Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York , U.S.A.

In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore.

He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package.

Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has over 83 patents in US.

IEEE Electronics Packaging Society Board of Governors (BoG) member from 2025

IEEE Electronics Packaging Society Taipei Chapter Executive Committee from 2025