16:35 – 16:45
Enabling the Advanced Packaging industry with HVM solutions for next generation glass core substrates
Glass offers unique properties and opportunities for advanced packaging. Research institutes and the advanced packaging industry have been working for years to integrate glass into next-generation IC substrates. Applications such as glass cores with ABF buildup on both sides, glass interposers with RDL, and other innovative glass-based solutions are continuously evolving.
Leveraging its expertise in PCP and IC substrates, along with a strong track record in turnkey solutions for photovoltaic fabs, SCHMID has developed advanced equipment and processes for TGV formation, glass core metallization, Embedded Trace Technology, and more. These innovations provide the industry with effective solutions for integrating glass into future IC substrates.
Roland Rettenmeier
SCHMID Group
Roland Rettenmeier is a seasoned Sales and Business Development expert in Advanced Packaging with 25+ years of experience across PCB, IC substrates, Wafer-Level, and Panel-Level packaging.
After qualifying as a Mechanical Engineer in 1997, he started his career at AT&S AG, where he worked in various departments. In 2005, he completed his MBA in Vienna and continued expanding his expertise through programs like Six Sigma (AT&S, Nokia) and executive education at Stanford University.
Over his 25-year career, Roland built a solid track record in leading high-performance teams and delivering consistent revenue growth in the Advanced Packaging Industry.
In March 2025, Roland joined SCHMID Group as CSO and works with the global sales organization on current and future opportunities.
Roland also plays a key role in the industry as Committee Member and Session Chair of the SEMI Advanced Packaging Conference in Europe and Advisory Board Member of the International Semiconductor Industry Group.
With his deep industry knowledge and global network, Roland remains at the forefront of semiconductor packaging innovation.
Company Profile
The SCHMID Group is a world-leading global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, with its parent company Gebr. SCHMID GmbH is based in Freudenstadt, Germany. Founded in 1864, today it employs more than 800 staff members worldwide, and has technology centers and manufacturing sites in multiple locations including Germany and China, in addition to several sales and service locations globally. The Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables, and energy storage. Our system and process solutions for the manufacture of substrates, printed circuit boards and other electrical components ensure highest level of technology, high yields with low production costs, high efficiency, quality, and sustainability in green production processes. www.schmid-group.com
