14:10 – 14:20
Enabling next-gen AI with ASMPT’s Total Interconnect Solutions
ASMPT Semiconductor Solutions stands at the forefront of the AI revolution, delivering comprehensive advanced packaging technologies essential for next-generation artificial intelligence applications. As AI workloads demand exponential increases in interconnect density and performance, ASMPT Semiconductor Solutions’ total interconnect solutions portfolio addresses critical challenges across CoWoS, HBM, and heterogeneous integration. Our pioneering thermo-compression bonding (TCB) technologies, including the industry-first fluxless AOR™ process, enable the precise sub-micron connections required for AI logic processors and high-bandwidth memory integration. With proven capabilities spanning first-level interconnect solutions for HPC and data center applications such as silicon photonics, co-packaged optics, logic, CoWoS and HBM packaging, ASMPT Semiconductor Solutions empowers the Intelligence Revolution, supporting applications from cloud computing to edge AI deployment across automotive, industrial, and telecommunications sectors.
Choon Khoon Lim
ASMPT Semiconductor Solutions
LIM Choon Khoon (CK) is a Senior Vice President and Chief Executive Officer of Semiconductor Solutions Advanced Packaging (AP).
CK’s career spans key engineering, manufacturing, and regional functional and global general management roles with several global semiconductor companies. As Chief Executive Officer of the Segment’s AP Business Group, he helps provide the industry’s leading first-level interconnect technologies covering leading AP First Level Interconnect (FLI) technologies for logic, HBM, Si Photonics & Co-Packaged Optics, wafer die singulation solution for advanced fabricated wafers and Panel ECD for fine Line/Space organic and glass substrate & Wafer PVD, that are well-positioned to serve and to scale with the most demanding AP needs.
CK holds a Bachelor of Science (Honours) in Production Engineering and Production Management degree from the University of Nottingham, United Kingdom
ASMPT Semiconductor Solutions
Company Profile
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
