11:35 – 12:15
Panel Discussion: Advanced Packaging
Moderator
Kinya Ichikawa
3DIC Research Lab LLC
3DIC Research Lab LLC
Company Profile
3DIC Research Lab LLC is a specialized consulting firm dedicated to advancing semiconductor packaging technologies with a focus on 3D integration. Founded by experts with decades of experience in wafer-level packaging, TSV, hybrid bonding, and advanced substrate technologies, the company provides deep technical insights and strategic guidance to semiconductor manufacturers, material suppliers, and equipment vendors. 3DIC Research Lab operates as a bridge between cutting-edge academic research and industrial applications, helping partners accelerate innovation, reduce risks, and optimize manufacturing processes. With strong expertise in areas such as HBM integration, fan-out packaging, and chiplet-based architectures, the company supports its clients in addressing key challenges in power, performance, thermal management, and reliability. By combining technical consulting with market perspectives, 3DIC Research Lab contributes to the realization of next-generation semiconductor solutions for AI, HPC, and consumer electronics.
Company Products & Services
3DIC Research Lab LLC offers a comprehensive range of consulting services tailored to the semiconductor packaging ecosystem. Its core services include technology evaluation, material selection support, process integration strategies, and roadmap development for advanced packaging solutions. The company provides in-depth technical analysis on critical areas such as wafer thinning, TSV formation, RDL scaling, underfill materials, and thermal interface solutions. Additionally, 3DIC Research Lab delivers customized training programs, workshops, and technical seminars to support knowledge transfer and skill development within client organizations. By leveraging a strong global network and hands-on expertise, the firm helps clients benchmark emerging technologies, assess competitive landscapes, and establish collaborations across the supply chain. Whether guiding material suppliers to meet stringent reliability requirements or advising device makers on cost-performance trade-offs, 3DIC Research Lab ensures that its partners are equipped to navigate the complexities of heterogeneous integration and advanced packaging.
Panelist
Monita Pau, Ph.D.
Onto Innovation
Monita Pau is currently Strategic Marketing Director for Advanced Packaging at Onto Innovation. She works with business leaders and executives to drive strategic planning and leads the development of collaborative initiatives to drive growth and innovation. With over 15 years of experience, her expertise spans across frontend and backend of line process control solutions as well as specialty materials for advanced packaging and assembly. Prior to joining Onto, she held various positions in applications engineering, marketing and strategic business development at DuPont and KLA. Monita holds a Ph.D. degree in Chemistry from Stanford University.
Onto Innovation
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panelists reserved for:
Intel Corporation
AMD
SHINKO