10:50 – 11:00
Tailoring through glass via (TGV) dimensions for glass-core panel substrates
Glass-core substrates are redefining advanced packaging by overcoming warpage and thermal management limits of organic materials. Central to this technology are through-glass vias (TGVs), whose precision and density define performance. We present an innovative alkaline etching technology combined with laser modification, enabling unprecedented control of via geometry with taper angles below 1°. Compared to conventional acidic etching, our process delivers higher selectivity, at advanced throughput, and compatibility with industrial considered glass types. This breakthrough enables the scalable production of ultra-high-density TGV substrates—paving the way for next-generation packaging demands.
Holger H. Kuehnlein, P.h.D.
RENA Technologies
Holger H. Kuehnlein began his career in 1999 at the Technical University of Dresden, within Silicon Saxony, gaining early industrial experience in ECD for packaging. His PhD work on Cu2ZnSn for CZTS semiconductors at ATOTECH led him to RENA Technologies in 2007, where he propelled PV success in PERC, TOPCON, and IBC cell technologies. Since 2015, as Head of Technology & Innovation at RENA, he has significantly contributed to the SEMI industry, diversifying into mobile device glass components, semiconductor wafering, plating, and Lithium-ion batteries. Currently, he focuses on wet chemical Through-Glass Via (TGV) etching and metallization of Glass Core Panel Substrates for advanced packaging in HPC/AI, collaborating with key industry players. His team also innovates electrochemical methods for SiC, Si (epitaxial-wafering), GaN, and GaO in next-gen power applications.
RENA Technologies
Company Profile
Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.
Company Products & Services
RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.
