• 09:45 – 09:55

SiC wafer dicing with multi-beam laser: optimal process quality and minimized cost

Traditional blade sawing of power wafers (Si, SiC, GaN on different substrates) has issues: side wall cracks, passivation chipping, wafer crack, metal pealing, smearing of backside metallization along die side. Furthermore, it is characterized by high
consumable cost (blade wear, water consumption). With the clear demand for performance improvement there is a trend towards thinner wafers, thicker back side metallization and a switch towards different materials: SiC and GaN. Consequently,
the issues from traditional blade sawing for power wafers becoming even more prominent. A traditional solution applied to overcome these problems is reducing blade saw speed. This is not future proof as it leads to significantly higher equipment
and fab space cost. ASMPT ALSI has developed multi – beam laser dicing of power wafers which outperforms traditional blade sawing and cost of ownership. Several examples will be shown in the presentation.

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Kees-Jan Leliveld photo

Kees-Jan Leliveld

Managing Director of ASMPT ALSI and Vice President ASMPT Semiconductor Solutions

ASMPT Limited

Kees-Jan Leliveld is Managing Director of ASMPT ALSI and Vice President ASMPT Semiconductor Solutions. He is leading the global ASMPT ALSI team in the development and supply of wafer separation solutions for semiconductor industry using laser dicing and laser grooving technology. Focus growth areas are power: thin Si, SiC, GaN, Advanced Packaging and Memory.

Before joining ASMPT ALSI in 2011 he held technical management roles at Bosch Rexroth and Philips Healthcare. He holds a Master’s degree and Ph.D. in Applied Physics from the Technical University of Delft.

ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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