13:50 – 14:10
Advanced Power Packaging for AI Power solution: UTAC’s Thermally Enhanced QFN and 3D Module Solutions for Optimized Efficiency and Integration
Reserved
Michael Choi
UTAC Group
Hyungmook Choi is a seasoned semiconductor expert with over 30 years of experience in the power semiconductor industry. He holds B.S. and M.S. degrees in Electrical Engineering from Seoul National University. Starting at Samsung Semiconductor, he advanced through leadership roles at VISHAY SILICONIX and UTAC, where he pioneered QFN copper clip technology and expanded into WBG markets. Under his guidance, UTAC shipped over 3 billion QFNs with copper clips by 2024. Mr. Choi is a respected keynote speaker and is currently focused on AI power QFN and SiP development to meet future industry needs
UTAC Group
Company Profile
UTAC Group is a leading outsourced semiconductor assembly and test (OSAT) provider, founded in 1997 and headquartered in Singapore. The company specializes in advanced assembly and test services for logic, memory, analog/mixed-signal, image sensors, MEMS, and power devices. UTAC supports a global customer base that includes fabless companies, integrated device manufacturers (IDMs), and wafer foundries.
With ten manufacturing facilities across Singapore, Thailand, China, and Indonesia, and a robust global sales network spanning North America, Europe, Greater China, Japan, and Southeast Asia, UTAC delivers comprehensive turnkey solutions—from wafer probing to final testing.
UTAC serves diverse market segments including automotive, computing, communications, consumer electronics, and industrial applications. Renowned for its reliability, technological expertise, and customer-centric approach, UTAC continues to play a vital role in enabling next-generation semiconductor innovation.
Company Products & Services
UTAC Group provides a comprehensive range of semiconductor assembly and test services, delivering turnkey solutions from wafer probe to final test across key end markets.
Its packaging portfolio includes leadframe-based packages such as QFN, DFN, QFP, TLA, and Cu-clip variants, as well as laminate-based BGA/iBGA packages for mobile, computing, and automotive applications. UTAC also offers System-in-Package (SiP) modules that integrate multiple components into compact, high-density solutions for IoT, wearables, and automotive electronics.
Advanced wafer-level offerings include bumping services and Wafer-Level Chip Scale Packaging (WLCSP) for customers requiring miniaturization, high electrical performance, and low-profile form factors.
UTAC also supports image sensor packaging, including automotive-grade iBGA with cleanroom assembly to meet stringent reliability and contamination standards.
To complement mass production, UTAC provides value-added services such as package design support, reliability qualification, and failure analysis—helping customers accelerate time to market with confidence.
