09:20 – 09:40
Revisiting the Necessity and Challenges of Glass Substrates in 3DIC Advanced Packaging
In 3DIC and HPC packaging, achieving both high-precision assembly and reliability demands a careful balance of material properties. Glass offers low CTE, high flatness, and low dielectric loss, yet faces trade-offs such as TGV reliability and stress management. This study argues that, without clearly defining the necessity of glass, application development lacks momentum. By analyzing these inherent contradictions, we discuss how to interpret and manage the trade-offs between material properties and system reliability, providing insights toward the future direction of glass utilization in advanced packaging.
Kinya Ichikawa
3DIC Research Lab LLC
Kinya Ichikawa retired from TSMC Japan 3DIC R&D Center Inc. as Technical Director in September 2024 and subsequently founded 3DIC Research Lab LLC, providing technical consulting for Japan’s semiconductor packaging ecosystem. At TSMC, he led the establishment of the Tsukuba R&D Center, aligned R&D with Taiwan headquarters, and managed NEDO project planning and execution. Before joining TSMC, he directed a joint development project at Nichia Corporation with European partners on next-generation high-definition micro-LED headlamps, which entered mass production in 2024. Earlier, he spent 24 years at Intel, pioneering FCBGA (OLGA) and EMIB technologies.
3DIC Research Lab LLC
Company Profile
3DIC Research Lab LLC is a specialized consulting firm dedicated to advancing semiconductor packaging technologies with a focus on 3D integration. Founded by experts with decades of experience in wafer-level packaging, TSV, hybrid bonding, and advanced substrate technologies, the company provides deep technical insights and strategic guidance to semiconductor manufacturers, material suppliers, and equipment vendors. 3DIC Research Lab operates as a bridge between cutting-edge academic research and industrial applications, helping partners accelerate innovation, reduce risks, and optimize manufacturing processes. With strong expertise in areas such as HBM integration, fan-out packaging, and chiplet-based architectures, the company supports its clients in addressing key challenges in power, performance, thermal management, and reliability. By combining technical consulting with market perspectives, 3DIC Research Lab contributes to the realization of next-generation semiconductor solutions for AI, HPC, and consumer electronics.
Company Products & Services
3DIC Research Lab LLC offers a comprehensive range of consulting services tailored to the semiconductor packaging ecosystem. Its core services include technology evaluation, material selection support, process integration strategies, and roadmap development for advanced packaging solutions. The company provides in-depth technical analysis on critical areas such as wafer thinning, TSV formation, RDL scaling, underfill materials, and thermal interface solutions. Additionally, 3DIC Research Lab delivers customized training programs, workshops, and technical seminars to support knowledge transfer and skill development within client organizations. By leveraging a strong global network and hands-on expertise, the firm helps clients benchmark emerging technologies, assess competitive landscapes, and establish collaborations across the supply chain. Whether guiding material suppliers to meet stringent reliability requirements or advising device makers on cost-performance trade-offs, 3DIC Research Lab ensures that its partners are equipped to navigate the complexities of heterogeneous integration and advanced packaging.
