16:50 – 17:00
Accelerating the AI Era
The AI era has arrived and to accelerate it, the AP industry and supply chain needs to innovate at a torrid pace to stay in tandem with the exponential growth of the Gen AI and AI ASIC computing trajectory. As a first mover in AP, ASMPT has been investing in the last 10 years to lead in end-to-end solutions for chiplets heterogeneous integration of the most advanced chip architecture in CoWoS and HBM. The AP industry is undergoing a “Power of N” transformation where fine interconnect pitch shall shrink rapidly along with thinner and bigger packaging formats, demanding breakthrough technologies in materials, process and equipment. This signals a need for a robust supply chain and ecosystem to continuously re-invent advanced packaging technologies to enable AI scaling.
Choon Khoon Lim
ASMPT Semiconductor Solutions
LIM Choon Khoon (CK) is a Senior Vice President and Chief Executive Officer of Semiconductor Solutions Advanced Packaging (AP).
CK’s career spans key engineering, manufacturing, and regional functional and global general management roles with several global semiconductor companies. As Chief Executive Officer of the Segment’s AP Business Group, he helps provide the industry’s leading first-level interconnect technologies covering leading AP First Level Interconnect (FLI) technologies for logic, HBM, Si Photonics & Co-Packaged Optics, wafer die singulation solution for advanced fabricated wafers and Panel ECD for fine Line/Space organic and glass substrate & Wafer PVD, that are well-positioned to serve and to scale with the most demanding AP needs.
CK holds a Bachelor of Science (Honours) in Production Engineering and Production Management degree from the University of Nottingham, United Kingdom
ASMPT Semiconductor Solutions
Company Profile
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
