. Beside the development of the process technologies, this also includes design kit development, design enablement and customer support as well as prototyping. Jörg joined X-FAB in 2004 and served in different engineering- and engineering management positions before he became the group CTO in 2020. He holds a diploma degree in Electrical Engineering and Information Technology from Technical University of Ilmenau, Germany.
X-FAB
Company Profile
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
