Holger H. Kuehnlein’s scientific career began in 1999 at the Technical University of Dresden, a key institution within the Silicon Saxony high-tech cluster. His early industrial experience at KSW MicroTec GmbH involved Electrochemical Deposition (ECD) for flip-chip bumps and packaging. His university research until 2004 focused on enhancing mass transfer and metal deposition in microstructures using pulse plating and magnetic fields.

His PhD. at ATOTECH Germany GmbH Berlin, on electrodeposited Cu2ZnSn for CZTS compound semiconductors, led him to RENA Technologies in 2007. He was instrumental in RENA’s success story in PV, driving advancements in wet chemical cleaning, etching, and plating for PERC, TOPCON, and IBC cell technologies. Since 2015, as head of Technology & Innovation at RENA, he’s significantly contributed to the SEMI industry. While specializing in wet chemical processes, he diversified RENA into mobile device glass components, semiconductor wafering, and plating. His development efforts since then have also encompassed new wet chemical processes for Lithium-ion batteries.

His current work is particularly focused on wet chemical Through-Glass Via (TGV) etching and metallization of Glass Core Panel Substrates for advanced packaging in high-performance computing and AI applications, involving close collaboration with key players in glass, material and packaging industries. His team also leverages electrochemical methods for polishing, porosification, and deposition for critical materials like Silicon Carbide (SiC) and Silicon (Si) in areas like epitaxial-wafering, with recent investigations extending to Gallium Nitride (GaN) and Gallium Oxide (GaO) for next generation power applications.