10:40 – 11:00
High Bandwidth Memory (HBM) and Advanced Packaging in AI
As the requirement of processing data in Artificial Intelligence (AI) grows exponentially, a large capacity and high bandwidth in memory technology plays a pivotal role in the integrated AI system performances. High bandwidth memories (HBMs) has been great solutions since 2017 when HBM2 was implemented in nVIDIA P100/V100. Currently, 6th generation HBM, HBM4 is in development.The continued scaling of HBM to increase memory capacity and bandwidth and additionally to enhance thermal performance has been great challenges and required the evolutions of 3D stacking technologies. In this presentation, HBM stacking technology innovations and roadmap will be presented. HBM stacking challenges associated with next generation advanced packaging technologies will be discussed.
Jaesik Lee Ph.D.
SK Hynix
Dr. Jaesik Lee is Vice President of Package Engineering at SK hynix America. In this role, Jaesik is responsible for the research and development of advanced packaging for next generation High Bandwidth Memory (HBM) and pathfinding initiatives which enrich SK hynix’s innovations. He also focuses on the collaborations with customers to overcome HBM challenges associated with System in Packages (SIPs).
Prior to joining SK hynix America, Jaesik has held various key technical positions through Meta, Google, Nvidia, and Qualcomm where he drove advanced packaging technology developments, Packaging and System Co-optimization, and Manufacturing in Mobile, AI, and HPC applications. He received a PhD in mechanical engineering from University of Waterloo.
Company Profile
An AI First Mover Leading the Global AI Memory Era
With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees.
Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in pursuit of more social value and a healthier governance structure.
SK hynix will grow into a Full Stack AI Memory Provider, offering customized solutions tailored to the diverse needs of global customers, covering both DRAM and NAND flash, in the era of full-scale AI.
