19:00 – 21:00
Gala Dinner and Award Ceremony
Gala Dinner Sponsored by:
Welcome Dinner Speaker
Simon Liu, Ph.D.
Camtek
Experience
- GM Taiwan, Camtek, 2013 – Present
- Director Taiwan, ASML, 2011 – 2013
- Director Taiwan, Air Liquide, 2009 – 2011
- Sr. AM SEA, Nanometrics Inc., 1998 – 2009
- Director & Associate Professor, Yuanpei Scientific University, 1996 – 1998
Education
National Tsing Hua University
Ph.D., Physics, Nuclear Science 1988 – 1991
As taking on the role of General Manager of Camtek Ltd.’s Taiwan branch since 2013, leading to gain a clear understanding of the company’s existing business model and the challenges it faced, laying the foundation for a comprehensive growth strategy.
The growth strategy began delivering measurable results in 2015, when the company achieved its highest global annual sales in its sector. Since then, it has maintained an impressive 30% year-over-year growth and received numerous industry accolades.
This management philosophy has led to remarkable outcomes. The Taiwan branch has consistently achieved strong annual performance, rapidly expanded its market share, and emerged as a market leader in Taiwan’s advanced semiconductor back-end packaging, testing, inspection, and metrology sector.
Camtek
Company Profile
Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry.
With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art inspection and metrology solutions in line with customers’ requirements.
Company Products & Services
Camtek has three product lines: Eagle and Hawk for inspection and 3D metrology and MicroProf for metrology.
Camtek’s inspection solutions provide comprehensive coverage for semiconductor manufacturing, supporting front-side inspection at sub-micron defect levels, as well as backside and edge inspection. Camtek’s 3D metrology solutions deliver precise measurements for micro-bump coplanarity and height, handling up to 500 million bumps per wafer. Our advanced metrology capabilities also cover critical parameters such as RDL CD/Overlay, TSV, topography, TTV, warp/bow, and layer thickness, ensuring comprehensive process control and high-quality manufacturing.
