13:05 – 13:30

IC Technology Platform for Efficient Customization of Automotive Chips

The three major trends of automotive intelligence, electrification, and networking are driving rapid changes in the automotive electronics industry, increasing the demand for high-performance, low-power, and integrated chip solutions. Traditional chip design models are struggling to meet the rapidly evolving market needs. To design specialized chips for different vehicle models and functions, chip design companies often need to tailor appropriate chip solutions to the specific requirements of automotive manufacturers, ensuring optimal balance of functionality, performance, and power consumption. JoinSilicon IC technology platform offers full-process services, significantly shortening the chip development cycle. Chiplet technology achieves a balance of performance, cost, and time through modular design and integration, further optimizing the cost structure for efficient modular production. The JoinSilicon IC platform combines advanced IC technology with rich design experience, encompassing ASIC customization, 2.5D/3D IC design packaging, and Chiplet technology. It provides customers with comprehensive customization services from demand analysis and architecture design to chip mass production. This not only strengthens the hardware foundation for automotive electronics but also assists customers in achieving outstanding product delivery.

Ser Wah Oh

General Manager

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