11:35 – 11:55
Innovations Driving HBM Roadmap
The presentation delves into the advancements and innovations driving High Bandwidth Memory (HBM) roadmap.
It highlights the exponential growth of AI models and the increasing complexity requiring more memory for training.
It discusses the importance of AI in revolutionizing various aspects of human life and the role of Micron’s memory and storage solutions in accelerating AI.
Boon Ong
Micron Technology, Inc.
Boon-Pin Ong (Boon) leads the Advanced Packaging Technology Development (APTD) in Micron Taiwan, focusing on enablement of advanced packaging technology roadmaps for memory and storage solutions.
Prior to his current role, Boon headed Micron’s DRAM Technology Development in Taiwan responsible for delivery of the industry’s first samples of 1γ (1-gamma), sixth-generation (10nm-class) DRAM node-based DDR5 memory.
Boon has been with the company for 20 years and served in Micron’s global semiconductor manufacturing and technology development sites in Singapore, the United States, Japan, and Taiwan.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
