Roger St. Amand
Amkor Technology, Inc.
Roger has more than 30 years of experience in the semiconductor industry and became part of Amkor in 2003. During his tenure at Amkor, he has taken on various leadership positions, and he currently oversees the Chiplet /FCBGA/fcCSP business unit, along with its associated packaging technologies. Prior to joining Amkor, Roger worked at Digital Equipment Corporation and Microchip Technology. He earned a Bachelor of Science in Electrical Engineering from the University of Massachusetts and a Master of Science in Materials Science from Stanford University. Additionally, Roger is an inventor on more than 70 patents related to semiconductor processing, packaging, and applications.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
