Stefan Pieper has studied chemistry in Berlin, Germany where he also completed his PH.D. in analytical chemistry. In 2009 he joined Atotech as Application Scientist in the department of Semiconductor Advanced Packaging processes where he used the opportunity to gain deep insight in multiple electrochemical metallization processes and their characterization for semiconductor application. During his work as Application Scientist, he also spent over 3 years in the US where he optimized Cu dual damascene electrodeposition and Through Silicon Via plating. In 2020 he took over the position of Global Application Manager for Electroless deposition processes in semiconductor application at Atotech. In his current position he is leading a team that provides wet-chemical solutions for semiconductor metallization with the focus on power semiconductor.

Stefan Pieper博士曾在德国柏林学习化学，并在那里获得分析化学博士学位。2009年，他加入安美特，担任半导体先进封装工艺部应用科学家。利用这个机会，他深入了解了多种电化学金属化工艺及其在半导体应用中的特性。在担任应用科学家期间，他还在美国花了3年多的时间，优化了双大马士革铜互连工艺和硅通孔电镀工艺。2020年，他接任安美特半导体化学镀工艺全球应用经理一职。在目前的职位上，他领导的团队为半导体金属化提供湿制程解决方案，重点是功率半导体。