16:20 – 16:30
AP 2.5D & 3D FLI with True Residue-Free Fluxless TCB
As FLI pitch scaling advances toward the single-micron range, traditional flux-based Thermocompression Bonding (TCB) faces challenges in oxide removal and residue elimination, impacting underfill quality and long-term reliability. To address these limitations, TCB equipment manufacturers are developing fluxless Thermal Compression Bonding technology with key customers to enable further pitch scaling.
Two possible fluxless TCB technologies—formic acid vapor and atmospheric plasma—are being integrated into TC Bonding equipment to remove native metal oxide grown onto the bonding interface. While both methods achieve similar oxide removal performance, only plasma Active Oxide Reduction (AOR) is entirely residue-free.
This presentation will compare these fluxless TCB technologies and highlight the advantages of plasma AOR in achieving superior metal oxide reduction for high-reliability TCB processes.
Greg Clemons
ASMPT Limited
Greg Clemons is a seasoned professional with over 27 years in the semiconductor industry. He currently serves as the Senior Business Development Manager at ASMPT SEMI Solutions in the USA, driving business growth and innovation in advanced packaging. His expertise spans silicon wafer fabrication, advanced packaging, and semiconductor equipment. Greg has held key roles throughout his career, starting as a wet etch process engineer at Intel corporation and progressing from wafer fabrication to facilities construction to advanced packaging R&D where he delivered the 1st HVM TCB process for Intel products. He holds seven advanced packaging patents and continues to innovate in fluxless processing development, and has co-authored many technical papers, including a recent publication in enabling HBM 16H stacks with ASMPT Fluxless AOR technology. Greg holds a Bachelor of Science in Mechanical Engineering and a Master of Science in Materials Engineering from the University of Dayton, Ohio while working at the WPAFB Materials Directorate Labs. His leadership and innovation continue to drive advancements in the semiconductor industry.
Company Profile
ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
