16:20 – 16:40

imec SiPh technologies for scaling AI Systems

In this presentation, we highlight the imec business models and technology roadmaps that we bring forward to enable the AI era to continue benefiting from scaling. We will outline the imec vision for deeply integrating optical interconnects into the package, interposer, and wafer level, leveraging scaled Silicon Photonics and 3D technologies to implement high-density sub-pJ/bit optical transceivers. We will share some recent results from our ongoing research and development efforts on advanced optical devices, packaging and assembly.

Maarten Willems

Vice President of Global Business Development

imec