27-28 August 2025
Suwon
13:45 – 13:55
A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology
Rozalia Beica
Rozalia is a distinguished leader in the Semiconductor and Advanced Packaging industry, with an impressive career of over 30 years. Her expertise encompasses a unique mix of broad cross-industry expertise, including electronic materials, substrates, equipment, device & system manufacturing, and market intelligence. Rozalia has held several executive roles across various functions, in technology development, strategic planning, business development, sales, marketing and operations and has been instrumental in the growth and success of industry powerhouses such as Rohm and Haas, Dow, DuPont, Semitool, Applied Materials, Lam Research, Maxim Integrated Products, Yole Developpement, and AT&S. Recently, Rozalia took on the role of Chief Commercial Officer at LQDX, where she is leading the company’s strategic direction and growth.
An active participant in industry activities, Rozalia led numerous symposiums globally, consortia activities, technical working groups and industry roadmaps activities. Rozalia served on the board of IEEE EPS, IMAPS and 3DinCites and currently she is a Member of the Advisory Board at IMPACT and Terecircuits.
Rozalia’s academic achievements include a M.Sc. in Chemical Engineering from Polytechnic University Timisoara, a M.Sc. in Management of Technology from KWU, and a Global Executive MBA from Instituto de Empresa University, in partnership with Brown University, Fudan University, and Insper University.